SOC Thermal Engineer

Summary

Do you love working on challenges that no one has yet solved? Do you like changing the game? Envision what you could do here. At Apple, we believe new ideas have a way of becoming extraordinary products, services, and customer experiences very quickly. Bring passion and dedication to your job and there's no telling what you could accomplish. We are looking for a self-motivated and ambitious individual who will work closely with multi-functional teams to optimize mobile device’s thermal performance and participate in advanced IC packaging research and development.

Minimum Qualifications

BS + 10 years of industry experience.

Preferred Qualifications

MSEE + 10 years of industry experience, preferred. Demonstrated leadership capabilities at the senior engineer level. Deep expertise in thermal design for silicon devices and packaging solutions. Proven experience with IC physical design parameters and their impact on electrical and thermal performance across various packaging technologies. Strong understanding of SoC design methodologies, low-power design techniques, and thermal analysis approaches. Comprehensive knowledge of advanced packaging assembly processes, including electrical and thermal characteristics. Extensive hands-on experience in thermal design, analysis, and validation of advanced cooling solutions for high-power SoCs. Background in thermal testing for semiconductor devices, packages, PCBs, or mobile products Proficiency with industry-standard tools including Ansys IcePak, Sentinel-TI, Fluent, Cadence Allegro, and RedHawk. Experience designing and executing experimental test setups and analyzing thermal data.

Description

The Thermal Engineer will design and validate cooling solutions for high-performance computing systems. The role involves simulation, testing, and cross-functional collaboration to ensure thermal performance and reliability across product lines.

Responsibilities

This position is responsible for thermal analysis and design of thermal solutions to address chip energy efficiency and performance scaling, Providing thermal modeling solutions to mobile devices at silicon die and semiconductor package levels, Analyzing simulation and measurement results to enhance product thermal management, Integrate cooling solutions to next generation SOC architecture design.