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Kandou AI

Provides chip-to-chip AI connectivity solutions

Customer Platform, SDK & Interoperability Architect

Software EngineeringConfirmed live in the last 24 hours
Full-timeHyderabad, Telangana, IndiaNo salary listedHybrid

About the Job

Requirements

  • At least 10 years of platform, embedded, or systems software experience, including architecture or technical leadership on shipping products.
  • Device-adjacent software experience on networking silicon, AEC/AOC, optical modules, retimers, storage, or comparable high-speed hardware.
  • Strong API and SDK architecture skills, with hands-on C and/or C++ and Python development.
  • Experience designing adaptation, plugin, or hook-based architectures that isolate customer-specific logic behind stable interfaces.
  • Customer or OEM integration experience across NICs, switch platforms, BMCs, drivers, or management software.
  • Experience with semantic versioning, backward compatibility, release governance, and technical documentation for external developers.
  • Working knowledge of hardware management and sideband interfaces such as I2C/SMBus, MCTP, or similar protocols.
  • Excellent customer communication, technical decision-making, and cross-functional leadership skills.
  • A BS in Electrical Engineering, Computer Engineering, or Computer Science, or equivalent experience.

Responsibilities

  • Architect the customer-facing software platform for Randa, including the adaptation layer, SDK, diagnostic tools, telemetry interfaces, and reference integrations.
  • Define stable APIs, extension points, and versioning contracts that support customer-specific requirements without forking the core platform.
  • Own C and Python management libraries, command-line tools, log-analysis utilities, integration examples, and developer documentation.
  • Lead interoperability and qualification across NIC, switch-ASIC, and host-BMC platforms; maintain the test matrix, known-failure catalog, and regression strategy.
  • Represent Kandou software in customer technical discussions and escalations, converting field requirements into governed, reusable platform capabilities.
  • Partner with firmware, platform validation, product management, and field engineering to deliver secure, backward-compatible, and supportable customer releases.

Desired Qualifications

  • Experience with CMIS, OSFP MSA, SFF conventions, or pluggable-module management software.
  • Hyperscaler or tier-one OEM qualification and field-issue triage experience.
  • Experience with REST, gRPC, Go or Rust bindings, and schema-driven API development.
  • Experience with telemetry pipelines, diagnostic analytics, and privacy-aware customer data handling.
  • Experience with hardware-in-loop lab automation, host emulation, and automated interoperability testing.
  • Experience with secure software supply chain, artifact signing, access isolation, and standards-group participation.

About the Company

Kandou AI

Provides chip-to-chip AI connectivity solutions

Kandou AI designs and sells semiconductor connectivity hardware for AI workloads. It provides a memory fabric and CXL controllers that link processors to memory, enabling scalable, energy-efficient AI inference and training clusters built from affordable hardware. Using Copper MIMO interconnect, it reduces energy per bit and supports features like offloading AI training collectives, switchless memory for in-memory databases, and field-repairable co-packaged optics for better cooling. By targeting the data-movement bottleneck between processors and memory and offering chiplet-based fabrics and IP licensing, Kandou AI aims to make scalable AI infrastructure more accessible to hyperscalers, data centers, and system integrators.

Company size
201-500
Company stage
Late Stage VC
Total funding
$504.7M
Headquarters
Lausanne, Switzerland
Founded
2011

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