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HyperLight

Photonic integrated circuits for data centers

Failure Analysis Engineer

Full-TimeUpdated on 10/17/2026
$90k - $180k/yr
Mid, Senior
Bachelor's, Master's, PhD
Cambridge, MA, USA
In PersonLocal travel between the office/lab and shared facilities at Harvard CNS and MIT.nano; occasional off-hours or weekend work may be required.
Manufacturing Quality & TestQuality Engineering

About the job

Requirements
  • A Bachelor of Science in materials science and engineering, chemistry, applied physics, physics, electrical engineering, or chemical engineering plus at least three years of hands-on cleanroom and/or characterization experience; or a Master of Science in one of those fields plus one to two years of experience; or a PhD in one of those fields, with graduate research counting toward experience.
  • Independent cleanroom experience, including unsupervised qualification and work in at least three of photolithography and resist processing, plasma/reactive ion etching, wet etching, thin-film deposition using PVD, CVD, or ALD, and e-beam lithography.
  • Knowledge of contamination and particle control, strict standard operating procedure adherence, and complete, legible logbooks.
  • Independent scanning electron microscope operation, including imaging insulating and photonic integrated circuit samples, plus energy-dispersive X-ray spectroscopy acquisition and interpretation.
  • Ability to design analyses with appropriate controls, identify confounding variables, and separate observations from inferences.
  • Ability to produce technical reports that non-specialist stakeholders can act on.
  • Comfort working with acids, bases, and solvents, and willingness to complete site-specific safety training, including hydrofluoric acid handling.
  • Ability to handle wafers, chips, and sub-millimeter features with tweezers under a microscope.
  • Correctable close visual acuity for microscope and instrument work.
  • Ability to perform extended standing and walking in cleanroom environments, often for two to four hours at a time, and to gown and remove full cleanroom attire multiple times per day.
  • Willingness and ability to travel locally between the office/lab and shared user facilities at Harvard CNS and MIT.nano, and to work occasional off-hours or weekends when shared facility tool availability requires it.
  • Access to certain instruments may be restricted for individuals with pacemakers or other implanted medical devices due to strong magnetic fields.
  • Authorization to work in the United States is required.
Responsibilities
  • Own failure-analysis cases end to end by defining the question, planning the analysis, executing it, and writing up the findings.
  • Sequence analyses appropriately on irreplaceable samples, prioritizing nondestructive methods before destructive methods and evaluating whether cross-sectioning is justified when only one sample is available.
  • Perform optical microscopy, scanning electron microscopy, energy-dispersive X-ray spectroscopy, focused ion beam cross-sectioning and lift-out, atomic force microscopy, profilometry, and ellipsometry as needed.
  • Perform surface and chemical characterization using X-ray photoelectron spectroscopy, Raman spectroscopy, and Fourier-transform infrared spectroscopy, and interpret the data.
  • Specify and manage outsourced analysis, such as transmission electron microscopy, with external laboratories.
  • Support post-reliability failure analysis on stressed parts, including high-accelerated-stress testing, damp heat, and thermal cycling, and analyze customer returns in collaboration with Test and Reliability engineers.
  • Prepare failure-analysis samples in the cleanroom and perform light fabrication for demonstration and process-feasibility devices, including resist processing, photolithography, e-beam lithography, metallization, wet and dry etching, ion milling, and reactive ion etching.
  • Write evidence-anchored reports and present findings to stakeholders, including Platform and Foundry.
  • Maintain sample chain of custody, case records, and the failure-analysis findings database.
  • Perform extended workstation-based data analysis and report writing.
Desired Qualifications
  • Focused ion beam experience in cross-sectioning, lift-out, and transmission electron microscopy lamella preparation.
  • X-ray photoelectron spectroscopy data analysis, including peak fitting, charge referencing and correction, and chemical-state assignment.
  • Transmission electron microscopy experience, or experience scoping and managing outsourced transmission electron microscopy or analytical work.
  • Experience with Raman spectroscopy, Fourier-transform infrared spectroscopy, atomic force microscopy, ellipsometry, and profilometry.
  • E-beam lithography experience.
  • Working knowledge of semiconductor and photonic failure mechanisms, including galvanic corrosion, delamination, cracking, electromigration, and electrostatic discharge.
  • Familiarity with JEDEC reliability methods, including high-accelerated-stress testing, damp heat, and thermal cycling.
  • Lithium niobate, integrated photonics, MEMS, or III-V process experience.
  • Statistical and spectral data analysis using JMP or Python.
  • Experience presenting technical findings to teams whose processes are implicated by the findings.

About the company

HyperLight designs and manufactures photonic integrated circuits (PICs) on a thin film lithium niobate on insulator (TFLN) platform for data centers and telecommunications networks. Its PICs include electro-optic modulators and related devices that deliver low drive voltage, low insertion loss, high optical power handling, and bandwidths above 110 GHz, built for customization and high-volume production. By focusing on tailoring PICs to specific applications and scaling manufacturing, HyperLight differentiates itself from competitors. The goal is to enable faster, more reliable communications in future data and telecom networks through efficient, scalable photonic solutions.

Company Size

51-200

Company Stage

Series C

Total Funding

$117M

Headquarters

Cambridge, Massachusetts

Founded

2018

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Simplify's Take

What believers are saying

  • June 2026 Series C raised $80 million for capacity and qualification.
  • HyperLight's 1.6T-DR8 demo hit 20W, about 20% below alternatives.
  • Revelio tracked 105 employees and 29 2026 job postings, signaling aggressive expansion.

What critics are saying

  • MediaTek, UMC, Jabil, and Foxconn now gain deep visibility into HyperLight's roadmap.
  • Customer qualification still gates revenue; any sampling miss delays 2026 AI deployments.
  • Thin-film lithium niobate faces Chinese cost pressure from Liobate and AFR.

What makes HyperLight unique

  • HyperLight's March 2026 UMC-Wavetek partnership gives 6-inch and 8-inch TFLN foundry scale.
  • Its 400G-per-lane PICs and 1.6T-DR8 demo target AI interconnects directly.
  • Over 150 patents and CMOS-level drive voltage strengthen its manufacturing moat.

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Benefits

  • Health Insurance
  • Vision Insurance
  • Dental Insurance
  • 401(k) Company Match
  • Paid Parental Leave
  • Life Insurance
  • Disability Insurance
  • Commuter Benefits
  • Professional Development Budget
  • Mentorship Program

Growth & Insights and Company News

Headcount

6 month growth

1%

1 year growth

-2%

2 year growth

-1%
Associated Press
Sep 8th, 2026
VentureTech Alliance joins HyperLight's Series C to advance TFLN photonics platform

HyperLight Corporation, a leader in thin-film lithium niobate photonics, announced that VentureTech Alliance has joined its Series C financing round. VTA is a venture firm focused on the semiconductor industry with investments across circuit design, foundry technology, and photonics. The addition extends HyperLight's ecosystem of investors spanning silicon ICs, foundry manufacturing, and networking. CEO Mian Zhang stated that bringing TFLN into volume production requires industry-wide alignment on process, design rules, and qualification data. HyperLight's TFLN Chiplet Platform supports data centre pluggables, coherent modules, and co-packaged optics in a single architecture. Products supporting 200G-per-lane operation are in production, with 400G-per-lane solutions now sampling. The platform is backed by over 150 patents covering device architecture and manufacturing processes.

Business Wire
Jun 19th, 2026
HyperLight Announces $80 Million Series C to Accelerate TFLN Deployment for AI Infrastructure

HyperLight Corporation (“HyperLight”), a leader in thin-film lithium niobate (TFLN) photonics, today announced the closing of an $80 million Series C financi...

The Montreal Gazette
Jun 18th, 2026
HyperLight announces $80 million Series C to accelerate TFLN deployment for AI infrastructure.

HyperLight announces $80 million Series C to accelerate TFLN deployment for AI infrastructure. CAMBRIDGE, Mass. - HyperLight Corporation ("HyperLight"), a leader in thin-film lithium niobate (TFLN) photonics, today announced the closing of an $80 million Series C financing round led by MediaTek. The round includes participation from UMC Capital, Jabil, Foxconn, EDBI (arm of SG Growth Capital, the investment platform of the Singapore Economic Development Board and Enterprise... June 18, 2026 at 11:38 a.m. CAMBRIDGE, Mass. - HyperLight Corporation ("HyperLight"), a leader in thin-film lithium niobate (TFLN) photonics, today announced the closing of an $80 million Series C financing round led by MediaTek. The round includes participation from UMC Capital, Jabil, Foxconn, EDBI (arm of SG Growth Capital, the investment platform of the Singapore Economic Development Board and Enterprise Singapore), CDIB-TEN Capital, and Qatar Investment Authority (QIA), as well as strategic investors from leading silicon IC and networking companies. Existing investors Summit Partners, The Engine, Foothill Ventures, and Xora Innovation continue to actively support the company's growth. The financing brings together companies across the AI infrastructure value chain - including silicon ICs, foundry manufacturing, electronics manufacturing services, networking, and global infrastructure investment - reflecting broad ecosystem support for scaling TFLN photonics into production. "This financing is about more than capital - it is about ecosystem alignment," said Mian Zhang, CEO of HyperLight. "AI infrastructure requires optical interconnects that can deliver higher bandwidth, lower power, and manufacturing scale across pluggable optics and co-packaged optics. HyperLight has spent years building the TFLN technology, manufacturing foundation, and ecosystem relationships required to support that transition. This round accelerates our ability to scale with customers and partners globally." HyperLight's TFLN Chiplet(TM) Platform is designed to unify the requirements of short-reach IMDD-based data center pluggables, longer-reach coherent datacom and telecom modules, and co-packaged optics (CPO) within a single high-volume manufacturable architecture. With products supporting 200G-per-lane operation and 400G-per-lane solutions now sampling, the platform combines ultra-high modulation bandwidth, CMOS-level drive voltage, and ultra-low optical loss to reduce power consumption as AI networks scale to higher lane speeds. "Next-generation AI infrastructure requires optical connectivity that enables 3.2T and beyond," said Brian Hsu, Managing Director of MediaTek Innovation Fund. "TFLN's combination of bandwidth and efficiency makes it a compelling technology for high-speed interconnects, and HyperLight is well positioned to support this transition." HyperLight will use the funding to expand manufacturing capacity, accelerate customer qualification, scale its TFLN Chiplet(TM) Platform, and deepen partnerships across foundry, semiconductor, networking, and systems integration domains. The financing builds on HyperLight's recently announced strategic manufacturing partnership with UMC and Wavetek for high-volume foundry production of the TFLN Chiplet(TM) Platform on both 6-inch and 8-inch wafers. HyperLight's platform approach consolidates diverse customer requirements into a standardized, production-ready architecture, reducing ecosystem complexity, lowering manufacturing risk, and enabling rapid, cost-competitive adoption of TFLN photonics at global scale. About HyperLight HyperLight delivers high-performance integrated photonics solutions based on thin-film lithium niobate technology. The company combines the electro-optic advantages of TFLN with scalable manufacturing, test, and integration to enable next-generation optical engines for AI data centers, telecom and metro networks, and emerging photonics markets.

FinancialContent
Jun 18th, 2026
HyperLight raises $80M Series C led by MediaTek to scale photonics for AI infrastructure

HyperLight Corporation, a thin-film lithium niobate photonics company, has raised $80 million in a Series C round led by MediaTek. The round included participation from UMC Capital, Jabil, Foxconn, EDBI, CDIB-TEN Capital and Qatar Investment Authority, alongside strategic investors from silicon IC and networking firms. The company develops TFLN technology for AI infrastructure optical interconnects, offering higher bandwidth and lower power consumption. Its TFLN Chiplet Platform supports 200G-per-lane operation, with 400G-per-lane solutions now sampling. HyperLight recently announced a manufacturing partnership with UMC and Wavetek for high-volume production on six-inch and eight-inch wafers. The funding will expand manufacturing capacity, accelerate customer qualification and scale the platform. CEO Mian Zhang said the round brings together companies across the AI infrastructure value chain.

Dailyhunt
Jun 18th, 2026
HyperLight announces $80 million series C to accelerate TFLN deployment for AI infrastructure.

HyperLight announces $80 million series C to accelerate TFLN deployment for AI infrastructure. 53 minutes ago CAMBRIDGE, Mass.-(BUSINESS WIRE)-Jun 18, 2026- (0)Comments. No comments yet. Be the first to comment.