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Applied Materials

Builds equipment for chip and display factories

Principal Program Manager - New Product Transition

Full-TimeUpdated on 10/23/2026
$116k - $159.5k+ Bonus + Stock award
Senior, Expert
Bachelor's, MBA
Austin, TX, USA
In PersonOnsite in Austin, Texas; travel required 10% of the time.
Project & Program ManagementProgram Management
Company Historically Provides H1B Sponsorship

About the job

Requirements
  • A bachelor's degree in any engineering discipline is required; mechanical or electrical engineering is preferred, along with an MBA.
  • At least 6–8 years of experience in project management, program management, and data analysis.
  • Effective written and verbal communication skills for conveying program and project status to diverse functional groups and stakeholders.
  • Ability to work positively in a team environment with individuals involved in program management, manage priorities under pressure, and meet tight deadlines.
  • Strong leadership and management skills, including the ability to lead functional teams or projects with moderate resource requirements, risk, or complexity.
  • Interpersonal skills to communicate difficult concepts and negotiate with others to adopt a different point of view.
  • Analytical, problem-solving, and synthesizing skills, including finding innovative ways to resolve problems and leading others to solve complex problems.
  • Ability to interpret internal and external business challenges and recommend best practices to improve products, processes, or services.
  • Depth or breadth of expertise in a specialized discipline or field.
  • Proficiency with Microsoft PowerPoint to communicate effectively with cross-functional program teams.
  • Knowledge of project and program management methodologies and techniques.
  • Knowledge of manufacturing operations in the product life cycle and engineering change management.
  • Proficiency with Microsoft Project to develop project plans and schedules.
  • Expertise in data gathering, analysis, and reporting using charts and Microsoft Excel.
  • Knowledge of budgeting and resource allocation procedures for financial planning and tracking.
Responsibilities
  • Lead a matrixed operational team comprising New Product Manufacturing Engineers, Material Project Managers, DFX Engineers, Manufacturing Engineers, Supplier Engineering, Procurement, and Manufacturing Program Managers to manage program deliverables from Manufacturing Operations.
  • Engage Pilot Manufacturing to ensure early learning builds meet target milestones.
  • Resolve operational business-process issues between the Business Unit, Pilot Operations, and Volume Production.
  • Align with the cross-functional Product Management Team to develop and execute the product commercialization strategy.
  • Engage the Engineering team to analyze designs and identify product improvements that enhance volume manufacturability.
  • Manage divisional risk exposure through analysis of production maturity.
  • Interface with Business Operations of the Business Unit to execute operational strategy.
  • Initiate and lead Operations strategies to improve business processes.
  • Drive Product Life Cycle Operations deliverables for Business Unit New Product Introduction programs.
  • Prepare and present high-level program-status and strategic-overview presentations to senior management.
  • Assist top management with reports, follow up with direct reports, and gather required data and information.
  • Organize meetings, prepare agendas and minutes of meetings, and follow up action items through closure.
  • Plan and define scope, activity planning and sequencing, and resource planning.
  • Develop schedules, time and cost estimates, budgets, and documentation.
  • Analyze risks, manage risks and issues, and regularly monitor and report progress.
  • Manage cross-project interdependencies to resolve conflicting priorities and plan resources.
  • Understand the program's broader objectives and define benefits that realize its strategic objectives.
Desired Qualifications
  • Exposure to the semiconductor industry.
  • Working knowledge of SAP.
  • Experience developing Excel macros.
  • PMP or Scrum certification.
  • Experience working with relational databases, including Microsoft SQL Server.
  • Exposure to data analytics tools such as Minitab.

About the company

Applied Materials designs and builds precision machines that chipmakers and display manufacturers use to form, shape and inspect thin layers of material. Its platforms handle steps such as depositing films and removing unwanted material, helping chipmakers create transistors and wiring at atomic scale. Customers include makers of logic chips and memory, as well as manufacturers of advanced displays. The company earns money from equipment sales, replacement parts and services, and factory software that schedules production and monitors manufacturing processes. Applied Materials was founded in 1967 and is headquartered in Santa Clara, California.

Company Size

10,001+

Company Stage

IPO

Headquarters

Santa Clara, California

Founded

1967

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Simplify Jobs

Simplify's Take

What believers are saying

  • Installed equipment brings repeat business: Applied Global Services sells long-term service agreements, replacement parts and equipment upgrades.
  • Sales are expanding: Applied's August 2026 report showed fiscal Q3 revenue of $9.12 billion, up 25% yearly.
  • Employees join profitable operations: Applied reported $3.08 billion of operating profit for fiscal Q3 in August 2026.

What critics are saying

  • Singapore manufacturing hires face late shifts: Applied's live engineering posting specifies 4 p.m. to 1:30 a.m. schedules.
  • Export compliance has real costs: Applied and its Korea subsidiary settled a $252 million penalty in February 2026.
  • Sales depend on China access: Applied's December 2025 filing attributed 30% of fiscal 2025 revenue to customers there.

What makes Applied Materials unique

  • Applied combines manufacturing steps under vacuum: its Endura copper platform integrates seven processes to protect delicate material interfaces.
  • Factory software reaches beyond chips: Applied SmartFactory serves battery and pharmaceutical manufacturers alongside semiconductor plants.
  • Research targets future chip generations: Applied's EPIC partners work on technology three to four generations ahead of production.

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Benefits

  • Health Insurance
  • Dental Insurance
  • Vision Insurance
  • Life Insurance
  • Disability Insurance
  • Relocation Assistance
  • Performance Bonus
  • Stock Options
  • Flexible Work Hours

Growth & Insights and Company News

6 month growth

0%

1 year growth

-1%

2 year growth

-1%
Yahoo Finance
Oct 24th, 2026
Applied Materials stock falls 24% since October 12 after investor day offers no spending forecast

Applied Materials shares have fallen 24% since October 12, from $497.53 to $377.24 at Friday's close. The drop followed an October 13 investor presentation in which the company set ambitious profit targets but gave no forecast for wafer fab equipment (WFE) spending. By 2030, Applied Materials targets a non-GAAP gross margin of about 54% and an operating margin of 40%. Chief executive officer Gary Dickerson declined to give a WFE forecast but expressed "tremendous confidence" in computing demand. The stock fell 6.7% on October 13, more than rivals Lam Research, KLA, and ASML, which lost roughly 2.6% to 3.5%. It trades at about 21.4x forward earnings, down from nearly 49x in late June. The company reports fiscal fourth-quarter earnings on November 12. Analysts expect revenue of about $10.30 billion and adjusted earnings of $4.06 per share. China accounts for about 30% of fiscal 2025 revenue.

Chief in Tech
Oct 16th, 2026
China's chip sector accelerates amid U.S. Export controls, redefining global tech dynamics.

China's chip sector accelerates amid U.S. Export controls, redefining global tech dynamics. 10/16/2026 Your morning in 30 seconds. * China's semiconductor industry surges ahead, fueled by U.S. export controls (Fortune). * Applied Materials and Intel announce a new partnership to accelerate AI-focused chipmaking (DQIndia). * ASML's hybrid bonder patent signals the next wave of advanced chip packaging (DigiTimes). * U.S. chipmakers' overseas production dependence exceeds 95%, SIA reveals (DigiTimes). * Asia startup funding tops $353M this week, led by Tessolve in semiconductors (Techloy). The lead. China's chip sector advances amid export controls. * China's domestic semiconductor sector is making rapid breakthroughs, with export controls from the U.S. acting as a catalyst for increased innovation and self-sufficiency (Fortune). * Recent advancements include new chip manufacturing capabilities and increased market share for Chinese suppliers. * The sector's progress is shifting the geopolitical balance in global technology supply chains. * U.S. restrictions, intended to slow China's progress, have instead accelerated domestic R&D and investment in Chinese chip firms. * The development raises questions about future supply chain resilience and the potential need for supplier diversification. * Source: Fortune * Why it matters: Executives must reassess supply chain strategies and risk exposure as geopolitical forces drive rapid realignment in global chip manufacturing. What changed. Applied Materials and Intel partner on AI chipmaking. * Applied Materials and Intel have formed a strategic collaboration to develop next-generation semiconductor fabrication processes tailored for AI workloads (DQIndia). * The partnership will focus on overcoming scaling challenges and boosting chip performance for advanced computing. * This move is designed to maintain a competitive edge in the race for AI hardware innovation. * Source: DQIndia * Implication: Tech leaders should watch for new fabrication technologies that could influence AI infrastructure roadmaps. ASML's hybrid bonder patent drives packaging innovation. * ASML has patented a hybrid bonder, a key enabler for advanced chip packaging as traditional scaling approaches hit physical limits (DigiTimes). * The technology is expected to improve efficiency and performance in semiconductor manufacturing. * This move reflects growing industry focus on packaging as a differentiator for next-gen chips. * Source: DigiTimes * Implication: Executives should evaluate how packaging advances may alter chip design, procurement, and partnerships. SIA finds U.S. Chipmakers rely heavily on overseas production. * The Semiconductor Industry Association (SIA) reports that U.S. chipmakers source 95% of their manufacturing equipment and materials from foreign suppliers (DigiTimes). * The finding contradicts previous assumptions about domestic self-sufficiency. * Heightened geopolitical risks highlight the need for robust supply chain strategies. * Source: DigiTimes * Implication: Supply chain diversification and contingency planning should be board-level priorities. Asia startup funding surges, led by Tessolve. * Asia's tech startups raised $353.73 million in the past week, with major investments in semiconductors, robotics, and electric mobility (Techloy). * Tessolve, a semiconductor firm, tops the funding list, reinforcing the region's growing influence in deep tech. * The funding landscape signals opportunities for new partnerships and expansion in Asia. * Source: Techloy * Implication: Executives exploring global growth should prioritize engagement with Asia's dynamic startup ecosystem. Cybersecurity job postings hit four-year low. * Cybersecurity job postings have dropped to the lowest level since 2022, according to Help Net Security. * Compliance roles are increasingly sought after, while CISO hiring remains volatile. * The trend suggests an industry-wide reevaluation of cybersecurity needs and workforce planning. * Source: Help Net Security * Implication: Rethink talent acquisition and upskilling strategies to align with evolving security priorities. Signals. * Iberdrola, BBVA, and Santander complete a €150M syndicated loan entirely on blockchain, advancing financial transparency (The Paypers). * Flipkart alumni advocate for ESOP buyouts, spotlighting ongoing debates over employee equity (Economic Times). * BTQ partners with MoonPay Korea to bolster stablecoin security, reinforcing the importance of digital asset protection (The Paypers). * Mastercard and BVNK launch a global money platform integrating fiat and stablecoin payments, aiming for real-time, cross-border efficiency (The Paypers). Chief in Tech Perspective: This week's deeptech surge is a call to action for women leaders in technology: proactive board engagement on supply chain, innovation, and cybersecurity is critical as global dynamics shift. Championing diverse leadership at the intersection of semiconductors, AI, and fintech will be essential for navigating risk and seizing new opportunities.

TechNode Global
Oct 15th, 2026
Applied Materials unveils $5B semiconductor R&D center in Silicon Valley.

Applied Materials unveils $5B semiconductor R&D center in Silicon Valley. Applied Materials has unveiled an Equipment and Process Innovation and Commercialization Center in Silicon Valley, a US$5 billion investment intended to support semiconductor equipment and process research. The company described the EPIC Center as a 600,000-square-foot facility bringing chipmakers, equipment manufacturers and university researchers together to accelerate the development of new semiconductor technologies. Applied Materials identified TSMC, Intel, Samsung, Micron and SK hynix among founding partners. Other companies cited in the announcement include Broadcom, Advantest, SCREEN, KIOXIA and Besi. The project is aimed at reducing the time between research breakthroughs and high-volume chip manufacturing, as growing AI demand raises performance and efficiency requirements. Its anticipated benefits are company expectations, not independently verified development outcomes. The facility is in the United States, but several announced participants are headquartered in Asia, giving the project a direct connection to the region's semiconductor industry.

Tech in Asia
Oct 15th, 2026
Applied Materials opens $5B AI chip research hub with TSMC, Intel, Samsung, Micron and SK hynix

Applied Materials has unveiled an AI chip research hub that brings together chipmakers, equipment suppliers, and university researchers to develop chipmaking technologies for AI. The centre spans 600,000 square feet and includes nearly four acres of cleanroom space for semiconductor process technology and equipment research. Founding partners are TSMC, Intel, Samsung, Micron, and SK hynix. Research partners include Arizona State University, Stanford University, the University of California, Berkeley, the UCLA Samueli School of Engineering, and Rensselaer Polytechnic Institute. Applied Materials expects capital spending to reach about $5 billion over time as customer projects begin.

DIGITIMES
Oct 15th, 2026
Applied Materials targets US$5 billion advanced packaging revenue.

Applied Materials targets US$5 billion advanced packaging revenue. , San Francisco Oct 15, 2026, 10:23 0 Credit: DIGITIMES Applied Materials sees advanced packaging as a key growth lever as AI chips move to multi-die designs, with the company projecting more than US$5 billion in related revenue in the coming years... Picks for you