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Qualcomm

Designs mobile chips and licenses wireless patents

Senior Director - Engineering, Hardware Engineering

Engineering LeadershipPosted on Nov 13
Full-timeSan Diego, CA, USAIn-person

About the Job

Requirements

  • A bachelor's degree in Mechanical Engineering, Thermal Engineering, Hardware Engineering, or a closely related engineering discipline, or the education alternatives specified in the minimum qualifications.
  • Around 18 or more years of experience in server/data center hardware and rack-scale systems, including 10 or more years in engineering leadership and proven experience leading others.
  • At least 12 years of direct, hands-on industry experience designing server and rack-level hardware, including mechanical, electrical, and thermal integration, power distribution, cabling/interconnect, and full rack assembly.
  • Deep working knowledge of direct-to-chip/cold-plate liquid cooling, coolant distribution units, manifolds, blind-mate connectors, rear-door heat exchangers, and immersion, plus a clear perspective on high-density thermal, power, and rack trends.
  • Proven ownership of hardware operations, including new product introduction-to-volume ramp, quality, reliability, availability and serviceability, serviceability, sustaining engineering, and fleet-health practices for production systems.
  • A track record taking rack-scale systems from bring-up and integration through validation to at-scale deployment in data centers, anticipating fleet-level issues.
  • Extensive close working relationships with original design manufacturers and original equipment manufacturers across the server/rack ecosystem, including joint design, manufacturing readiness, bill of materials and supply alignment, and executive-level partner management.
  • Demonstrated ownership of a rack/platform roadmap or engineering function delivering products at scale with external manufacturing partners and major customers.
  • Executive communication, negotiation, and cross-organizational leadership to align engineering, operations, and business stakeholders on strategy and commitments.
  • A bachelor's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or a related field and 10 or more years of Hardware Engineering or related work experience; or a master's degree in one of those fields and 9 or more years of experience; or a PhD in one of those fields and 8 or more years of experience.

Responsibilities

  • Help lead, scope, design, and set the architecture and roadmap for rack-scale platforms across multiple generations, balancing performance, total cost of ownership, power, thermal considerations, memory, and serviceability.
  • Serve as the senior engineering counterpart to original design manufacturer and original equipment manufacturer partners and customers, shaping joint roadmaps, design partnerships, and deployment commitments.
  • Set the liquid-cooling and high-density power strategy, including direct-to-chip cooling, coolant distribution units, two-phase direct liquid cooling, immersion, and high-power busbars.
  • Ensure rack platforms progress from new product introduction through validation to reliable, high-volume field deployment; institute scalable operations, reliability, availability and serviceability, and fleet-health practices.
  • Engage in industry standards, including the Open Compute Project, and represent rack platform strategy with customers, partners, and executives.
  • Partner across silicon, software, networking, supply chain, operations, product, and finance to deliver a coherent, buildable, deployable platform strategy.
  • Help set forward-looking strategy for rack architecture design and thermal implementation across new areas, and help the organization design, test, and deploy across product lines, generations, and internal test racks.
  • Lead mechanical areas tied to rack design and deployment, interfacing with business units, engineering teams, and original design and equipment manufacturers on build, test, and scale-out.
  • Develop end-to-end cooling analysis and fluid mechanics processes and tools spanning facilities, point of delivery, rack, and system-on-chip.

Desired Qualifications

  • A master's degree is preferred.
  • Deep involvement in the Open Compute Project ecosystem, including ORV3/Open Rack Wide, rack and power working groups, and standards leadership.
  • Experience building or scaling a data center rack/platform business or function.
  • Experience with AI/accelerator or GPU rack infrastructure at hyperscale, and with sovereign-AI or neocloud deployments.
  • Familiarity with high-speed connectivity, SerDes, chiplets, PCIe and Ethernet fabrics, and confidential computing.

About the Company

Qualcomm

Designs mobile chips and licenses wireless patents

Qualcomm designs the Snapdragon processors and modems inside many Android phones, and it licenses its wireless patents to device makers around the world. It helped commercialize CDMA, the cellular technology behind 3G networks, and its patents cover core parts of the 4G and 5G standards that phones use to connect. The company does not run its own chip factories; contract foundries make its chips, which it sells to makers of phones, PCs, cars, and connected devices. Device makers also pay Qualcomm royalties for using its patented technology, which forms a second business alongside chip sales. Qualcomm was founded in 1985 and is based in San Diego, California.

Company size
10,001+
Company stage
IPO
Headquarters
San Diego, CA
Founded
1985

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