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HyperLight

Photonic integrated circuits for data centers

Failure Analysis Engineer

Quality EngineeringConfirmed live in the last 24 hours
Full-timeCambridge, MA, USA$90k - $180k /yr

About the Job

Requirements

  • A Bachelor of Science in materials science and engineering, chemistry, applied physics, physics, electrical engineering, or chemical engineering plus at least three years of hands-on cleanroom and/or characterization experience; or a Master of Science in one of those fields plus one to two years of experience; or a PhD in one of those fields, with graduate research counting toward experience.
  • Independent cleanroom experience, including unsupervised qualification and work in at least three of photolithography and resist processing, plasma/reactive ion etching, wet etching, thin-film deposition using PVD, CVD, or ALD, and e-beam lithography.
  • Knowledge of contamination and particle control, strict standard operating procedure adherence, and complete, legible logbooks.
  • Independent scanning electron microscope operation, including imaging insulating and photonic integrated circuit samples, plus energy-dispersive X-ray spectroscopy acquisition and interpretation.
  • Ability to design analyses with appropriate controls, identify confounding variables, and separate observations from inferences.
  • Ability to produce technical reports that non-specialist stakeholders can act on.
  • Comfort working with acids, bases, and solvents, and willingness to complete site-specific safety training, including hydrofluoric acid handling.
  • Ability to handle wafers, chips, and sub-millimeter features with tweezers under a microscope.
  • Correctable close visual acuity for microscope and instrument work.
  • Ability to perform extended standing and walking in cleanroom environments, often for two to four hours at a time, and to gown and remove full cleanroom attire multiple times per day.
  • Willingness and ability to travel locally between the office/lab and shared user facilities at Harvard CNS and MIT.nano, and to work occasional off-hours or weekends when shared facility tool availability requires it.
  • Access to certain instruments may be restricted for individuals with pacemakers or other implanted medical devices due to strong magnetic fields.
  • Authorization to work in the United States is required.

Responsibilities

  • Own failure-analysis cases end to end by defining the question, planning the analysis, executing it, and writing up the findings.
  • Sequence analyses appropriately on irreplaceable samples, prioritizing nondestructive methods before destructive methods and evaluating whether cross-sectioning is justified when only one sample is available.
  • Perform optical microscopy, scanning electron microscopy, energy-dispersive X-ray spectroscopy, focused ion beam cross-sectioning and lift-out, atomic force microscopy, profilometry, and ellipsometry as needed.
  • Perform surface and chemical characterization using X-ray photoelectron spectroscopy, Raman spectroscopy, and Fourier-transform infrared spectroscopy, and interpret the data.
  • Specify and manage outsourced analysis, such as transmission electron microscopy, with external laboratories.
  • Support post-reliability failure analysis on stressed parts, including high-accelerated-stress testing, damp heat, and thermal cycling, and analyze customer returns in collaboration with Test and Reliability engineers.
  • Prepare failure-analysis samples in the cleanroom and perform light fabrication for demonstration and process-feasibility devices, including resist processing, photolithography, e-beam lithography, metallization, wet and dry etching, ion milling, and reactive ion etching.
  • Write evidence-anchored reports and present findings to stakeholders, including Platform and Foundry.
  • Maintain sample chain of custody, case records, and the failure-analysis findings database.
  • Perform extended workstation-based data analysis and report writing.

Desired Qualifications

  • Focused ion beam experience in cross-sectioning, lift-out, and transmission electron microscopy lamella preparation.
  • X-ray photoelectron spectroscopy data analysis, including peak fitting, charge referencing and correction, and chemical-state assignment.
  • Transmission electron microscopy experience, or experience scoping and managing outsourced transmission electron microscopy or analytical work.
  • Experience with Raman spectroscopy, Fourier-transform infrared spectroscopy, atomic force microscopy, ellipsometry, and profilometry.
  • E-beam lithography experience.
  • Working knowledge of semiconductor and photonic failure mechanisms, including galvanic corrosion, delamination, cracking, electromigration, and electrostatic discharge.
  • Familiarity with JEDEC reliability methods, including high-accelerated-stress testing, damp heat, and thermal cycling.
  • Lithium niobate, integrated photonics, MEMS, or III-V process experience.
  • Statistical and spectral data analysis using JMP or Python.
  • Experience presenting technical findings to teams whose processes are implicated by the findings.

About the Company

HyperLight

Photonic integrated circuits for data centers

HyperLight designs and manufactures photonic integrated circuits (PICs) using a thin film lithium niobate on insulator (TFLN) platform for data centers and telecommunications networks. Its PICs, such as electro-optic modulators, deliver high bandwidth (over 110 GHz) with low drive voltage, low insertion loss, and strong optical power handling. The company differentiates itself through its TFLN platform, focus on low power and high-bandwidth performance, and the ability to customize PICs for specific applications at high volume. Its goal is to enable faster, more reliable data and telecom networks by providing efficient, scalable photonic solutions.

Company size
51-200
Company stage
Series C
Total funding
$117M
Headquarters
Cambridge, MA
Founded
2018

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