NXP Semiconductors

Automotive semiconductors and secure embedded solutions

NPI Process Development Engineer

Manufacturing EngineeringConfirmed live in the last 24 hours

Full-timeKuala Lumpur, Federal Territory of Kuala Lumpur, MalaysiaNo salary listedIn-person

About the Job

Requirements

Three to six years of work experience in semiconductor assembly for automotive customers.
Experience in package development, including LQFP, MAPBGA, SiP, FCCSP, or FCBGA, is an added advantage.
Good technical knowledge and hands-on experience in process characterization for key processes such as laser dicing, plasma dicing, mechanical sawing, die bonding, wire bonding, molding, ball attach, marking, and singulation.
Good SPC, process control, statistical, and problem-solving skills.
Proficiency with Microsoft applications, including PowerPoint, Excel macros, and Word.
Project management knowledge is an added advantage.

Responsibilities

Develop and qualify new LQFP and BGA packages for total assembly processes in automotive applications.
Conduct quality, yield, cost, and process-improvement activities.
Create and maintain process documentation, process specifications, standard work instructions, OCAP, QIT, and related materials.
Collaborate with cross-functional team members to resolve conflicts and make timely decisions that avoid risks to the organization, company, and customer.
Work closely with upper management to align the scope and direction of key projects.

Desired Qualifications

Experience in LQFP, MAPBGA, SiP, FCCSP, or FCBGA package development is an added advantage.
Project management knowledge is an added advantage.

•Responsible to develop and qualify new LQFP & BGA packages for total assembly processes in automotive applications.

•Responsible for quality, yield, cost and process improvement activities.

•Responsible for process documentation, process spec, standard work instruction, OCAP, QIT etc.

•Need to collaborate closely with cross functional team members to resolve conflicts and make fast decision to avoid any risk to the organization/company/customer.

•Take ownership to work closely with upper management to align scope and direction of key projects.

Requirements:

•3-6 years of work experience with semiconductor assembly background for automotive customers.

•Experience in LQFP, MAPBGA, SiP, FCCSP, FCBGA etc. packing development will be an added advantage.

•Good technical knowledge and hands-on experience in process characterization for key processes such as laser dicing, plasma dicing, mechanical saw, die bond, wire bonding, mold, ball attach, marking, singulation etc.

•Candidate must have great interpersonal skills, leadership skills, result orientated, self-driven and eager to strive for success.

•Good SPC, Process Control and other relevant statistical & problem-solving skills

•Good in Microsoft application (PowerPoint, Excel Macro, Word, etc.). Project Management knowledge is an added advantage.

More information about NXP in Malaysia...

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About the Company

NXP Semiconductors

Automotive semiconductors and secure embedded solutions

NXP Semiconductors designs and sells semiconductor chips for vehicles and other devices. Its products include automotive-grade microcontrollers and other ICs used in engines, infotainment, safety systems, and networked car architectures. These chips process data, run software, and enable features such as advanced driver assistance and vehicle connectivity, often with strong security and real-time performance. Unlike some peers, NXP became an independent company after Philips spun off its semiconductor unit in 2006 and later merged with Freescale in 2015, building a focused strength in automotive semiconductors and microcontrollers. This gives it a clear niche in the market and the goal of growing as a standalone leader in smarter, connected vehicles and related technologies.

Company size: 10,001+
Company stage: IPO
Headquarters: Eindhoven, Netherlands
Founded: 2004

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