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Powerlattice

Integrated power-delivery chiplet for compute

Applications Engineer

Implementation & Technical Account ManagementConfirmed live in the last 24 hours
Full-timeChandler, AZ, USA

About the Job

Requirements

  • A bachelor's or master's degree in Electrical Engineering, Computer Engineering, or a related field.
  • At least 10 years of experience in application engineering for integrated circuits.
  • A proven track record of solving complicated problems involving evaluation boards, integrated circuits, and systems.
  • A proven track record of working with customers to solve application-related problems.
  • Strong expertise in Python scripting for laboratory automation.
  • Strong expertise with laboratory electronics equipment, including power supplies, oscilloscopes, and meters.
  • Ability to communicate plans, problems, and results, and propose solutions.
  • Strong debugging and problem-solving skills.
  • Experience leading laboratory problem-solving with top-tier electronics companies.
  • Experience with silicon bring-up and post-silicon debugging.

Responsibilities

  • Develop focused laboratory testing to resolve customer problems.
  • Identify, communicate, and document root causes.
  • Write application notes to help customers understand the distinctiveness of products and use them successfully.
  • Generate collateral for external conferences, as pertinent, to demonstrate company capability and technical strength.
  • Create operating guides for internal and external use.
  • Assist the scheduling team in creating project schedules.
  • Lead and guide other team members as needed to resolve customer issues.

About the Company

Powerlattice

Integrated power-delivery chiplet for compute

PowerLattice develops power delivery chiplets that sit in the processor package to provide voltage regulation directly at the compute die. The chiplet packages miniaturized on-die inductors, voltage control circuits, a vertical packaging design, and a programmable software layer on a single silicon die to move power delivery closer to the compute core. This near-die integration differs from typical power management by delivering regulatory functions inside the chiplet itself, enabling substantial energy savings and easier scaling across AI accelerators, GPUs, and data-center CPUs. The goal is to improve efficiency and performance for next-generation compute by offering modular, near-die power regulation to hyperscalers, OEMs, and system integrators, with early sampling and trials planned for 2026.

Company size
11-50
Company stage
Late Stage VC
Total funding
$111M
Headquarters
Vancouver, WA
Founded
2023

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