Failure Analysis Engineer

onsemi is seeking a highly motivated senior Failure Analysis Engineer to join the Tempe Product Analysis Lab, one of our premier analytical laboratories supporting a broad portfolio of semiconductor technologies and products.

In this highly visible role, you will perform electrical failure analysis and lead physical failure analysis involving customer returns, qualification failures, reliability testing, design debug and technology development. You will work alongside a team of talented engineers dedicated to delivering best-in-class analytical services and technical reports that drive product quality, reliability and customer success.

This position offers exceptional opportunities to expand your technical expertise, develop new analytical capabilities, and contribute to some of the company's most challenging and impactful investigations. Engineers in our lab enjoy access to advanced fault localization, physical analysis, and materials characterization capabilities while collaborating with product engineering, design, quality, reliability and manufacturing teams worldwide.

Why join Tempe PAL

Access industry-leading fault localization, physical analysis and materials characterization tools. 

Investigate one of the industry's most diverse semiconductor portfolios, including CMOS image sensors, automotive products, analog and mixed-signal ICs, digital devices, and Silicon Carbide (SiC) technologies.

Collaborate with highly experienced engineers and subject matter experts across a global network of Product Analysis Labs

Develop new analytical capabilities and influence future laboratory technologies and methodologies. 

Expand both technical and leadership expertise while supporting high-impact business-critical investigations.

Play a key role in improving product quality, reliability, and customer satisfaction across the company.

Bachelor's degree or higher in Electrical Engineering, Materials Science, Physics, or a related engineering discipline; Electrical Engineering preferred. 

5+ years of semiconductor failure analysis, product analysis, or advanced materials characterization experience required. 

Strong understanding of electrical characterization, fault localization, and semiconductor failure mechanisms.

Experience with one or more advanced failure analysis techniques such as PEM, OBIRCH, EOP, EOFM, Microprobing, Nanoprobing, EBIC, EBAC, scan diagnosis. 

Ability to handle and manipulate very small semiconductor samples during laboratory and chemical processing operations.

Strong analytical and problem-solving skills with the ability to independently lead complex technical investigations. 

Excellent written and verbal communication skills with the ability to clearly communicate technical findings to both technical and non-technical audiences. 

Ability to prepare concise, high-quality technical reports and presentations. 

Ability to manage multiple investigations simultaneously while maintaining high-quality results and meeting customer expectations.

Demonstrated ability to work effectively in a collaborative, team-oriented environment. 

Experience mentoring, coaching, or providing technical leadership to other engineers is highly desirable. 

Perform electrical and lead physical failure analysis investigations on customer returns and internally generated failures arising from qualification, reliability, design debug, manufacturing, and technology development activities.

Develop comprehensive analysis strategies using background information such as electrical test results, ATE data, reliability information, imaging results, application knowledge, and design data. 

Characterize the failure modes using semiconductor parameter analyzers, oscilloscopes, logic analyzers, function generators, application boards, automated test equipment and other advanced laboratory instrumentation.

Utilize fault localization techniques such as Photon Emission Microscopy (PEM), Optical Beam Induced Resistance CHange (OBIRCH), Electro-Optical Frequency Mapping (EOFM), Electro-Optical Probing (EOP), microprobing, nanoprobing, scan diagnosis, and related methodologies to localize failure sites. 

Direct and interpret physical and materials characterization activities utilizing SEM, FIB, TEM, EDS, FTIR, X-ray, CT imaging, and advanced sample preparation techniques. 

Correlate electrical characterization, fault localization, physical analysis and materials characterization results to determine root cause and clearly identify failure mechanisms. 

Prepare clear, concise, and data-driven technical reports that effectively communicate analytical findings and support 8D problem-solving activities. 

Present analytical findings and recommendations to cross-functional engineering teams, management and customers as required. 

Develop and implement new analytical methodologies, workflows, and laboratory capabilities to address emerging technologies and increasingly complex failure mechanisms. 

Provide technical leadership, mentorship, and training to engineers and technicians while helping establish best-known analytical practices across the laboratory.