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Kandou AI

Provides chip-to-chip AI connectivity solutions

Analog Layout Engineer Lead

Silicon & ASIC DesignConfirmed live in the last 24 hours
Full-timeNo salary listedHybrid

About the Job

Requirements

  • 10–15 years of relevant experience.
  • Experience in custom analog layout of circuits and blocks for multi-gigabit serial data-link transceivers or high-frequency/radio-frequency circuits.
  • Expertise in layout of high-speed/frequency circuits, including amplifiers, oscillators, phase-locked loops, delay-locked loops, biasing, buffers, regulators, filters, data converters, and other fundamental building blocks.
  • Understanding of layout approaches and techniques for high-speed circuits, matching constraints, parasitic minimization, power grids, and electrostatic discharge requirements.
  • Experience with modern semiconductor process technologies, including 28 nm, 14/16 nm, and 7 nm.
  • Experience using electronic design automation tools for design and verification, such as Cadence Virtuoso, Spectre/HSpice, Calibre/PVS design-rule and layout-versus-schematic verification, parasitics extraction and modeling, electromagnetic analysis, IR drop, and electrostatic discharge.
  • Background in semiconductor physics.
  • Graduate in Electrical Engineering.

Responsibilities

  • Perform custom layout and verification of analog circuits, cells, blocks, and IP for multigigabit high-speed chip-to-chip communication links, including SerDes up to and beyond 28 Gb/s and/or memory I/O, in advanced semiconductor technology nodes.
  • Lay out and verify very high-speed analog circuits.
  • Interact closely with the design team to understand requirements and implement solutions.
  • Support IP and chip-level integration.
  • Support and interact with customers regarding requirements and IP delivery.
  • Manage workload and schedules and report to the internal management team.

Desired Qualifications

  • Exposure to flip-chip package technologies.

About the Company

Kandou AI

Provides chip-to-chip AI connectivity solutions

Kandou AI designs and sells semiconductor connectivity hardware for AI workloads. It provides a memory fabric and CXL controllers that link processors to memory, enabling scalable, energy-efficient AI inference and training clusters built from affordable hardware. Using Copper MIMO interconnect, it reduces energy per bit and supports features like offloading AI training collectives, switchless memory for in-memory databases, and field-repairable co-packaged optics for better cooling. By targeting the data-movement bottleneck between processors and memory and offering chiplet-based fabrics and IP licensing, Kandou AI aims to make scalable AI infrastructure more accessible to hyperscalers, data centers, and system integrators.

Company size
201-500
Company stage
Late Stage VC
Total funding
$504.7M
Headquarters
Lausanne, Switzerland
Founded
2011

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