Q

Qualcomm

Designs mobile chips and licenses wireless patents

Electromagnetic Passives and RF Module Design Engineer - ASICS Engineering

RF & Microwave EngineeringConfirmed live in the last 24 hours
Full-timeBengaluru, Karnataka, IndiaNo salary listedIn-person

About the Job

Requirements

  • A Bachelor's degree in Science, Engineering, or a related field and at least 2 years of ASIC design, verification, validation, integration, or related work experience; or a Master's degree in Science, Engineering, or a related field and at least 1 year of such work experience; or a PhD in Science, Engineering, or a related field.
  • Experience designing and simulating RF passive components, such as inductors, transformers, MOM capacitors, and passive filters.
  • Experience designing and modeling RF modules for RF and mmWave frequencies.
  • Experience using electromagnetic simulation techniques and tools, including Method of Moments EM solvers (EMX, PeakView, Helic) and HFSS.
  • Experience with circuit design and layout using Cadence tools and Agilent ADS.
  • Experience extracting compact RLCK models of multiport passive components.
  • Ability to use electromagnetic tools to predict circuit-level electric and magnetic coupling.
  • Understanding of chip fabrication processes and design.
  • Knowledge of electromagnetic theory, microwave theory, and design.
  • Knowledge of antenna design and radiation and wave propagation.
  • Understanding of signal integrity and power integrity at chip, package, and PCB levels.
  • Basic understanding of RF systems.
  • Understanding of noise propagation mechanisms in chips, packages, and PCBs.
  • Knowledge of tools including Ansys Suite (HFSS, Q3D, SiWave, Layout), Lorentz, Helic, EMX, Cadence Virtuoso, Allegro or similar tools for package/module layout, and Expedition or similar tools for PCB layout and schematics.
  • Bachelor's degree in science, engineering, or a related field is required.

Responsibilities

  • Design and develop RF passive components for next-generation highly integrated RF integrated circuits in deep sub-micron 28 nm and 14ff CMOS and SOI technologies.
  • Work with the RF circuit design team to optimize component sizes and performance for RF circuit blocks.
  • Deliver components that include compact models and design-rule-check-clean physical designs.
  • Perform isolation analysis and optimization to reduce on-chip and chip-to-package coupling.
  • Optimize multichip carriers for RF systems, focusing on loss and isolation.
  • Participate in RF package, module, and PCB design and modeling to optimize overall system performance.

Desired Qualifications

  • Exposure to RF package, module, and PCB design and modeling.
  • Knowledge of module- and PCB-level power distribution networks and RF transmission-line layout and analysis.
  • Working experience with programming languages such as Python, MATLAB, and SKILL.
  • Working experience and knowledge of power amplifier and low-noise amplifier matching, along with a basic understanding of patch antenna design parameters and matching.
  • A Master's degree and PhD are preferred.

About the Company

Qualcomm

Designs mobile chips and licenses wireless patents

Qualcomm designs the Snapdragon processors and modems inside many Android phones, and it licenses its wireless patents to device makers around the world. It helped commercialize CDMA, the cellular technology behind 3G networks, and its patents cover core parts of the 4G and 5G standards that phones use to connect. The company does not run its own chip factories; contract foundries make its chips, which it sells to makers of phones, PCs, cars, and connected devices. Device makers also pay Qualcomm royalties for using its patented technology, which forms a second business alongside chip sales. Qualcomm was founded in 1985 and is based in San Diego, California.

Company size
10,001+
Company stage
IPO
Headquarters
San Diego, CA
Founded
1985

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