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Applied Materials

Builds equipment for chip and display factories

Director Pathfinding Solutions - Integrated Materials Solutions

Full-Time
$176k - $242k+ Bonus + Stock award
Expert
PhD
Albany, NY, USA
In Person
Manufacturing & Process EngineeringProcess Engineering
Company Historically Provides H1B Sponsorship

About the job

Requirements
  • A Ph.D. in Electrical Engineering, Materials Science, Chemical Engineering, Physics, or a related semiconductor discipline.
  • 10+ years of experience in semiconductor process development, integration, or device engineering, with deep expertise in FEOL, MOL, or BEOL process technologies.
  • A demonstrated hands-on track record of developing integrated process solutions for advanced logic and/or memory nodes.
  • A strong publication record at top-tier semiconductor conferences (IEDM, VLSI, IRPS) and/or a significant patent portfolio.
  • Experience engaging directly with customer technical teams at major semiconductor manufacturers, including IDMs, foundries, or memory makers.
  • Deep understanding of device physics, process-structure-property relationships, and DTCO principles.
  • Ability to work effectively across organizational boundaries, coordinating with multiple BUs, product teams, and customer organizations.
  • Experience collaborating with or working at a semiconductor equipment or materials company with exposure to multiple process technologies.
  • Track record as a Distinguished Member of Technical Staff (DMTS) or equivalent technical leadership designation.
  • Experience with advanced device architectures including Gate-All-Around (GAA), Complementary FET (CFET), 3D DRAM, 4F2 DRAM, or NAND.
  • Familiarity with advanced metallization (Mo, Cu, W, etc.), selective processes, and novel patterning approaches.
  • Prior experience at a leading semiconductor manufacturer in a process integration or device engineering role.
  • A strong network in the semiconductor technical community.
Responsibilities
  • Develop and demonstrate integrated pathfinding process solutions for advanced logic (GAA, CFET) and/or memory (DRAM 4F2, 3D DRAM, NAND) device architectures.
  • Drive hands-on process development spanning deposition, etch, implant, epitaxy, CMP, and thermal processing, connecting individual process steps into integrated module flows.
  • Identify and de-risk critical process challenges for N+1 and N+2 technology nodes through systematic experimentation and DTCO analysis.
  • Translate customer device performance targets, such as contact resistance reduction, carrier mobility enhancement, low-k integration, and high-selectivity etch, into actionable Applied process solutions.
  • Work across Applied's product BUs to assemble end-to-end process flows that demonstrate Applied's differentiated value.
  • Partner with BU development teams to influence product roadmaps based on pathfinding learnings and customer requirements.
  • Collaborate with DTCO for integration-level analysis connecting individual process capabilities to device-level performance metrics, including Vt, Idsat, leakage, RC delay, capacitance, resistance, strain, thermal, and NAND.
  • Coordinate wafer flow, DOE design, and data analysis across multiple BU tools and process modules.
  • Engage directly with senior technologists at key customers, presenting data, discussing integration approaches, and aligning on pathfinding priorities.
  • Lead technical discussions in customer Technology Review Meetings (TRMs), performance task forces, and pathfinding workshops.
  • Translate customer integration challenges into Applied-actionable development programs and demo plans.
  • Support customer co-development engagements by providing deep process expertise and integration guidance.
  • Publish at premier conferences (IEDM, VLSI, ISSCC, IRPS) and in top journals to establish Applied's technical leadership in pathfinding.
  • Build a strong patent portfolio in advanced process integration and pathfinding solutions.
  • Contribute to Applied's internal technical community through seminars, reviews, and mentoring of junior engineers.
  • Stay at the forefront of semiconductor technology trends, including device architecture evolution, new materials, and emerging integration challenges.
  • Own end-to-end pathfinding solutions from concept through customer demonstration.
  • Drive complex multi-BU process development programs independently.
  • Elevate Applied's technical brand through publications, patents, and customer engagements.

About the company

Applied Materials designs and builds precision machines that chipmakers and display manufacturers use to form, shape and inspect thin layers of material. Its platforms handle steps such as depositing films and removing unwanted material, helping chipmakers create transistors and wiring at atomic scale. Customers include makers of logic chips and memory, as well as manufacturers of advanced displays. The company earns money from equipment sales, replacement parts and services, and factory software that schedules production and monitors manufacturing processes. Applied Materials was founded in 1967 and is headquartered in Santa Clara, California.

Company Size

10,001+

Company Stage

IPO

Headquarters

Santa Clara, California

Founded

1967

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Simplify's Take

What believers are saying

  • Installed equipment brings repeat business: Applied Global Services sells long-term service agreements, replacement parts and equipment upgrades.
  • Sales are expanding: Applied's August 2026 report showed fiscal Q3 revenue of $9.12 billion, up 25% yearly.
  • Employees join profitable operations: Applied reported $3.08 billion of operating profit for fiscal Q3 in August 2026.

What critics are saying

  • Singapore manufacturing hires face late shifts: Applied's live engineering posting specifies 4 p.m. to 1:30 a.m. schedules.
  • Export compliance has real costs: Applied and its Korea subsidiary settled a $252 million penalty in February 2026.
  • Sales depend on China access: Applied's December 2025 filing attributed 30% of fiscal 2025 revenue to customers there.

What makes Applied Materials unique

  • Applied combines manufacturing steps under vacuum: its Endura copper platform integrates seven processes to protect delicate material interfaces.
  • Factory software reaches beyond chips: Applied SmartFactory serves battery and pharmaceutical manufacturers alongside semiconductor plants.
  • Research targets future chip generations: Applied's EPIC partners work on technology three to four generations ahead of production.

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Benefits

Health Insurance

Dental Insurance

Vision Insurance

Life Insurance

Disability Insurance

Relocation Assistance

Performance Bonus

Stock Options

Flexible Work Hours

Growth & Insights and Company News

Headcount

6 month growth

0%

1 year growth

-1%

2 year growth

-1%
Yahoo Finance
Oct 14th, 2026
Applied Materials vs Intel: why the $9.1B-quarter equipment maker beats the foundry turnaround

A Motley Fool comparison of chip equipment maker Applied Materials and chipmaker Intel favours Applied Materials as the better 2026 buy, though the author suggests buying shares gradually. Applied Materials' revenue rose 25% to $9.1 billion in the quarter ended July 26, 2026, and net income rose 43% to $2.5 billion. Risks include cyclical demand and China, which made up 28% of revenue. In February 2026 it agreed to pay $252.5 million to settle US export allegations. Intel's second-quarter revenue also rose 25%, to $16.1 billion. It posted an $11.0 billion net loss, driven by a $12.5 billion noncash charge tied to its US government deal. Its foundry unit lost $2.1 billion, and an August share sale raising about $23 billion diluted existing owners. On valuation, Applied trades at 42.2x forward earnings against Intel's 77.7x.

Yahoo Finance
Oct 13th, 2026
Applied Materials targets 54% gross margin and $12B services revenue by 2030 on AI demand

Applied Materials (NASDAQ:AMAT) expects to gain more than two percentage points of wafer-fab-equipment market share by 2030, driven by demand for artificial intelligence (AI) chips. The company outlined its strategy at the SEMICON West technology breakfast. Chief executive officer Gary Dickerson said AI spending is concentrating in leading-edge logic, DRAM memory and advanced packaging, which should make up about 75% of incremental industry growth. For 2030, Applied targets a 54% non-GAAP gross margin, a 40% operating margin and more than $12 billion in services revenue. It expects more than $1 billion in high-bandwidth-memory packaging revenue this year. The company plans to more than double its laboratory and manufacturing capacity, and return 80% to 100% of free cash flow to shareholders.

Yahoo Finance
Oct 12th, 2026
Applied Materials stock prices in 36.3% sales growth for fiscal 2027

Applied Materials stock trades at 39.5 times adjusted earnings for the past twelve months, despite sales growth of just 7.8% over the period. The price leans on forecasts that sales will rise 36.3% between fiscal 2026 and fiscal 2027, with profit growing 40.0%. Net margin is expected to widen from 27% in fiscal 2025 to 31% in fiscal 2027. On those estimates, the stock costs 38.7 times fiscal 2026 profit and 27.7 times fiscal 2027 profit. Sales growth reached 24.8% in the most recent quarter, up from declines earlier in the year. Management said clean room space at customers' factories will limit shipments in 2027, and costs could squeeze margins. The company presents to investors on October 13, 2026, at SEMICON West.

Fox Business
Oct 12th, 2026
Applied Materials CEO calls AI economy's biggest inflection point as $5B EPIC Center opens

Applied Materials chief executive officer Gary Dickerson called AI the biggest economic "inflection" point of our lifetime. He spoke about the company's $5 billion EPIC Center in Silicon Valley, its research into next-generation chips, and surging demand for AI chips. Dickerson made the remarks on "The Claman Countdown.

Yahoo Finance
Oct 12th, 2026
Applied Materials opens $5B EPIC Center, the world's largest chip equipment R&D facility

Applied Materials unveiled its Equipment and Process Innovation and Commercialization (EPIC) Center in Sunnyvale, California, on October 12, 2026. The $5 billion facility is billed as the world's largest dedicated to collaborative semiconductor process technology and equipment R&D. Chipmakers, systems companies, equipment partners and universities will work alongside Applied's engineers. Founding partners are TSMC, Intel, Samsung Electronics, Micron and SK hynix. Broadcom, Advantest, SCREEN, KIOXIA and Besi join as innovation partners, along with five research universities. The 600,000-square-foot building holds nearly four acres of cleanroom space. It aims to remove the handoffs between materials research, equipment development and pilot production, speeding new chip technologies to volume manufacturing for the AI era. Applied expects capital spending to scale to about $5 billion as customer projects begin.