onsemi

Semiconductors for intelligent power and sensing

Manufacturing Integration Engineer

Process EngineeringConfirmed live in the last 24 hours

Full-timeWappingers Falls, NY, USA$127.8k - $217.2k /yrIn-person

About the Job

Requirements

Master’s or Bachelor's degree in Electrical Engineering, Materials Science, Physics, or a related field.
Proven experience in semiconductor manufacturing, specifically with discrete power FETs (trench MOSFETs, superjunction, or related structures).
Experience with post wafer fab operations such as Back-Grind/Back Metallization, Packaging, Dicing and Singulation, module construction.
Experience with wafer level testing, ILT/WAT/PCM and Probe. Familiarity with package level Final Testing especially for discrete power devices
Experience taking technologies from development stage, through optimization and qualification and into volume ramp.
Strong understanding of semiconductor physics, device reliability, and fabrication processes, including experience in 300mm fabrication.
Demonstrated ability to translate high‑level objectives into actionable engineering plans and drive projects independently.
Strong data‑driven problem-solving skills using DOE, statistical analysis, SPC, 6‑sigma, and FMEA methodologies.
Track record of leading or significantly contributing to technology development projects with measurable impact on performance, reliability, yield, or cost.
Excellent communication skills with the ability to present complex technical topics clearly to both engineering and executive audiences.
Ability to manage multiple projects simultaneously in a fast‑paced development environment

Responsibilities

Lead technology transfer and manufacturability for onsemi’s advanced nodes of discrete power FETs, owning device architecture from concept definition through qualification and high‑volume manufacturing.
Monitor electrical performance and device performance, collaborating with design, process integration, and modeling teams to optimize Rds(on), switching performance, ruggedness, and power density.
Partner with process module owners in the fab to optimize process windows, ensure device robustness, and resolve integration challenges.
Perform device characterization, electrical testing, and failure analysis, ensuring compliance with specifications and customer requirements.
Drive structured root‑cause analysis (DOE, 6‑sigma, SPC, FMEA) for yield, reliability, or device‑related issues, and implement sustainable corrective actions.
Collaborate with systems engineering, product engineering, packaging, and applications teams to integrate power FETs into system‑level solutions and end‑customer applications.
Monitor industry trends and emerging device concepts in power MOSFET, superjunction, and wide‑bandgap (SiC/GaN) technologies.
Generate invention disclosures, patents, and technical reports to strengthen onsemi’s IP portfolio and documentation standards.
Provide technical guidance, coaching, and mentorship to junior engineers; matrix‑manage engineers across multiple organizations.
Present technical content in executive‑level reviews and represent the team in cross‑functional and customer‑facing discussions.

onsemi is seeking a Manufacturing Integration Engineer in our EFK Hopewell Junction site. We are a leading innovator in semiconductor technology, dedicated to advancing power electronics through cutting‑edge research and development. We are seeking a talented and motivated Senior principal engineer to join our team and drive Technology transfers and Manufacturability of next‑generation discrete power FET technologies. This role offers high technical ownership, cross‑functional visibility, and the opportunity to directly shape onsemi’s future power device roadmap.

Qualifications

Master’s or Bachelor's degree in Electrical Engineering, Materials Science, Physics, or a related field.

Proven experience in semiconductor manufacturing, specifically with discrete power FETs (trench MOSFETs, superjunction, or related structures).

Experience with post wafer fab operations such as Back-Grind/Back Metallization, Packaging, Dicing and Singulation, module construction.

Experience with wafer level testing, ILT/WAT/PCM and Probe.  Familiarity with package level Final Testing especially for discrete power devices

Experience taking technologies from development stage, through optimization and qualification and into volume ramp.

Strong understanding of semiconductor physics, device reliability, and fabrication processes, including experience in 300mm fabrication.

Demonstrated ability to translate high‑level objectives into actionable engineering plans and drive projects independently.

Strong data‑driven problem‑solving skills using DOE, statistical analysis, SPC, 6‑sigma, and FMEA methodologies.

Track record of leading or significantly contributing to technology development projects with measurable impact on performance, reliability, yield, or cost.

Excellent communication skills with the ability to present complex technical topics clearly to both engineering and executive audiences.

Ability to manage multiple projects simultaneously in a fast‑paced development environment

Salary: onsemi is excited to share the base salary range for this position is $127,800 to $217,200, exclusive of fringe benefits or potential bonuses. The final pay rate for the successful candidate will depend on geographic location, skills, education, experience, and/or consideration of internal equity of our current team members. We also offer a competitive benefits package. https://www.onsemi.com/site/pdf/Benefits-Summary-USA.pdf

Responsibilities

Lead technology transfer and manufacturability for onsemi’s advanced nodes of discrete power FETs, owning device architecture from concept definition through qualification and high‑volume manufacturing.

Monitor electrical performance and device performance, collaborating with design, process integration, and modeling teams to optimize Rds(on), switching performance, ruggedness, and power density.

Partner with process module owners in the fab to optimize process windows, ensure device robustness, and resolve integration challenges.

Perform device characterization, electrical testing, and failure analysis, ensuring compliance with specifications and customer requirements.

Drive structured root‑cause analysis (DOE, 6‑sigma, SPC, FMEA) for yield, reliability, or device‑related issues, and implement sustainable corrective actions.

Collaborate with systems engineering, product engineering, packaging, and applications teams to integrate power FETs into system‑level solutions and end‑customer applications.

Monitor industry trends and emerging device concepts in power MOSFET, superjunction, and wide‑bandgap (SiC/GaN) technologies.

Generate invention disclosures, patents, and technical reports to strengthen onsemi’s IP portfolio and documentation standards.

Provide technical guidance, coaching, and mentorship to junior engineers; matrix‑manage engineers across multiple organizations.

Present technical content in executive‑level reviews and represent the team in cross‑functional and customer‑facing discussions.

About the Company

onsemi

Semiconductors for intelligent power and sensing

onsemi designs and manufactures semiconductors with a focus on intelligent power and sensing technologies for automotive and industrial markets. Its products include power management ICs and sensors that regulate energy, monitor conditions, and provide control signals for EVs, ADAS, factory automation, robotics, and energy infrastructure. The company differentiates itself by its specialized emphasis on intelligent power and sensing across both sectors and through its direct OEM relationships and global distributor network. Its goal is to improve energy efficiency and enable smarter, more capable systems for electrification, autonomy, and sustainable energy solutions.

Company size: 10,001+
Company stage: IPO
Headquarters: Scottsdale, AZ
Founded: 1999

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