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Kandou AI

Provides chip-to-chip AI connectivity solutions

Analog Design Intern - Analog Design

Silicon & ASIC DesignConfirmed live in the last 24 hours
InternshipSaint-Sulpice, SwitzerlandNo salary listed

About the Job

Requirements

  • Applicants must be currently enrolled at a university or higher education institution in Switzerland and already based in Switzerland.
  • The project is suitable for Master's students in Electrical Engineering, Microelectronics, Communications Engineering, or Computer Engineering.
  • Familiarity with analog integrated circuit design and layout drawing is desired.
  • Familiarity with analog circuit simulators such as SPICE or SPECTRE is desired.
  • A strong background in signal processing is desired.

Responsibilities

  • Review the state of the art in simultaneous bidirectional and full-duplex wireline communication systems.
  • Develop behavioral models of wideband copper channels and transceiver architectures.
  • Study self-interference cancellation techniques in the analog and/or digital domains.
  • Evaluate the impact of channel impairments, mismatch, and non-idealities on link performance.
  • Design and simulate key building blocks using Python or circuit-level computer-aided design tools.
  • Assess achievable data rates, energy efficiency, and implementation complexity.
  • Develop simulation models for simultaneous bidirectional serial links.
  • Quantify the benefits and challenges associated with full-duplex operation over copper channels.
  • Present the results in a technical report and oral presentation.

Desired Qualifications

  • The work may lead to conference or journal publication opportunities, depending on the student's progress and interests.

About the Company

Kandou AI

Provides chip-to-chip AI connectivity solutions

Kandou AI designs and sells semiconductor connectivity hardware for AI workloads. It provides a memory fabric and CXL controllers that link processors to memory, enabling scalable, energy-efficient AI inference and training clusters built from affordable hardware. Using Copper MIMO interconnect, it reduces energy per bit and supports features like offloading AI training collectives, switchless memory for in-memory databases, and field-repairable co-packaged optics for better cooling. By targeting the data-movement bottleneck between processors and memory and offering chiplet-based fabrics and IP licensing, Kandou AI aims to make scalable AI infrastructure more accessible to hyperscalers, data centers, and system integrators.

Company size
201-500
Company stage
Late Stage VC
Total funding
$504.7M
Headquarters
Lausanne, Switzerland
Founded
2011

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