Q

Qualcomm

Designs mobile chips and licenses wireless patents

Build and Integration - B&I, Staff Engineer, Customer Engineering Team, Software Applications Engineering

Full-Time
No salary listed
Expert
Bachelor's, Master's, PhD
Bengaluru, Karnataka, India
Hybrid
DevOps & InfrastructureDevOps Engineering

About the job

Requirements
  • A B.E./B.Tech in Engineering, Computer Science, Electronics, or a related field with 8+ years of Software Applications Engineering, Embedded Systems, or related experience; or an M.Tech/M.S. in a relevant field with 6+ years of experience; or a Ph.D. in a relevant field with 4+ years of experience.
  • At least 5 years of hands-on experience in build, integration, and release engineering for large-scale software products.
  • Strong expertise in CI/CD pipeline design, implementation, and optimization.
  • Hands-on experience with build automation systems such as Make, CMake, Bazel, Ninja, or Gradle.
  • Proficiency in Python and Shell/Bash scripting for build and automation workflows.
  • Strong expertise in source control management and branching strategies, including GitFlow and Trunk-Based Development.
  • Experience with artifact repository management and release artifact governance.
  • Experience with Linux/Unix build environments and containerized build infrastructure.
  • At least 3 years of customer-facing or cross-functional technical support experience.
  • Strong written and verbal communication skills, including the ability to document root-cause analyses and communicate technical findings to cross-functional teams.
  • A bachelor's degree in Engineering, Information Systems, Computer Science, or a related field and 4+ years of Software Applications Engineering, Software Development, or related work experience; or a master's degree in those fields and 3+ years of such experience; or a Ph.D. in those fields and 2+ years of such experience.
  • At least 2 years of experience with a programming language such as C, C++, Java, or Python.
  • At least 1 year of experience with debugging techniques.
Responsibilities
  • Own and manage end-to-end build, integration, and release activities for complex Snapdragon Automotive software products spanning multiple operating system platforms.
  • Design, implement, and maintain scalable and reliable build infrastructures and CI/CD pipelines tailored for embedded and high-level operating system automotive software stacks.
  • Drive continuous improvement of build systems, toolchains, automation frameworks, and release processes across program milestones.
  • Establish release governance, versioning, branching, tagging, and artifact management strategies for multi-operating-system automotive software deliveries.
  • Monitor build health, integration quality, and release readiness across multiple product streams and chipset generations.
  • Collaborate with development, quality engineering, and platform teams to ensure successful integration and deployment.
  • Identify bottlenecks and implement measures to improve build performance, reliability, and delivery efficiency.
  • Define and maintain build and release key performance indicators, dashboards, and operational metrics to track program health.
  • Ensure compliance with software development standards, security policies, and release governance processes.
  • Lead investigations and root-cause analysis for build failures, integration issues, and release blockers.
  • Serve as the primary escalation point for build and integration-related issues across the Customer Engineering team.
  • Provide timely triage, troubleshooting, and resolution support for development, integration, and release issues.
  • Analyze build logs, compiler errors, dependency conflicts, toolchain issues, and deployment failures.
  • Drive root-cause analysis and corrective actions for recurring engineering issues; own Change Requests end-to-end from triage through patch validation.
  • Partner with product, platform, and infrastructure teams to resolve cross-functional technical challenges.
  • Develop self-service tools, documentation, and best practices to improve engineering productivity across the BDC Customer Engineering team.
  • Track and manage technical debt associated with build environments, toolchains, and integration workflows.
  • Serve as a key technical interface for build and integration queries from automotive original equipment manufacturer and Tier-1 customers across regions.
  • Support Automotive RFI assessments for build-and-integration-related non-recurring engineering scoping, communicating technical complexity and resource requirements.
  • Engage with customers during bring-up, pre-commercial-sample, and post-commercial-sample phases to proactively identify and mitigate build and integration risks.
  • Provide on-site customer support as required during critical program milestones.
  • Collaborate with North America, Europe, and India Customer Engineering teams to ensure global follow-the-sun build and integration support.
  • Drive development and validation of build and release automation frameworks for multi-operating-system automotive software platforms.
  • Design and maintain automated build health monitors, integration quality dashboards, and triage tooling to reduce mean time to resolution.
  • Partner with platform and Automated Platform Test teams to define and integrate build qualification checks across CI/CD pipelines.
  • Create and maintain build guides, integration runbooks, and reusable diagnostic artifacts for build and release issues across platforms.
  • Track and analyze build and integration trends across program stages (Bring-up, ES, L0–L4, FC, and CS) and communicate risk to program and customer teams.
  • Contribute to secure software supply chain and DevSecOps practices within the automotive software delivery pipeline.
  • Serve as the build-and-integration subject matter expert for the BDC Customer Engineering team, providing architectural guidance on build system design, integration strategy, and release engineering.
  • Lead cross-functional build-and-integration reviews with development, quality assurance, DevOps, and Customer Engineering teams; drive root-cause analysis delivery to enable process improvements.
  • Mentor junior- and mid-level engineers on build system concepts, CI/CD best practices, scripting, and customer engagement.
  • Influence feature design and architecture decisions to proactively prevent build and integration failures in future Snapdragon Automotive software programs.
  • Scale technical knowledge through reusable documentation, training materials, and knowledge-base contributions.
Desired Qualifications
  • Staff-level experience owning build and integration engineering for production automotive programs (IVI, ADAS, or FLEX) from bring-up through start of production.
  • Experience with multi-operating-system build environments spanning Linux, Android, QNX (HQX), and HGY (Gunyah Hypervisor).
  • Familiarity with Qualcomm Snapdragon Automotive chipsets across Gen3, Gen4, Gen4.5, and Gen5 software delivery pipelines.
  • Experience with DevSecOps practices and secure software supply chain management.
  • Knowledge of containerization with Docker and cloud-native build pipelines for embedded software.
  • Familiarity with ASPICE process compliance, ASIL functional safety considerations, and automotive program delivery cycles.
  • Experience with AutoRFI processes, non-recurring engineering scoping, and Chipset Development activities within Customer Engineering programs.
  • Knowledge of build and release key performance indicator frameworks, dashboards, and workload-based productivity trend analysis.
  • Proven experience collaborating with global automotive original equipment manufacturer and Tier-1 customers on build, integration, and release escalations.

About the company

Qualcomm designs the Snapdragon processors and modems inside many Android phones, and it licenses its wireless patents to device makers around the world. It helped commercialize CDMA, the cellular technology behind 3G networks, and its patents cover core parts of the 4G and 5G standards that phones use to connect. The company does not run its own chip factories; contract foundries make its chips, which it sells to makers of phones, PCs, cars, and connected devices. Device makers also pay Qualcomm royalties for using its patented technology, which forms a second business alongside chip sales. Qualcomm was founded in 1985 and is based in San Diego, California.

Company Size

10,001+

Company Stage

IPO

Headquarters

San Diego, California

Founded

1985

Get referred to Qualcomm

See people who can refer or advise you

Simplify Jobs

Simplify's Take

What believers are saying

  • Cars are a second engine: automotive chip revenue rose 61% to $1.59 billion in the June 2026 quarter.
  • Pays for learning: Qualcomm funds tuition assistance and apprenticeships and sells staff discounted shares through a stock purchase plan.
  • Profits support stability: Qualcomm earned $2.21 non-GAAP per share in the June 2026 quarter despite a 4% sales dip.

What critics are saying

  • Apple is walking away: Qualcomm expects Apple revenue to fall about 50% from the September to December 2026 quarter.
  • Data-center deals start thin: in July 2026, management said custom chips will cut chip gross margin 1.5 to 2 points.
  • Cuts keep trickling: Qualcomm filed WARN notices in April 2026 covering 144 layoffs, including 68 in San Diego.

What makes Qualcomm unique

  • Phones are only part of it: handsets were $5.09 billion of $8.50 billion chip revenue in fiscal Q3 2026.
  • Cloud giants buy its custom chips: two hyperscaler design wins start producing revenue in the December 2026 quarter.
  • It owns an AI software layer: Qualcomm completed its Modular acquisition in July 2026 for open generative AI software.

Help us improve and share your feedback! Did you find this helpful?

Benefits

  • Premium-free health coverage
  • Onsite health & fitness centers
  • Retirement programs
  • Disability & life insurance programs
  • Tuition reimbursement
  • Product discounts
  • Flexible time off
  • Parental leave

Growth & Insights and Company News

Headcount

6 month growth

3%

1 year growth

1%

2 year growth

0%
CNBC
Oct 21st, 2026
Tokenized stock trading surges overseas to $11.31B on Robinhood Chain as Goldman, Microsoft object in US

Tokenized stock trading is growing overseas while major US companies resist it at home, according to Bitwise Asset Management's latest quarterly report. On Robinhood Chain, tokenized stock volume rose from $526 million in July to $2.21 billion in August, then to $11.31 billion in September. Tokenized equities were also the fastest-growing category on Solana. Goldman Sachs, Microsoft, Qualcomm, Caterpillar, McDonald's, Western Digital, and Alphabet have objected to tokenized versions of their shares trading on OKXICE, a venue launched by crypto exchange OKX and Intercontinental Exchange. Sixteen companies have now objected. The US Securities and Exchange Commission's innovation exemption lets companies opt out. OKXICE co-chairman Andrew Cuomo said many companies would "wait and see" before taking part.

SammyFans
Oct 21st, 2026
Qualcomm buys RISC-V startup Akeana, a Samsung foundry partner, to boost AI chip push

Qualcomm has acquired Akeana, a US semiconductor startup that designs processors using the open-source RISC-V architecture. The deal will help Qualcomm expand in AI and data centres. Financial terms were not disclosed. Akeana's founder and chief executive officer, Rabin Sugumar, confirmed the news on LinkedIn. Its team will join Qualcomm, and Sugumar becomes vice president of engineering. Founded in 2021 by former Marvell server chip engineers, Akeana raised more than $100 million in August 2024 from investors including Kleiner Perkins, Mayfield, and Fidelity. It also worked with Samsung Foundry on server chips built on a 4-nanometre process. In December 2025, they completed the design of a test chip called Alpine.

CNBC
Oct 20th, 2026
Qualcomm to cut jobs globally in performance-focused layoffs, with notices starting in November

Qualcomm will cut jobs worldwide in a "performance-focused reduction" after its annual employee reviews, chief executive officer Cristiano Amon told staff in a Monday memo seen by Reuters. Notifications begin in November. Amon said the cuts aim to build "a stronger performance culture" and address cases where the company "has consistently fallen short of expectations." The memo did not say how many jobs would go. Qualcomm had about 52,000 employees as of September last year. The smartphone chipmaker has been hit this year by weak consumer electronics sales, as rising memory prices dampen demand. Its shares have gained 1.5% in 2026. Qualcomm expects most chip sales in fiscal 2027 to come from non-smartphone businesses, including AI data centres.

CEO North America
Oct 20th, 2026
Qualcomm CEO announces global job cuts.

Qualcomm CEO announces global job cuts. According to CEO Cristiano Amon, Qualcomm will cut jobs worldwide in a "performance-focused reduction" after its annual employee reviews. The CEO did not say how many jobs would be affected. Amon told staff in a memo that notifications would begin in November, with the cuts being part of an effort to build "a stronger performance culture" and to address situations where the company "has consistently fallen short of expectations." "As we have expanded the business, so have the competencies and skills we require," he wrote. "We must have the right people in the right roles so they can perform at their best and the company can continue to succeed." The cuts come as Qualcomm faces a slump in consumer electronics sales, with soaring memory prices dampening demand in key markets. In its latest earnings report, the company lowered its forecast. It also said growth in data-center and other non-handset businesses would more than offset the lost revenue by fiscal 2027. The company expects most of its chip sales to come from non-smartphone businesses in fiscal 2027. Qualcomm currently has 52,000 employees globally. The tech giant's stock was down about 1% in premarket trading on Tuesday after the release of the memo. By CEO NA Editorial Staff

Helpful Info For You
Oct 16th, 2026
Qualcomm and Amazon collaborate on next-gen AI data center tech.

Qualcomm and Amazon collaborate on next-gen AI data center tech. Discover more Try New Games Table of Contents Discover more video games Try AR Glasses Introduction. Qualcomm and Amazon have teamed up in a partnership that's catching a lot of attention in the tech world. This collaboration is all about creating new technology to help artificial intelligence (AI) run faster and smarter in data centers. It's a big deal because AI is becoming a huge part of how companies operate, and making AI work better means faster decisions, smarter services, and new possibilities. The news about this collaboration comes from a recent Qualcomm announcement, showing how these two giants are joining forces to shape the future of AI data centers. Multi-Generation collaboration. When Helpful Info For You talk about a multi-generational partnership, Helpful Info For You mean a teamwork that spans years, even decades. Qualcomm and Amazon are committing to work together over many years, developing new AI hardware continuously. This isn't a one-time deal; it's a steady, step-by-step journey to improve technology. Think of it like building a skyscraper - they're laying the foundation now and planning to add more floors as technology evolves. The goal is to create AI hardware that fits perfectly with Amazon's data centers, making sure the AI systems keep getting better and better through each generation. Customized silicon solutions. You might wonder, what are customized silicon chips? Simply put, they are special computer parts designed just for Amazon's needs. Unlike regular chips you find in your laptop or phone, these silicon chips are made to supercharge AI tasks inside Amazon's data centers. By tailoring the chips specifically for Amazon's AI, Qualcomm helps ensure everything runs smoothly, faster, and more efficiently. This is important because AI requires a lot of power to process huge amounts of data. Customized chips mean less wasted energy and better performance on tough AI challenges that regular chips might struggle with. Advanced optical connectivity and AI infrastructure. Another key part of this partnership is advanced optical connectivity. This sounds technical, but it's basically about making super-fast, high-quality connections inside data centers. Imagine data centers as busy highways for information - optical connectivity builds smoother, faster roads so data can travel with minimal delay. Fast connections help AI systems get the information they need quickly, which is vital for all kinds of AI projects, from voice assistants to image recognition. Improving these connections means Amazon's AI infrastructure becomes more reliable and capable of handling even bigger AI workloads without running into bottlenecks. Conclusion. In summary, the partnership between Qualcomm and Amazon is a powerful step forward for AI technology. They're working together over many years, building custom silicon chips and improving the way data moves inside Amazon's data centers. This teamwork not only boosts how AI performs today but also lays the groundwork for future advancements that could transform how AI services operate. As AI continues to grow in importance, collaborations like this one are shaping the next generation of technology, making AI faster, smarter, and more efficient than ever before. The future of AI data centers is looking brighter, with Qualcomm and Amazon leading the way. Learn AI Tools Discover more Preorder Games Last updated on October 16, 2026