Engineer 2 - Software Development

Build smarter, more resilient 48V power systems with energy-aware digital power monitoring from Microchip. New 65V digital power monitors help designers track accumulated energy data to improve system response in applications that also depend on higher levels of measurement headroom and spike protection. CHANDLER, Ariz., Sept. 24, 2026 (GLOBE NEWSWIRE) - As automotive, AI/data center, networking and industrial systems quickly migrate toward 48V power architectures to improve efficiency and support higher power demands, designers need more than visibility into instantaneous voltage and current conditions. They need systems that understand energy use over time and can respond intelligently to changing power conditions. Microchip Technology (Nasdaq: MCHP) today announced the PAC1761 and PAC1861 families of 65V energy-aware digital power monitors that combine accumulated power-measurement insights with the necessary high-voltage measurement headroom and transient spike protection capabilities to help make 48V power architectures more efficient and resilient. The move to 48V power architectures demands that digital power monitors have an additional operational margin of up-to-65V measurement and 75V of spike protection to ensure transient survivability. The PAC1761 and PAC1861 devices add to these capabilities the intelligence to understand and react in real time to energy usage dynamics based on accumulated power measurement data. "The industry conversation is shifting from measuring power at a single point in time to understanding and responding to energy behavior across an entire system and its lifecycle," said Keith Pazul, vice president of Microchip's mixed-signal linear business unit. "The PAC1761 and PAC1861 families are designed to help customers build better performing and more reliable 48V systems that can measure instantaneous conditions and understand energy consumption and availability over time. These scalable, low-power solutions reduce monitoring overhead and include pin-compatible package options that improve source flexibility while reducing design risk." Microchip's digital power monitoring devices feature programmable alerts for voltage, current and power excursions, step-limit detection to identify sudden load changes, and configurable accumulated-energy thresholds that enable proactive system management based on both instantaneous and long-term power behavior. Target applications include automotive, AI/data center, networking, industrial, server, telecom/Power over Ethernet (PoE) and 48V power distribution systems. The 12-bit PAC1761 and 16-bit PAC1861 options are available in VDFN-8 (similar to SOT23-8), VDFN-10 and MSOP-10 packages including automotive-orderable variants. Pin-compatible options can reduce redesign risk, shorten qualification cycles and give customers flexibility to move between devices as requirements, availability, cost or performance change. Development Tools Development support includes evaluation board EV12R33A, a Python Command Line Interface (CLI) with library, Linux(R) driver and generic C library with multiple MCU code examples. Pricing and Availability Products in the PAC1761 and PAC1861 families are available now starting at $0.56 each in 10,000-unit quantities for the PAC1761T-3E/E3 and PAC1861T-1E/3P, both in the MSOP-10 package. The price of the evaluation board EV12R33A is $49.00. You can purchase directly from Microchip or contact a Microchip sales representative or authorized worldwide distributor. High-res images available through Flickr or editorial contact (feel free to publish): About Microchip Technology: Microchip Technology Inc. is a broadline supplier of semiconductors committed to making innovative design easier through total system solutions that address critical challenges at the intersection of emerging technologies and durable end markets. Its easy-to-use development tools and comprehensive product portfolio supports customers throughout the design process, from concept to completion. Headquartered in Chandler, Arizona, Microchip offers outstanding technical support and delivers solutions across the industrial, automotive, consumer, aerospace and defense, communications and computing markets. For more information, visit the Microchip website at www.microchip.com. Note: The Microchip name and logo and the Microchip logo are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. All other trademarks mentioned herein are the property of their respective companies.

SEMICON India 2026: 25 MoUs strengthen India's Semiconductor ecosystem. Reading Time: 3 mins read Summarize with: New Delhi, September 19 (APAC Media): SEMICON India 2026, being held from September 17 to 19 at Yashobhoomi in New Delhi, has emerged as a major platform for partnerships aimed at strengthening India's semiconductor ecosystem. The event has brought together private companies, research institutions, government departments, and skilling organisations, with 25 MoUs and major announcements spanning semiconductor manufacturing, materials, packaging, logistics, design, and workforce development. Tata Electronics drives semiconductor supply chain localisation. Tata Electronics announced several partnerships focused on building a localised supply chain for semiconductor manufacturing. The company signed collaborations with INOX Air Products Limited for high-purity gases and with Sumitomo Chemical Corporation Ltd. for high-purity chemicals. It also partnered with Kelington Engineering Pte Ltd for gas distribution systems, high-purity piping, and process tool hookup for its semiconductor fab in Dholera, Gujarat. An agreement with Enomoto Co. Ltd will focus on advanced semiconductor packaging capabilities and localisation of lead frame manufacturing in India. Focus on materials and power electronics. The event also highlighted efforts to develop critical materials and power electronics capabilities domestically. C-MET and Hindalco Industries Ltd. announced a collaboration for the indigenous development of critical semiconductor materials. An announcement was also made on indigenous Silicon Carbide power modules for Voltage Source Converter-based high-voltage direct current (HVDC) power transmission systems, linking semiconductor capabilities with the country's renewable energy and power infrastructure needs. L&T Semiconductor Technologies expands partnerships. L&T Semiconductor Technologies announced partnerships with Virtual Forest Pvt Ltd., Newen Systems Pvt. Ltd., Fimer India Pvt. Ltd. and Capital Power Systems Ltd. The collaborations cover Silicon Carbide power modules for next-generation renewable energy systems, IGBT development, and IoT modules for smart meters, expanding the application of semiconductor technologies across energy and connected infrastructure. Investment, logistics, and packaging get push. The India Deep Tech Alliance (IDTA) announced an investment of $236 million across 56 deep tech companies. SEMI and IDTA also announced the establishment of the India Semiconductor Academy. Meanwhile, the India Semiconductor Mission and NIPPON Express Group signed an MoU focused on semiconductor logistics infrastructure in India. India market analysis In packaging and manufacturing, Kaynes Semicon partnered with IndieSemiC, Microchip Technology and United BC Team for package qualification, assembly and testing, eMeter SoC packaging and manufacturing, and intralogistics and lights-off automation. Skilling and semiconductor education take Centre stage. Workforce development featured prominently at SEMICON India 2026. Lam Research and the Electronics Sector Skills Council of India announced a skilling collaboration, while NIELIT entered into partnerships with Siemens EDA, Tata Electronics, Singapore Polytechnic International, IESA, and SEMI University. These initiatives cover semiconductor design education, ATMP training, skill development, capacity building, and workforce education. NIELIT also launched the SCL 0.8 Micron open-source PDK on its eChipHub platform. Designing and research. A research collaboration between C-DAC and Silvaco Inc. will provide access to EDA tools, TCAD, and IPs through the ChipIN Centre. Together, the announcements highlight efforts to build capabilities across the semiconductor ecosystem and strengthen India's transition towards a more integrated domestic semiconductor industry. Summarize with:

Winners and honorees announced for 2026 EDGE Awards. The 2026 EDGE Awards honor the latest innovations in fluid power, design tools, communications & networking and more. Sept. 18, 2026 After weeks of voting, it's time announce the winners and honorees for the 2026 EDGE Awards which celebrates innovation within design and engineering. Power & Motion readers - along with those of EndeavorB2B brands Automation World, Control, Control Design, Electronic Design, Machine Design, and Microwaves & RF - helped select this year's winners and honorees in 10 categories. In addition, Microchip Technology Inc.'s Micro Switchtec Gen 6 PCIe Switches have been named the leading EDGE Winner which recognizes the innovation with the most votes. Below are winners and honorees by category; winners receive a physical award honoring their achievement in the 2026 EDGE Awards. Congrats to all of this year's nominees and winners! Communications & networks. This category of products includes wireless and wired systems, modules, and software that facilitate communication between chips, modules, and systems, including I/O modules, cloud communications. Leading EDGE Winner: Cabling & enclosures. Hardware meant to hold controls and electronics as well as monitor the temperature, pressure, humidity, etc. inside the enclosure, such as terminal blocks and cabinet coolers were among the products considered in this category. Computing Hardware, software and systems. Eligible entries for this category included edge computing devices and interfaces, as well as associated compute, storage, design, and analysis systems. Design tools & software. EDA, CAD, CAM, CAE, Digital Twin, modeling and simulation software as well as application tools and operating systems to assist the design engineer. This category also includes IDEs, compilers and middleware. Electronic components. Passive electronic components like capacitors, transistors or diodes, connectors, cables, antennas, and switches were among the product types under consideration in this category. Industrial controllers. Technologies considered in this category include PLCs (programmable logic controllers), PACs (programmable automation controllers) and IPCs (industrial PC). Machine vision and optical components & systems. This category includes adaptive optics, optical materials, coatings, precision optics, micro-optics, lenses, mirrors, aspheres, prisms, and freeform optics. This category also considers lighting products for machine vision applications, cameras, sensors, lenses, filters, lighting, frame grabbers, software, and systems. Motion control components. Eligible product submissions included pneumatic, hydraulic, and electric motion control components and systems, including actuators, cylinders, ball screws, motors and drives, and accessories such as fasteners, bearings, gears, belts, and chains, as well as fluids, filters, and compressed air systems. Production tools and systems. This category includes creation of chips, printed circuit boards, components and systems as well as all mechanical and machine tool operations, welding, soldering, and adhesives focused on metal or component joining as well as materials used to fasten and secure components. Test, measurement, sensors and software. Products in this category are test and measurement equipment and sensors that measure things including electrical, photons, speed, temperature, vibration, positioning, dimensional accuracy, defect detection and other operational parameters, as well as the software needed to effectively analyze the sensor data.