Failure Analysis Engineer
HyperLight
Failure Analysis Engineer
HyperLight
Photonic integrated circuits for data centers
HyperLight · Cambridge, United States · Full-time · Posted 2026-08-28
Workplace: on_site
Department: Test
HyperLight is at the forefront of the commercialization of thin-film lithium niobate (TFLN) integrated photonics - a material and process technology that is enabling high-performance, scalable optical components across AI/datacom infrastructure, hyperscale computing, quantum computing, sensing, and beyond. Founded in 2018 and backed by leading venture capital, we’ve built a team and a platform focused on real-world mass deployment of TFLN photonics technology.
At the core of our work is the TFLN Chiplet™ platform - a modular, integrated architecture designed for scalability, manufacturability, and seamless integration into complex systems. It offers a rare combination of extraordinary performance and industrial readiness, enabling system developers across applications to deploy the technology fast and ready. We partner with our customers and suppliers from conceptualization, design, and prototyping phases, all the way through mass production to ensure smooth and rapid deployment of TFLN photonic technology.
We believe our platform is the key, in the golden age of integrated photonics, to empower humanity to the next level. We assembled a world class team covering engineering, business, and operations. We believe in the power of integrity, innovation, collaboration, and pragmatic solutions. Our diverse team thrives on challenges and is united by a shared commitment to excellence. We take pride in tackling complex challenges with curiosity, humility, and a deep sense of care for one another.
Failure Analysis currently consists of a small and impactful team. You’ll be trained directly by the FA lead and will grow into owning cases independently across the full workflow: intake, analysis planning, hands-on characterization, root cause determination, and reporting back to the Test, Platform, and Engineering teams.
FA at HyperLight is investigative work. Each measurement is one piece of evidence, and the job is to assemble those pieces into a defensible picture of what actually happened – while resisting the pull of the first plausible story.
What you’ll do
Education and experience — one of:
BS in materials science and engineering, chemistry, applied physics, physics, electrical engineering, or chemical engineering, plus 3+ years hands-on cleanroom and/or
characterization experience; or
PhD in one of the above (graduate research counts toward experience)
Independent cleanroom experience. You have been qualified on and worked unsupervised with at least three of: photolithography and resist processing, plasma/RIE etch, wet etch, thin-film deposition (PVD/CVD/ALD), e-beam lithography. This includes the habits that go with it – contamination and particle control, strict SOP adherence, and legible, complete logbooks.
Preferred
What we look for
Two qualities matter more here than any single tool on the list.
The first is curiosity that doesn’t quit – the instinct to stop at the odd thing in the corner of
the image rather than move on because it wasn’t what you were looking for. Most root causes we find started as an incidental observation someone chose not to ignore.
The second is calibration – being willing to say the evidence doesn’t yet support a conclusion,
and to change your mind when a control comes back wrong. FA findings drive real changes to
production, so being confidently wrong is expensive.
Physical and work environment demands
This role is in-person at HyperLight's office in Cambridge, MA. Authorization to work in the US is required.
HyperLight is an equal opportunity employer. All applicants will be considered for employment without attention to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status. HyperLight is committed to providing reasonable accommodations to individuals with disabilities during our hiring process. If you need assistance or an accommodation, please contact us at [email protected].
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Photonic integrated circuits for data centers
HyperLight designs and manufactures photonic integrated circuits (PICs) using a thin film lithium niobate on insulator (TFLN) platform for data centers and telecommunications networks. Its PICs, such as electro-optic modulators, deliver high bandwidth (over 110 GHz) with low drive voltage, low insertion loss, and strong optical power handling. The company differentiates itself through its TFLN platform, focus on low power and high-bandwidth performance, and the ability to customize PICs for specific applications at high volume. Its goal is to enable faster, more reliable data and telecom networks by providing efficient, scalable photonic solutions.
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