Packaging Engineer

Summary

Looking for a senior level IC packaging engineer to develop exciting new products. You will be responsible providing Custom Silicon packaging solutions in a module/system for various consumer markets.

Minimum Qualifications

BS and 10+ years of relevant industry experience.

Preferred Qualifications

M.S or Ph.D. degree in mechanical engineering, physics, materials science or similar disciplines with a minimum of 10 years of experience in IC packaging. AutoCAD, APD and multi-physics simulation knowledge is a plus. Industry experience and work on WLP either in IDM or Fabless companies. Knowledge and hands-on experience on Wafer Bumping and Dielectric materials and their pros/cons is a must. Some hands-on knowledge in Manufacturing assembly processes; such as wafer back-grind, wafer dicing, Flip Chip die attach, encapsulation/molding, under-fill, ball attach, package singulation and Tape & Reel. In-depth knowledge in Wafer Level Chip Scale Packaging (RDL/Wafer Bumping & BEOL Assembly processes for Fan-In & Fan-Out designs). Good knowledge on Package Qualification and Reliability testing. Expert level knowledge of common reliability failure modes. Able to understand device physics and component/board level reliability testing. Proven track record to bring a product/package from conceptual stage to development and to HVM environment. Ability to construct Designs of Experiments and down-select materials and processes. Good written and verbal communication skills. Able to present ideas, design concepts, data and plan with high confidence at team meetings and executive review meetings. Able to perform independent research and development work with minimal supervision.

Description

• In this fast-paced environment, your role is to interface between internal product/device design, quality, supply chain, and the external suppliers to develop and deploy new packaging technologies. • Must be a good negotiator and influencer to drive industry to meet company needs. • We are looking for individuals who are very innovative with a proven track record to reduce package development cycle and qualify devices into a high-volume manufacturing environment.

Responsibilities

Define new package characteristics based on unique module and system level performance, cost, and footprint requirements. Define package/packaging specifications. Work with external suppliers on package design, new material, new equipment selection and process flow development. Perform initial proof of concept sample build, POR establishment, package and process qualification, reliability test, yield analysis and enhancement. Coordinate with other packaging and cross-functional team members to comply with product development/ramp schedule. Deliver package/packaging milestones on time. Define packaging roadmap based on long term packaged product requirements. Work closely and Manage suppliers’ R&D activities.