Q

Qualcomm

Designs mobile chips and licenses wireless patents

Physical Design Engineer Senior Staff

Silicon & ASIC DesignConfirmed live in the last 24 hours
Full-timeHod Hasharon, IsraelNo salary listedIn-person

About the Job

Requirements

  • A Bachelor's degree in Science, Engineering, or a related field and 6 or more years of ASIC design, verification, validation, integration, or related work experience; or a Master's degree in Science, Engineering, or a related field and 5 or more years of that experience; or a PhD in Science, Engineering, or a related field and 4 or more years of that experience.
  • 10 or more years of experience in digital physical design with a proven track record of tapeouts on FinFET nodes N7 and below.
  • Deep expertise in full-chip and block-level floorplanning, clock architecture, static timing analysis, place and route, and physical sign-off.
  • Expert proficiency with Synopsys ICC2/Fusion, Cadence Innovus, Calibre, PrimeTime, RedHawk or Voltus, and StarRC or Quantus.
  • Advanced Python and TCL scripting, including the ability to architect large-scale physical design automation frameworks and flow infrastructure.
  • Proven experience designing, implementing, and owning end-to-end backend design flows at team or organization level.
  • Demonstrated experience or vision applying Agentic AI methodologies to EDA challenges, including autonomous agents, AI-driven optimization, and LLM-assisted debugging.
  • Strong communication skills to present methodology decisions, risk assessments, and tapeout readiness to senior management.
  • Experience with power optimization, including DVFS, multi-Vt, power domains, and UPF/CPF.

Responsibilities

  • Architect and own full-chip physical design strategy, including floorplanning, power delivery network, clock architecture, place and route, and timing closure.
  • Define and drive backend methodology standards across the team for advanced-node tapeouts at N5, N4P, and N3.
  • Lead critical timing closure efforts, including MCMM, OCV, advanced ECO strategies, and cross-corner sign-off.
  • Oversee and guide signal integrity, power integrity, EM/IR, and reliability analysis for full-chip designs.
  • Architect and lead development of scalable physical design flow infrastructure using Python and TCL, including automated regression, sign-off reporting, and run management systems.
  • Champion Agentic AI adoption in the design flow by defining use cases, evaluating tools, and prototyping autonomous agents for floorplan exploration, timing closure, and ECO automation.
  • Lead cross-functional design reviews with DFT, verification, analog, and process engineering teams.
  • Interface with TSMC, EDA vendors including Synopsys, Cadence, and Siemens, and internal research teams to evaluate and adopt new methodologies.
  • Mentor and technically guide junior and mid-level physical design engineers across the organization.

Desired Qualifications

  • Experience with chiplets, 2.5D/3D IC physical design, or advanced packaging technologies.
  • Familiarity with AI/ML-driven EDA tool evaluation and vendor collaboration.
  • Prior experience in a tech lead or staff engineering leadership role.

About the Company

Qualcomm

Designs mobile chips and licenses wireless patents

Qualcomm designs the Snapdragon processors and modems inside many Android phones, and it licenses its wireless patents to device makers around the world. It helped commercialize CDMA, the cellular technology behind 3G networks, and its patents cover core parts of the 4G and 5G standards that phones use to connect. The company does not run its own chip factories; contract foundries make its chips, which it sells to makers of phones, PCs, cars, and connected devices. Device makers also pay Qualcomm royalties for using its patented technology, which forms a second business alongside chip sales. Qualcomm was founded in 1985 and is based in San Diego, California.

Company size
10,001+
Company stage
IPO
Headquarters
San Diego, CA
Founded
1985

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