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Applied Materials

Builds equipment for chip and display factories

Director Pathfinding Solutions - Integrated Materials Solutions

Process EngineeringConfirmed live in the last 24 hours
Full-timeAlbany, NY, USAIn-person

About the Job

Requirements

  • A Ph.D. in Electrical Engineering, Materials Science, Chemical Engineering, Physics, or a related semiconductor discipline.
  • 10+ years of experience in semiconductor process development, integration, or device engineering, with deep expertise in FEOL, MOL, or BEOL process technologies.
  • A demonstrated hands-on track record of developing integrated process solutions for advanced logic and/or memory nodes.
  • A strong publication record at top-tier semiconductor conferences (IEDM, VLSI, IRPS) and/or a significant patent portfolio.
  • Experience engaging directly with customer technical teams at major semiconductor manufacturers, including IDMs, foundries, or memory makers.
  • Deep understanding of device physics, process-structure-property relationships, and DTCO principles.
  • Ability to work effectively across organizational boundaries, coordinating with multiple BUs, product teams, and customer organizations.
  • Experience collaborating with or working at a semiconductor equipment or materials company with exposure to multiple process technologies.
  • Track record as a Distinguished Member of Technical Staff (DMTS) or equivalent technical leadership designation.
  • Experience with advanced device architectures including Gate-All-Around (GAA), Complementary FET (CFET), 3D DRAM, 4F2 DRAM, or NAND.
  • Familiarity with advanced metallization (Mo, Cu, W, etc.), selective processes, and novel patterning approaches.
  • Prior experience at a leading semiconductor manufacturer in a process integration or device engineering role.
  • A strong network in the semiconductor technical community.

Responsibilities

  • Develop and demonstrate integrated pathfinding process solutions for advanced logic (GAA, CFET) and/or memory (DRAM 4F2, 3D DRAM, NAND) device architectures.
  • Drive hands-on process development spanning deposition, etch, implant, epitaxy, CMP, and thermal processing, connecting individual process steps into integrated module flows.
  • Identify and de-risk critical process challenges for N+1 and N+2 technology nodes through systematic experimentation and DTCO analysis.
  • Translate customer device performance targets, such as contact resistance reduction, carrier mobility enhancement, low-k integration, and high-selectivity etch, into actionable Applied process solutions.
  • Work across Applied's product BUs to assemble end-to-end process flows that demonstrate Applied's differentiated value.
  • Partner with BU development teams to influence product roadmaps based on pathfinding learnings and customer requirements.
  • Collaborate with DTCO for integration-level analysis connecting individual process capabilities to device-level performance metrics, including Vt, Idsat, leakage, RC delay, capacitance, resistance, strain, thermal, and NAND.
  • Coordinate wafer flow, DOE design, and data analysis across multiple BU tools and process modules.
  • Engage directly with senior technologists at key customers, presenting data, discussing integration approaches, and aligning on pathfinding priorities.
  • Lead technical discussions in customer Technology Review Meetings (TRMs), performance task forces, and pathfinding workshops.
  • Translate customer integration challenges into Applied-actionable development programs and demo plans.
  • Support customer co-development engagements by providing deep process expertise and integration guidance.
  • Publish at premier conferences (IEDM, VLSI, ISSCC, IRPS) and in top journals to establish Applied's technical leadership in pathfinding.
  • Build a strong patent portfolio in advanced process integration and pathfinding solutions.
  • Contribute to Applied's internal technical community through seminars, reviews, and mentoring of junior engineers.
  • Stay at the forefront of semiconductor technology trends, including device architecture evolution, new materials, and emerging integration challenges.
  • Own end-to-end pathfinding solutions from concept through customer demonstration.
  • Drive complex multi-BU process development programs independently.
  • Elevate Applied's technical brand through publications, patents, and customer engagements.

About the Company

Applied Materials

Builds equipment for chip and display factories

Applied Materials designs and builds precision machines that chipmakers and display manufacturers use to form, shape and inspect thin layers of material. Its platforms handle steps such as depositing films and removing unwanted material, helping chipmakers create transistors and wiring at atomic scale. Customers include makers of logic chips and memory, as well as manufacturers of advanced displays. The company earns money from equipment sales, replacement parts and services, and factory software that schedules production and monitors manufacturing processes. Applied Materials was founded in 1967 and is headquartered in Santa Clara, California.

Company size
10,001+
Company stage
IPO
Headquarters
Santa Clara, CA
Founded
1967

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