Process Component Engineer

What's new in Xpedition 2610. The latest release of Siemens' flagship systems design platform, Xpedition, is here. Packed with enhancements across systems engineering, schematic capture, library and data management, PCB layout, and multi-domain verification, this release accelerates productivity, strengthens design-chain security, and deepens integration across the enterprise digital thread. Here is a closer look at what's new in Xpedition 2610. General portfolio enhancements. * Scalable portfolio: Siemens AG has been working on a scalable portfolio to serve the needs of engineering teams as their design, process and organizational complexities increase. With this release, Siemens AG introduce Xpedition Advanced, tuned to the needs of small enterprise companies. * Modernized UX: The user experience has been updated with an optimized application bar that aligns with Siemens design standards, freeing up critical toolbar space for faster command access on standard displays. * Fortified security: Under the hood, security is substantially fortified: all communications between design authoring tools, project management services, and concurrent multi-user workflows (including forward/backward annotation and packaging) are now fully encrypted in transit. This ensures sensitive engineering IP remains protected across the distributed design network while aligning with modern secure-by-design standards. Systems design: Model-based requirements and verification automation. Modern electronic systems demand tight traceability from high-level architecture down to physical implementation. Xpedition 2610 delivers powerful enhancements to requirements decomposition and multi-board engineering: * Automated batch verification & regression testing: Execute multiple or all verification tasks in batch mode, enabling seamless regression testing across complex design variants. * Digital verification records for complex simulations: Run entire simulation suites from a single verification task. Xpedition Model-Based Engineering (MBE) automatically generates traceable digital verification records mapped directly from requirement targets to individual nets. * Reusable technology verification templates: Build reusable requirement and verification templates for industry-standard protocols such as DDR4, PCIe, and SerDes to accelerate future project kick-offs. * Interactive HTML verification reporting: Review verification outcomes directly from MBE verification objects via rich, interactive HTML reports for faster triage and sign-off reviews. * Streamlined multi-board signal management: A redesigned Signal Manager user interface provides an intuitive mechanism for hardware engineers to validate cross-board connectivity, dramatically reducing false positives and preventing costly interconnect errors. Design capture: Orchestration, reusability, and constraint speed. Getting from concept to schematic sign-off is faster and more reliable with new automation and constraint management tools: * Setup wizard & environment orchestration: A semi-automated setup wizard accelerates designer onboarding and standardizes design environments across enterprise teams. * Responsive cross-probing: Improved cross-probing architecture eliminates freezing when selecting complex nets in Layout, giving engineers seamless bidirectional navigation between schematic and layout. * Intuitive constraint import: Easily search EDM projects by name or metadata properties to import constraints, or import known-good constraint rules from existing projects even without an EDM deployment. Library and design data management: Supply chain intelligence and faster component creation. Maintaining trusted component data and securing design assets is central to Xpedition's data management backbone: * Embedded PartQuest search: Direct integration of the PartQuest plug-in eliminates tab-switching and allows designers to search manufacturer parts using supplier facets and parametric filters natively inside EDM. * Dynamic supply chain and compliance data: Access real-time logistics, component availability, and manufacturer environmental/compliance documentation directly from EDM Web and component detail views. * Unified parasolid 3D content: Central libraries automatically convert legacy PADS Pro 3D models to Siemens Parasolid format upon opening, standardizing 3D mechanical fidelity across Xpedition Standard and Advanced. * Cell editor and footprint expert upgrades: Directly modify or create padstacks and switch design units without closing the Cell Editor, alongside expanded padstack geometries (such as chamfered square through-holes) via Footprint Expert. PCB layout: Massive plane acceleration and MCAD co-design. Xpedition Layout 2610 delivers significant performance breakthroughs for today's most complex, power-dense boards: * Up to 10X faster plane generation: Layout operations on dense designs featuring thousands of overlapping power rail shapes are dramatically accelerated - plane generation is up to 10x faster, board load times improve by up to 1.8x, and physical reuse updates run up to 2.3x faster. Interactive plowing and via insertion through power planes are noticeably smoother. * Enhanced MCAD / ECAD baseline collaboration: Smarter IDX file and UID tracking ensures seamless baseline comparisons when collaborating with Siemens Designcenter, dramatically speeding up mechanical exchange on large designs with nested reuse blocks. * Logical-to-physical block mapping: A single logical-only managed block in schematic can now be mapped to multiple distinct physical reuse circuit layouts, letting teams fit identical circuit functionality into different mechanical board form factors. * Streamlined creepage checking: Improved batch creepage analysis allows engineers to review, accept, and audit clearance violations with timestamps and user comments directly inside Hazard Explorer. Design verification: Optimized integration of verification into workflows. Shift-left verification ensures designs are right the first time by bringing physics-validated and manufacturability checks directly into the design cockpit: * Modernized, AI-driven DFM verification: Valor NPI introduces a revamped verification workspace with AI-driven assistance, customizable layouts, and direct EDM integration to execute DFM analysis and review results within Hazard Explorer with complete revision control. * EDM-managed schematic analysis: Run HyperLynx Schematic Analysis within EDM-managed workflows. Trace violations across design revisions and investigate findings faster through severity-based grouping (critical, defect, warning) and direct cross-probing back into Designer. * Design-level DC Drop analysis in EDM: Integrate power integrity directly into the flow - EDM integration enables review of simulation status and pass/fail results. Whether you are designing advanced multi-board systems, managing enterprise component libraries, or pushing the limits of high-speed layout and verification, Xpedition 2610 gives engineering teams the speed, agility, and trusted outcomes required for first-pass success.

Xpedition EDM integration. With the new 2610 release, Valor NPI has become part of a broader Xpedition engineering data management (EDM) verification suite, alongside several HyperLynx products, including design rule checking (DRC), schematic analysis, signal integrity and power integrity. By bringing design revisions, verification results, reports, and related metadata together in a managed and traceable environment, EDM creates a richer foundation for AI-assisted analysis. AI capabilities can use this connected engineering context to help uncover patterns, summarize results, and identify opportunities to improve verification and manufacturing workflows. Xpedition EDM now allows Valor users to launch manufacturing verification against a specific PCB revision while managing the resulting Valor NPI data through a check-in, check-out and approval processes. Synchronization with Xpedition Layout helps teams work from the latest design, while tying each verification to a specific design revision. Valor 2610 organizes DFM results alongside broader board information and other verification checks, like DRC. Each check-in will capture the rules and factors used, pass/fail counts, failure details and feedback from multiple reviewers. MRA summaries will provide access to the verification history, including run dates, job size, ownership, approval and release status, and the corresponding PCB revision. This gives teams the context to understand findings and track how manufacturing readiness changes as the design develops. Teams can perform verification concurrently within a shared design or independently against the same revision, then rerun analysis using the updated PCB as needed. The workflow supports standalone access through EDM Cockpit, as well as direct access from Xpedition Layout through an integrated Xpedition DFM workflow. This accumulated manufacturing knowledge supports AI analysis and deeper metadata mining. Connecting design properties, verification settings, results and reviewer feedback across revisions helps teams identify recurring issues and understand how design decisions affect manufacturing outcomes. These insights help teams refine DFM practices and improve manufacturability earlier in development. Embedded IPC standards compliance. Valor NPI 2610 introduces design for standards compliance (DFSC) embedded within all versions Valor NPI and available at no cost. This version of the traditional IPC Class 1, Class 2 and Class 3 standards have been generated by the Global Electronics Association (GEA) and shared exclusively within Valor NPI. Design for Standards Compliance (DFSC) checks PCB designs against applicable industry standards. DFSC supplements traditional DFM analysis, helping teams evaluate industry compliance alongside their existing manufacturing checks. The deployment includes nine advanced IPC profiles developed jointly by Siemens EDA and the Global Electronics Association (GEA), with planned updates happening twice yearly. This strategic partnership brings together two complementary areas of expertise. GEA contributes its knowledge of IPC standards and global manufacturing capabilities, while Siemens provides the manufacturing verification technology to apply that knowledge directly to PCB designs. For users, this turns complex manufacturing requirements into repeatable checks within their existing design workflow. The nine profiles cover every combination of IPC performance Class 1, 2 and 3 and producibility Level A, B and C. These describe two different aspects of a design: the performance expected of the finished product and the manufacturing capabilities needed to produce it. Performance classes will already be familiar to many designers. Class 1 covers general electronic products where the primary requirement is that the finished product functions. Class 2 covers products requiring continued performance and extended service life, where uninterrupted operation is desirable but not critical. Class 3 covers products where continued performance or operation on demand is critical, downtime is unacceptable, and the product must function when required. Producibility levels describe how widely the capabilities needed to manufacture a design are available across the global PCB supply chain: Selecting a level helps teams understand how their design decisions affect manufacturing options. Moving toward Level C can accommodate more demanding technologies and geometries, but it also makes supplier capability more important. Performance class and producibility level remain separate choices: specifying a Class 3 product does not automatically mean it requires Level C manufacturing. Each profile uses pass/fail criteria for the requirements it evaluates. These results indicate whether a design meets the selected profile's thresholds; they are not severity rankings. Used alongside traditional DFM analysis, they give teams a consistent basis for reviewing standards compliance while continuing to address supplier-specific constraints and other manufacturing risks. Developed for use with Valor NPI, the advanced profiles build on the basic profiles previously offered through PCBflow. They expand coverage to include HDI and microvias, flex and rigid-flex, RF, high layer counts, and heavy copper. The profiles draw on the IPC-2220 and IPC-6010 series, IPC J-STD-001, IPC-4101, IPC-2152, IPC-2141, IPC-4562, IPC-7351, and IPC-4202, IPC-4203 and IPC-4204, along with related standards. GEA also researched global PCB suppliers to establish copper feature-size and clearance values that account for copper weight and thickness. This combines standards requirements with practical manufacturing capability data. The profiles are reviewed twice a year for updates and revisions. The profiles provide an implementation of applicable IPC requirements for automated checking, while the underlying standards remain essential technical references. Although the check values are present in the profiles, the standards provide the fuller explanations, application guidance and engineering context needed to interpret them. Users can learn more about the advanced IPC profiles on GEA's website and purchase the supporting IPC standards through the GEA store. Improved component intelligence. The Valor Parts Library supplies component intelligence to Valor NPI and is the vital connection between BOM engineering data and manufacturing verification workflows. Its 2610 updates complement the Valor NPI application changes by improving how this component information is protected, located and made available to users. Security, reliability, simplicity. Significant infrastructure changes have been made to the VPL to ensure more robust data integrity across the entire component exchange process, while simplifying authentication and access. Part data now has more robust encryption during system-to-system communication with each application. Along with this, the VPL Content Server now supports LDAP-based authentication, allowing users to authenticate use using their existing enterprise credential. This connects each users VLM roles directly to their enterprise identity infrastructure. Valor Parts Library 2610 includes automatic recovery capabilities, creating more stable deployment environment. Simplifying Part Discovery with manufacturing part number (MPN) only search. By removing the vendor-name requirement from part searches, VPL makes component discovery more flexible and better aligned with how users often receive part information. This helps with whole-flow connectivity and improves matching when component data is incomplete or inconsistent. New and improved DFM checks. Pass/fail constraints organized by manufacturing intent. DFM profiles express the requirements used to evaluate a design. Pass/fail constraints determine whether particular conditions meet those requirements, while manufacturing factors help determine which constraints apply. Valor NPI 2610 organizes pass/fail constraints into general groups based on shared constraint factors. General constraints are divided into relevant areas, including etch, mechanical, quality, solder, process setup and component placement. Manufacturing requirements that adapt to board size. [Video - WhatsNew_2610_ValorNPI_New_Factor_Board_Size] Valor NPI 2610 adds board dimensions to the list of factors within the ADM. Represented as two values; board width and board length, this allows analysis to automatically adapt to product size, allowing for more intelligent rule selection. Longer and wider boards are more susceptible to warping and as such, will need more fiducials, or increased fiducial spacing along the board dimensions to ensure consistent alignment for component placement. In addition, larger boards also require extra tooling holes to provide sufficient support and reduce board flex during assembly. Expanded support for complex trench-via configurations. Valor NPI continues to extend it's DFM coverage to support emerging PCB design techniques. One of the emerging manufacturing technologies increasingly entering HDI designs are trench vias. Trench vias appear exclusively within rigid HDI PCBs and are created on blind or buried drill layers. Trenches are continuous laser-etched lines cut through the dielectric and then electroplated, forming uniform, elongated electrical connection between board layers. Traditionally, via trenches Siemens AG designated as simple point-to-point lines. Any overlapping paths were classified as illegal linear trenches. Valor NPI 2610 now supports multiple termination points from a single starting point, allowing for three and four termination microvia trench configurations.

Siemens partners with NVIDIA to advance AI-driven, autonomous factories. 26 October 2026 Siemens has unveiled a new suite of industrial AI solutions at its Electronics Factory in Erlangen, Germany, marking a major milestone in its strategic partnership with NVIDIA. Developed in under ten months following their January 2026 announcement at CES, the applications combine NVIDIA's AI, simulation, and accelerated computing technologies with Siemens' industrial automation portfolio to advance autonomous, self-optimizing manufacturing. Operating as a living lab and global demonstration hub, the 1,000-employee Erlangen site produces power electronics and drives for industrial automation while running over 100 active AI algorithms across its operations. The latest deployment forms part of Siemens' €500 million investment to transform the facility by 2030. Virtual production preparation and ai-driven inspection. For printed circuit board (PCB) assemblies - the core components produced at Erlangen - the joint team introduced a fully virtual production ramp-up process that eliminates traditional bottlenecks: * 85% Engineering Reduction: Virtual production preparation cuts engineering effort by up to 85% and speeds up time-to-market by up to 40%. * Synthetic Vision Training: Rather than waiting weeks for physical prototypes to configure quality inspection equipment, NVIDIA Cosmos world models generate photorealistic representations from digital twins to train inspection systems virtually before physical hardware exists. Agent-Based production planning and dynamic simulation. Siemens and NVIDIA have deployed AI agents to replace manual experience-based scheduling, managing complex variables across capacity, material availability, line constraints, and delivery deadlines: * Automated Scenario Generation: When new orders arrive or supply disruptions occur, AI agents automatically generate multiple production scenarios and quantify their impacts against defined KPIs. * Digital Twin Validation: Proposed schedules are validated within a real-time Digital Twin of the entire factory built using NVIDIA Omniverse and NVIDIA Factory Operations Blueprint technologies. * 20% Cost Reduction: End-to-end agent-based planning delivers cost savings of up to 20% while enabling rapid adaptation to supply chain shifts or urgent customer requirements. "The historic opportunity for Germany and Europe lies in bringing artificial intelligence out of the data centers and into the factories - and applying it on an industrial scale." - Cedrik Neike, Member of the Managing Board of Siemens AG and President Digital Industries "At Erlangen, Siemens and NVIDIA are putting years of collaboration to work on the factory floor... Together, we're building a blueprint for autonomous factories everywhere." - Rev Lebaredian, Vice President, Physical AI Simulation at NVIDIA Connect with industry leaders at Globuc's Go Digital Energy Summit. Interested in how digital twins, industrial AI agents, and autonomous manufacturing are reshaping high-tech industrial operations? Explore executive insights, automation showcases, and digital transformation strategies at Globuc's Go Digital Energy Summit. Relevant industry events.