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Siemens is a global engineering and technology company focused on automation, digitalization, smart infrastructure, and mobility. Its products and solutions span industrial automation systems, electrical equipment, energy management, and digital services that help industries run more efficiently. The company’s core technology comes from its history of electrical generation and distribution, including the dynamo-electric principle, and it now sells hardware, software, and services that connect factories, buildings, grids, and transportation networks. Siemens differentiates itself through scale, a broad portfolio across the value chain, and a long track record of large-scale, multi-country projects in infrastructure and industry. Its goal is to enable smarter, more sustainable industrial processes and urban systems by integrating hardware, software, and digital services to improve productivity, energy efficiency, and mobility.
Company Size
10,001+
Company Stage
IPO
Headquarters
Munich, Germany
Founded
1847
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What's new in Xpedition 2610. The latest release of Siemens' flagship systems design platform, Xpedition, is here. Packed with enhancements across systems engineering, schematic capture, library and data management, PCB layout, and multi-domain verification, this release accelerates productivity, strengthens design-chain security, and deepens integration across the enterprise digital thread. Here is a closer look at what's new in Xpedition 2610. General portfolio enhancements. * Scalable portfolio: Siemens AG has been working on a scalable portfolio to serve the needs of engineering teams as their design, process and organizational complexities increase. With this release, Siemens AG introduce Xpedition Advanced, tuned to the needs of small enterprise companies. * Modernized UX: The user experience has been updated with an optimized application bar that aligns with Siemens design standards, freeing up critical toolbar space for faster command access on standard displays. * Fortified security: Under the hood, security is substantially fortified: all communications between design authoring tools, project management services, and concurrent multi-user workflows (including forward/backward annotation and packaging) are now fully encrypted in transit. This ensures sensitive engineering IP remains protected across the distributed design network while aligning with modern secure-by-design standards. Systems design: Model-based requirements and verification automation. Modern electronic systems demand tight traceability from high-level architecture down to physical implementation. Xpedition 2610 delivers powerful enhancements to requirements decomposition and multi-board engineering: * Automated batch verification & regression testing: Execute multiple or all verification tasks in batch mode, enabling seamless regression testing across complex design variants. * Digital verification records for complex simulations: Run entire simulation suites from a single verification task. Xpedition Model-Based Engineering (MBE) automatically generates traceable digital verification records mapped directly from requirement targets to individual nets. * Reusable technology verification templates: Build reusable requirement and verification templates for industry-standard protocols such as DDR4, PCIe, and SerDes to accelerate future project kick-offs. * Interactive HTML verification reporting: Review verification outcomes directly from MBE verification objects via rich, interactive HTML reports for faster triage and sign-off reviews. * Streamlined multi-board signal management: A redesigned Signal Manager user interface provides an intuitive mechanism for hardware engineers to validate cross-board connectivity, dramatically reducing false positives and preventing costly interconnect errors. Design capture: Orchestration, reusability, and constraint speed. Getting from concept to schematic sign-off is faster and more reliable with new automation and constraint management tools: * Setup wizard & environment orchestration: A semi-automated setup wizard accelerates designer onboarding and standardizes design environments across enterprise teams. * Responsive cross-probing: Improved cross-probing architecture eliminates freezing when selecting complex nets in Layout, giving engineers seamless bidirectional navigation between schematic and layout. * Intuitive constraint import: Easily search EDM projects by name or metadata properties to import constraints, or import known-good constraint rules from existing projects even without an EDM deployment. Library and design data management: Supply chain intelligence and faster component creation. Maintaining trusted component data and securing design assets is central to Xpedition's data management backbone: * Embedded PartQuest search: Direct integration of the PartQuest plug-in eliminates tab-switching and allows designers to search manufacturer parts using supplier facets and parametric filters natively inside EDM. * Dynamic supply chain and compliance data: Access real-time logistics, component availability, and manufacturer environmental/compliance documentation directly from EDM Web and component detail views. * Unified parasolid 3D content: Central libraries automatically convert legacy PADS Pro 3D models to Siemens Parasolid format upon opening, standardizing 3D mechanical fidelity across Xpedition Standard and Advanced. * Cell editor and footprint expert upgrades: Directly modify or create padstacks and switch design units without closing the Cell Editor, alongside expanded padstack geometries (such as chamfered square through-holes) via Footprint Expert. PCB layout: Massive plane acceleration and MCAD co-design. Xpedition Layout 2610 delivers significant performance breakthroughs for today's most complex, power-dense boards: * Up to 10X faster plane generation: Layout operations on dense designs featuring thousands of overlapping power rail shapes are dramatically accelerated - plane generation is up to 10x faster, board load times improve by up to 1.8x, and physical reuse updates run up to 2.3x faster. Interactive plowing and via insertion through power planes are noticeably smoother. * Enhanced MCAD / ECAD baseline collaboration: Smarter IDX file and UID tracking ensures seamless baseline comparisons when collaborating with Siemens Designcenter, dramatically speeding up mechanical exchange on large designs with nested reuse blocks. * Logical-to-physical block mapping: A single logical-only managed block in schematic can now be mapped to multiple distinct physical reuse circuit layouts, letting teams fit identical circuit functionality into different mechanical board form factors. * Streamlined creepage checking: Improved batch creepage analysis allows engineers to review, accept, and audit clearance violations with timestamps and user comments directly inside Hazard Explorer. Design verification: Optimized integration of verification into workflows. Shift-left verification ensures designs are right the first time by bringing physics-validated and manufacturability checks directly into the design cockpit: * Modernized, AI-driven DFM verification: Valor NPI introduces a revamped verification workspace with AI-driven assistance, customizable layouts, and direct EDM integration to execute DFM analysis and review results within Hazard Explorer with complete revision control. * EDM-managed schematic analysis: Run HyperLynx Schematic Analysis within EDM-managed workflows. Trace violations across design revisions and investigate findings faster through severity-based grouping (critical, defect, warning) and direct cross-probing back into Designer. * Design-level DC Drop analysis in EDM: Integrate power integrity directly into the flow - EDM integration enables review of simulation status and pass/fail results. Whether you are designing advanced multi-board systems, managing enterprise component libraries, or pushing the limits of high-speed layout and verification, Xpedition 2610 gives engineering teams the speed, agility, and trusted outcomes required for first-pass success.
Xpedition EDM integration. With the new 2610 release, Valor NPI has become part of a broader Xpedition engineering data management (EDM) verification suite, alongside several HyperLynx products, including design rule checking (DRC), schematic analysis, signal integrity and power integrity. By bringing design revisions, verification results, reports, and related metadata together in a managed and traceable environment, EDM creates a richer foundation for AI-assisted analysis. AI capabilities can use this connected engineering context to help uncover patterns, summarize results, and identify opportunities to improve verification and manufacturing workflows. Xpedition EDM now allows Valor users to launch manufacturing verification against a specific PCB revision while managing the resulting Valor NPI data through a check-in, check-out and approval processes. Synchronization with Xpedition Layout helps teams work from the latest design, while tying each verification to a specific design revision. Valor 2610 organizes DFM results alongside broader board information and other verification checks, like DRC. Each check-in will capture the rules and factors used, pass/fail counts, failure details and feedback from multiple reviewers. MRA summaries will provide access to the verification history, including run dates, job size, ownership, approval and release status, and the corresponding PCB revision. This gives teams the context to understand findings and track how manufacturing readiness changes as the design develops. Teams can perform verification concurrently within a shared design or independently against the same revision, then rerun analysis using the updated PCB as needed. The workflow supports standalone access through EDM Cockpit, as well as direct access from Xpedition Layout through an integrated Xpedition DFM workflow. This accumulated manufacturing knowledge supports AI analysis and deeper metadata mining. Connecting design properties, verification settings, results and reviewer feedback across revisions helps teams identify recurring issues and understand how design decisions affect manufacturing outcomes. These insights help teams refine DFM practices and improve manufacturability earlier in development. Embedded IPC standards compliance. Valor NPI 2610 introduces design for standards compliance (DFSC) embedded within all versions Valor NPI and available at no cost. This version of the traditional IPC Class 1, Class 2 and Class 3 standards have been generated by the Global Electronics Association (GEA) and shared exclusively within Valor NPI. Design for Standards Compliance (DFSC) checks PCB designs against applicable industry standards. DFSC supplements traditional DFM analysis, helping teams evaluate industry compliance alongside their existing manufacturing checks. The deployment includes nine advanced IPC profiles developed jointly by Siemens EDA and the Global Electronics Association (GEA), with planned updates happening twice yearly. This strategic partnership brings together two complementary areas of expertise. GEA contributes its knowledge of IPC standards and global manufacturing capabilities, while Siemens provides the manufacturing verification technology to apply that knowledge directly to PCB designs. For users, this turns complex manufacturing requirements into repeatable checks within their existing design workflow. The nine profiles cover every combination of IPC performance Class 1, 2 and 3 and producibility Level A, B and C. These describe two different aspects of a design: the performance expected of the finished product and the manufacturing capabilities needed to produce it. Performance classes will already be familiar to many designers. Class 1 covers general electronic products where the primary requirement is that the finished product functions. Class 2 covers products requiring continued performance and extended service life, where uninterrupted operation is desirable but not critical. Class 3 covers products where continued performance or operation on demand is critical, downtime is unacceptable, and the product must function when required. Producibility levels describe how widely the capabilities needed to manufacture a design are available across the global PCB supply chain: Selecting a level helps teams understand how their design decisions affect manufacturing options. Moving toward Level C can accommodate more demanding technologies and geometries, but it also makes supplier capability more important. Performance class and producibility level remain separate choices: specifying a Class 3 product does not automatically mean it requires Level C manufacturing. Each profile uses pass/fail criteria for the requirements it evaluates. These results indicate whether a design meets the selected profile's thresholds; they are not severity rankings. Used alongside traditional DFM analysis, they give teams a consistent basis for reviewing standards compliance while continuing to address supplier-specific constraints and other manufacturing risks. Developed for use with Valor NPI, the advanced profiles build on the basic profiles previously offered through PCBflow. They expand coverage to include HDI and microvias, flex and rigid-flex, RF, high layer counts, and heavy copper. The profiles draw on the IPC-2220 and IPC-6010 series, IPC J-STD-001, IPC-4101, IPC-2152, IPC-2141, IPC-4562, IPC-7351, and IPC-4202, IPC-4203 and IPC-4204, along with related standards. GEA also researched global PCB suppliers to establish copper feature-size and clearance values that account for copper weight and thickness. This combines standards requirements with practical manufacturing capability data. The profiles are reviewed twice a year for updates and revisions. The profiles provide an implementation of applicable IPC requirements for automated checking, while the underlying standards remain essential technical references. Although the check values are present in the profiles, the standards provide the fuller explanations, application guidance and engineering context needed to interpret them. Users can learn more about the advanced IPC profiles on GEA's website and purchase the supporting IPC standards through the GEA store. Improved component intelligence. The Valor Parts Library supplies component intelligence to Valor NPI and is the vital connection between BOM engineering data and manufacturing verification workflows. Its 2610 updates complement the Valor NPI application changes by improving how this component information is protected, located and made available to users. Security, reliability, simplicity. Significant infrastructure changes have been made to the VPL to ensure more robust data integrity across the entire component exchange process, while simplifying authentication and access. Part data now has more robust encryption during system-to-system communication with each application. Along with this, the VPL Content Server now supports LDAP-based authentication, allowing users to authenticate use using their existing enterprise credential. This connects each users VLM roles directly to their enterprise identity infrastructure. Valor Parts Library 2610 includes automatic recovery capabilities, creating more stable deployment environment. Simplifying Part Discovery with manufacturing part number (MPN) only search. By removing the vendor-name requirement from part searches, VPL makes component discovery more flexible and better aligned with how users often receive part information. This helps with whole-flow connectivity and improves matching when component data is incomplete or inconsistent. New and improved DFM checks. Pass/fail constraints organized by manufacturing intent. DFM profiles express the requirements used to evaluate a design. Pass/fail constraints determine whether particular conditions meet those requirements, while manufacturing factors help determine which constraints apply. Valor NPI 2610 organizes pass/fail constraints into general groups based on shared constraint factors. General constraints are divided into relevant areas, including etch, mechanical, quality, solder, process setup and component placement. Manufacturing requirements that adapt to board size. [Video - WhatsNew_2610_ValorNPI_New_Factor_Board_Size] Valor NPI 2610 adds board dimensions to the list of factors within the ADM. Represented as two values; board width and board length, this allows analysis to automatically adapt to product size, allowing for more intelligent rule selection. Longer and wider boards are more susceptible to warping and as such, will need more fiducials, or increased fiducial spacing along the board dimensions to ensure consistent alignment for component placement. In addition, larger boards also require extra tooling holes to provide sufficient support and reduce board flex during assembly. Expanded support for complex trench-via configurations. Valor NPI continues to extend it's DFM coverage to support emerging PCB design techniques. One of the emerging manufacturing technologies increasingly entering HDI designs are trench vias. Trench vias appear exclusively within rigid HDI PCBs and are created on blind or buried drill layers. Trenches are continuous laser-etched lines cut through the dielectric and then electroplated, forming uniform, elongated electrical connection between board layers. Traditionally, via trenches Siemens AG designated as simple point-to-point lines. Any overlapping paths were classified as illegal linear trenches. Valor NPI 2610 now supports multiple termination points from a single starting point, allowing for three and four termination microvia trench configurations.
Building the digital foundation for the next generation of manufacturing at Zimmer Biomet. Driving innovation in orthopedic manufacturing. In the medical technology industry, delivering consistent quality, precision, and traceability is essential. As a global leader in orthopedic innovation, Zimmer Biomet continuously invests in technologies that help its teams operate more efficiently, make informed decisions faster, and support the production of life-changing solutions for patients around the world. To further advance its manufacturing strategy, Zimmer Biomet embarked on a digital transformation initiative centered on Manufacturing Execution Systems (MES). Through a thoughtful, phased implementation approach and strong collaboration between operations, IT, and shop floor teams, the company established a connected digital foundation that is enhancing visibility, improving operational performance, and enabling future innovation. A people-first approach to digital transformation. Rather than pursuing a large-scale deployment all at once, Zimmer Biomet implemented MES one department at a time, prioritizing areas based on business impact and opportunities for value creation. This approach allowed teams to learn from each deployment, gather feedback directly from shop floor personnel, and continuously refine the experience before expanding across the organization. By placing employees at the center of the transformation, the company ensured that technology adoption aligned closely with day-to-day operational needs while creating momentum for long-term success. Siemens AG deployed MES in one department at a time based on the priority and impact of the business. Taking that phased approach was really helpful to understand feedback from its shop floor team members to improve its MES system for the next deployment." - Palak Shah, AMS Manager, Zimmer Biomet Connecting teams, data, and operations. A key factor in the success of the initiative was the strong partnership between IT and operations. Before launching MES, Zimmer Biomet established clear ownership between information technology (IT) and operational technology (OT) teams. IT focused on application management while OT teams owned MES operations and manufacturing support. This collaborative model streamlined communication, accelerated issue resolution, and provided a strong framework for scaling digital manufacturing initiatives across the business. By aligning people, processes, and technology, Zimmer Biomet created an environment where digital innovation could be adopted efficiently and sustainably. Unlocking real-time visibility across the shop floor. As Zimmer Biomet expanded its digital manufacturing capabilities, real-time operational visibility became a significant advantage. Today, MES provides teams with immediate access to critical information across production operations, including work-in-progress status, order priorities, quality insights, production performance metrics, and operational trends. With a unified view of manufacturing activities, employees can make informed decisions faster, maintain production flow, and proactively identify opportunities to improve both efficiency and quality. The result is a more connected manufacturing environment where data is accessible when and where it is needed. Transforming traceability and Quality Management. In an industry where quality and compliance are paramount, rapid access to accurate production information is essential. By digitizing manufacturing data within Opcenter MES, Zimmer Biomet has enhanced its ability to investigate operational and quality-related events with greater speed and confidence. Information that once required significant manual effort to compile can now be accessed almost instantly, enabling teams to quickly assess situations and take action while maintaining the highest standards of quality and patient safety. Traceability is the key feature in terms of scoping for quality or operational issues. It used to take a lot of effort, but because of all the digital data in Opcenter MES, now Siemens AG is able to scope all the issues within a few seconds." - Palak Shah, AMS Manager, Zimmer Biomet This enhanced traceability not only supports regulatory requirements but also provides valuable insights that help drive continuous improvement across manufacturing operations. Delivering measurable business results. The impact of Zimmer Biomet's MES transformation extends well beyond technology implementation. The initiative has delivered measurable business outcomes, including: * More than 90% reduction in non-conformance events * Improved direct labor efficiency * Enhanced operational visibility * Faster issue identification and resolution * Greater consistency across manufacturing processes These results demonstrate the value of combining digital technologies with a disciplined implementation strategy focused on operational excellence and continuous improvement. Creating the foundation for advanced manufacturing. Perhaps the most significant outcome of the MES initiative has been the creation of a robust digital backbone for future innovation. Today, MES serves as a central platform connecting automation technologies, ERP systems, Quality Management Systems (QMS), and other shop floor applications into a cohesive manufacturing ecosystem. Operators can manage their work through a unified environment, from understanding production priorities and executing work orders to collecting quality data and completing production activities. This seamless flow of information enables teams to focus more on value-added work while leveraging trusted manufacturing data throughout the production lifecycle. Looking ahead: the next phase of digital manufacturing. Zimmer Biomet continues to build on this momentum. As part of its advanced manufacturing roadmap, the company is upgrading to the latest MES version and plans to leverage capabilities such as Statistical Process Control (SPC), Advanced Planning and Scheduling (APS), and Mendix integration to create new digital tools for shop floor teams. These initiatives are designed to further digitalize manufacturing operations, expand access to actionable insights, and empower employees with the information needed to optimize performance and support continuous innovation. A blueprint for manufacturing excellence. Zimmer Biomet's MES journey illustrates how manufacturing leaders can unlock new levels of performance by thoughtfully connecting people, processes, and technology. The results achieved to date demonstrate more than a successful technology deployment. They reflect a long-term commitment to innovation, operational excellence, and continuous improvement. As the company continues to invest in advanced manufacturing capabilities, it is helping define what the future of digital manufacturing looks like in the medical technology industry, proving that digital transformation is most powerful when it empowers people, strengthens processes, and creates a platform for sustained innovation.
Siemens Collaborates with NVIDIA to advance AI-powered PCB inspection from Digital Twin to factory. Siemens announced a new collaboration with NVIDIA to develop adaptive AI-powered manufacturing capabilities that combine industrial software, Siemens' Digital Twin technology and NVIDIA Cosmos to accelerate production planning, inspection preparation and optimization. The collaboration combines Siemens' Teamcenter software for product lifecycle management (PLM) and Process Preparation X with NVIDIA Cosmos to create a new AI-powered workflow for PCB inspection, helping electronics manufacturers prepare and optimize automated optical inspection (AOI) processes before physical production begins. The solution is being demonstrated at Siemens Electronics Factory Erlangen, Siemens' Customer Zero for adaptive AI-powered production - with the goal of creating a highly adaptive factory that can rapidly introduce near daily changes (3 to 5 times a week) without disruption. "By connecting the comprehensive Digital Twin to the shop floor and AI we are improving both line productivity and product quality. At the Erlangen factory, we're demonstrating how the deterministic nature of Siemens' Digital Twin is the foundation for leveraging physics AI for preparing production," said Mark Hindsbo, Executive Vice President Operations Software, Siemens. "By leveraging a 'virtual' golden board, electronics manufacturers can change production dramatically quicker without taking the line out of production. This enables electronics manufacturers to respond more quickly to change and helps reach production readiness at scale and speed - while helping to reduce manual engineering effort, accelerate AOI readiness and improve manufacturing quality." "Manufacturers shouldn't have to wait for the first physical circuit board to start preparing inspection," said Rev Lebaredian, Vice President, Physical AI Simulation at NVIDIA. "By combining Siemens' industrial software and manufacturing expertise with NVIDIA Cosmos, we can generate synthetic images of good and defective boards to prepare inspection virtually - helping manufacturers bring new products into production faster." Traditionally, introducing a new product or product variant requires a physical prototype before optical inspection processes can be prepared and trained for quality control. The new approach moves more of that work into the virtual world. Teamcenter provides PCB design, bill of materials and component information while Process Preparation X validates, normalizes and assembles this information into a Digital Twin of the printed circuit board assembly (PCBA). This provides the comprehensive product and manufacturing context needed to prepare inspection before the first physical board reaches the production line. This Digital Twin of the "perfect" reference board, often referred to as the "golden board," is used with NVIDIA Cosmos to create a fully photorealistic virtual golden board along with synthetic photorealistic samples that represent both good and false conditions created during production. Siemens uses NVIDIA Cosmos Data Factory to generate synthetic circuit-board defect images, enabling inspection-machine calibration before physical boards are produced. The workflow then extends into production through an AI-supported secondary inspection capability. When an AOI system identifies a potential defect, the secondary inspection capability can help analyze the detected condition and determine whether it represents a real defect or a false call. Together, these technologies are intended to create an end-to-end digital and AI-supported workflow spanning virtual AOI preparation, calibration and inspection support once production begins. Customer Zero at Siemens Electronics Factory, Erlangen The collaboration is being demonstrated at the Siemens Electronics Factory in Erlangen, Germany, which serves as Customer Zero for broader Siemens and NVIDIA work on adaptive, autonomous and AI-powered production. The factory contributes the manufacturing use case, production environment and subject-matter expertise in a highly adaptable, high-mix environment with ever-changing production processes. The project is targeting up to 85 percent less manual engineering effort in AOI program generation - with 40 percent fewer false calls and more than 5 percent first-pass yield improvement. For manufacturers, the intended value is earlier inspection preparation, reduced manual engineering effort, lower dependency on physical samples, better-calibrated inspection processes, reduced manual verification, faster production readiness and improved manufacturing quality. The collaboration also demonstrates how the Digital Twin and industrial AI can connect engineering intent with real-world inspection across the digital and real stages of production and how the comprehensive Digital Twin evolves from a virtual representation of the product into an active foundation for AI-powered manufacturing and quality processes.
Mercedes-Benz puts product development in the AI fast lane. Published: Oct 22, 2026 Summarize with AI From digital drawing board to production line, Mercedes-Benz is rewiring global vehicle development around PLM.AI. The AI-ready backbone will connect the entire product lifecycle, cut development cycles by around 17 months, and unlock efficiency gains of up to 50 percent in individual engineering processes. Faster to the future, without cutting corners. * The new Product Lifecycle Management (PLM) system will use artificial intelligence (AI) to connect development, procurement, production, sales, and aftersales across the entire product lifecycle, helping innovations reach series maturity faster. * Mercedes-Benz expects to reduce the development time for new vehicles by approximately 17 months, whilst achieving efficiency gains of up to 50 percent in selected engineering processes. * Mercedes-Benz is working with two strategic technology partners on the transformation programme. CONTACT Software provides the platform's open-core system, whilst Siemens is expanding its long-standing collaboration with Mercedes-Benz in physical design and digital validation. Mercedes-Benz is preparing for a fundamental shift in how it conceives, engineers, and brings vehicles to market. With PLM.AI, the company is building an AI-native digital backbone that connects development, procurement, production, sales, and aftersales through a single, intelligent knowledge base. By creating an uninterrupted flow of data and insight across these functions, Mercedes-Benz aims to bring new products and technologies to series maturity faster, more efficiently, and more sustainably. Development time could be reduced by up to 30 percent, with efficiency gains up to 50 percent expected in selected engineering processes. The ambition is not to move faster by making compromises. It is to help teams make better decisions earlier, giving the right people access to the right information precisely when they need it. This connected approach is intended to reduce complexity, accelerate innovation, and bring new technologies to customers sooner. Throughout that transformation, the standards associated with every Mercedes-Benz vehicle will remain firmly in place. The company's commitment to quality and safety is unchanged. Vehicles developed with PLM.AI will remain unmistakably Mercedes-Benz, shaped by the same craftsmanship, engineering excellence, and desirability, but delivered to customers faster. From data silos to an ai-ready digital thread. AI is already woven into Mercedes-Benz's product development. AI agents support a growing range of tasks, from optimising material costs and navigating certification and homologation processes to identifying faults, resolving technical issues, and assisting with software development. Today, many of these agents operate within individual stages of the development process. PLM.AI is designed to take the next step by connecting applications across those stages through standardised data models and end-to-end integration of development information. The result will be a continuous digital thread built on consistent data and clearly defined standards. Information will be available in real time, coordination between teams will become simpler, and promising innovations will be able to move through development more quickly. Backed by an investment of about half a billion euros, Mercedes-Benz is laying the foundation for a new generation of product development that is more connected, data-driven, and intelligent than before. The system will allow teams to assess complex interdependencies more holistically and translate emerging technologies into tangible customer benefits at greater speed. PLM.AI will help employees examine cross-functional relationships, intelligently connect relevant information, and identify potential trade-offs much earlier in the development cycle. AI-powered simulations and digital development processes will also let teams use physical testing more selectively, potentially cutting it by half over time. Resources can therefore be directed more efficiently, whilst teams can validate development decisions earlier and with greater confidence. People remain at the centre of the process, however, and teams will continue to own product decisions. Weight optimisation illustrates the potential. Changing a single component can affect cost, crash performance, hardware and software functions, and the production process itself. Specialised AI agents can examine these interdependencies simultaneously, giving development teams a comprehensive picture sooner. With that broader view, teams can evaluate potential solutions against safety, quality, and commercial requirements rather than considering each factor in isolation. The same connected approach could also open new aftersales opportunities by bringing together product, service, and operating data. Three partners, one ai-ready backbone. Mercedes-Benz is working with CONTACT Software and Siemens to deliver the PLM.AI architecture. Together, the two strategic technology partners will play a central role in modernising product development and establishing the technical foundations for the new system. More specifically, CONTACT Software is supplying the open PLM core layer through CONTACT Elements. This will give Mercedes-Benz a modular, scalable foundation for integrating product data, processes, and applications throughout product development, whilst retaining the flexibility to incorporate future AI technologies. Meanwhile, Siemens is contributing solutions and expertise in AI-enabled automotive design, simulation and digital validation for the digital twin. Supported by PLM.AI's shared data and process foundation, these capabilities will help key engineering disciplines become more closely connected and move faster. For its part, Mercedes-Benz will lead the end-to-end transformation, defining the target vision, architecture, data models, and governance for PLM.AI. The company will also oversee the global rollout through an agile transformation programme and continue to develop the digital backbone over time. PLM.AI is set to become the cornerstone of the Mercedes-Benz engineering ecosystem, providing the foundation for fully integrated, data-driven, and AI-supported development across every vehicle programme. Throughout the transformation, Mercedes-Benz will retain full ownership and control of its data, as well as the AI models developed and operated using that data.