Integrated Photonics Design Engineer - Device Components
About the job
- Either 5+ years of relevant work experience or equivalent experience through an advanced degree (M.S. or Ph.D.) in Electrical Engineering, Physics, or a related field.
- Strong expertise with passive and/or active photonic device component design, including hands-on development of multiple successful designs.
- Strong expertise in finite element analysis of photonic integrated circuit components using tools such as Lumerical, Tidy3D, COMSOL, Synopsys OptoDesigner, and similar tools.
- Extensive hands-on experience performing measurements to characterize photonic integrated circuits using instruments such as swept lasers, fiber alignment stages, vector network analyzers, bit error rate testers, and oscilloscopes.
- Extensive experience with data analysis and statistical methods such as design of experiments using tools such as JMP or Python.
- A demonstrated record of innovation and achievement, such as product designs, publications, or patents.
- Familiarity with the entire photonic integrated circuit engineering process, including simulation, layout, fabrication, test, and device operation.
- Authorization to work in the United States is required.
- Collaborate with product teams and customers to define requirements for device components.
- Own the end-to-end design and delivery of high-performance, robust device components such as fiber couplers, optical taps, optical crossings, thermo-optic phase shifters, photodiodes, and high-speed electro-optic modulators.
- Simulate component designs using finite element analysis tools such as Lumerical, Tidy3D, HFSS, CST, and COMSOL.
- Develop and perform rigorous measurement techniques to assess component performance.
- Analyze measurement and simulation data for performance and robustness.
- Collaborate to improve fabrication processes for optimal device performance.
- Serve as a technical expert within the company to guide engineering decisions and the technical roadmap.
About the company
HyperLight designs and manufactures photonic integrated circuits (PICs) on a thin film lithium niobate on insulator (TFLN) platform for data centers and telecommunications networks. Its PICs include electro-optic modulators and related devices that deliver low drive voltage, low insertion loss, high optical power handling, and bandwidths above 110 GHz, built for customization and high-volume production. By focusing on tailoring PICs to specific applications and scaling manufacturing, HyperLight differentiates itself from competitors. The goal is to enable faster, more reliable communications in future data and telecom networks through efficient, scalable photonic solutions.
Company Size
51-200
Company Stage
Series C
Total Funding
$117M
Headquarters
Cambridge, Massachusetts
Founded
2018
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Simplify's Take
What believers are saying
- June 2026 Series C raised $80 million for capacity and qualification.
- HyperLight's 1.6T-DR8 demo hit 20W, about 20% below alternatives.
- Revelio tracked 105 employees and 29 2026 job postings, signaling aggressive expansion.
What critics are saying
- MediaTek, UMC, Jabil, and Foxconn now gain deep visibility into HyperLight's roadmap.
- Customer qualification still gates revenue; any sampling miss delays 2026 AI deployments.
- Thin-film lithium niobate faces Chinese cost pressure from Liobate and AFR.
What makes HyperLight unique
- HyperLight's March 2026 UMC-Wavetek partnership gives 6-inch and 8-inch TFLN foundry scale.
- Its 400G-per-lane PICs and 1.6T-DR8 demo target AI interconnects directly.
- Over 150 patents and CMOS-level drive voltage strengthen its manufacturing moat.
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Benefits
- Health Insurance
- Vision Insurance
- Dental Insurance
- 401(k) Company Match
- Paid Parental Leave
- Life Insurance
- Disability Insurance
- Commuter Benefits
- Professional Development Budget
- Mentorship Program