Wafer Fabrication Back Grinding Technician

Wafer Fabrication Back Grinding Technician 

1. Willingness to work in a cleanroom environment, compliance with cleanroom protocols, contamination control requirements, and ESD procedures.
2. Good communication skills and ability to work effectively with the team.
3. Strong team member, able to work closely with the cross functional team .
4. Perform consumables change ,equipment setup, qualification, and buy-off activities after maintenance, repairs, upgrades, or engineering changes.
5. Operate and troubleshoot semiconductor back grinding manufacturing equipment to minimize downtime and ensure production targets are achieved.
6. Perform scheduled preventive maintenance on back grinding department machines.
   Diagnose mechanical, electrical and pneumatic issues during PM or breakdowns.
7. Identify and address potential areas for improvement and optimize tool availability, cycle time, utilization, and cost
8. Complete all required reporting and documentation
9. Understand and follow all health, safety, and environmental procedures and requirements
10. Actively participate in continuous improvement processes, learning, and skills development
11. Strong team member, able to work well with a global team, train new team members as needed, and other duties as assigned
12. Perform all activities in a safe and responsible manner and support all Environmental, Health, Safety programs .
13. Knowledge of semiconductor equipment such as Back Grinder, Dicing Saw ,Taping ,Detaping & Wafer Mounter is an advantage.
14. Escalate critical equipment issues promptly and provide effective communication during major tool downtime events.
15. Support shift coverage, weekend work, and on-call duties when required to support manufacturing operations.
16. Ensure compliance with cleanroom protocols, contamination control requirements, and ESD procedures.
17. Read and interpret electrical schematics, pneumatic diagrams, mechanical drawings, and technical manuals.
18. Escalate critical equipment issues promptly and provide effective communication during major tool downtime events.
19. Support shift coverage, weekend work, and on-call duties when required to support manufacturing operations.
20. Basic understanding of PLC systems, sensors, servo motors, robotics, vacuum systems, pumps, and pneumatic control systems is an advantage .
21. Knowledge of machine interlocks, safety circuits, and lockout/tagout (LOTO) procedures.
22. Ability to use measuring instruments such as digital multimeters, calipers, pressure gauges, vacuum gauges, and dial indicators.
23. Basic understanding of servo motors, robotics, vision systems, and automated wafer handling mechanisms.
24. Ability to interpret equipment alarms, logs, and diagnostic information to identify equipment failures.

Diploma in the followings field : 

• Electrical Engineering
• Mechanical Engineering
• Mechatronics Engineering 
• Electronics Engineering

Basic understanding of:

• Mechanical systems (motors, bearings, alignment)
• Electrical systems (wiring, sensors, PLC basics)
• Pneumatic systems
• Ability to read technical drawings and machine manuals
• Familiarity with preventive maintenance procedures and safety standards
• Familiar with Microsoft Outlook, Excel, PowerPoint, and Word

Diploma in the followings field : 

• Electrical Engineering
• Mechanical Engineering
• Mechatronics Engineering 
• Electronics Engineering

Basic understanding of:

• Mechanical systems (motors, bearings, alignment)
• Electrical systems (wiring, sensors, PLC basics)
• Pneumatic systems
• Ability to read technical drawings and machine manuals
• Familiarity with preventive maintenance procedures and safety standards
• Familiar with Microsoft Outlook, Excel, PowerPoint, and Word

Wafer Fabrication Back Grinding Technician 

1. Willingness to work in a cleanroom environment, compliance with cleanroom protocols, contamination control requirements, and ESD procedures.
2. Good communication skills and ability to work effectively with the team.
3. Strong team member, able to work closely with the cross functional team .
4. Perform consumables change ,equipment setup, qualification, and buy-off activities after maintenance, repairs, upgrades, or engineering changes.
5. Operate and troubleshoot semiconductor back grinding manufacturing equipment to minimize downtime and ensure production targets are achieved.
6. Perform scheduled preventive maintenance on back grinding department machines.
   Diagnose mechanical, electrical and pneumatic issues during PM or breakdowns.
7. Identify and address potential areas for improvement and optimize tool availability, cycle time, utilization, and cost
8. Complete all required reporting and documentation
9. Understand and follow all health, safety, and environmental procedures and requirements
10. Actively participate in continuous improvement processes, learning, and skills development
11. Strong team member, able to work well with a global team, train new team members as needed, and other duties as assigned
12. Perform all activities in a safe and responsible manner and support all Environmental, Health, Safety programs .
13. Knowledge of semiconductor equipment such as Back Grinder, Dicing Saw ,Taping ,Detaping & Wafer Mounter is an advantage.
14. Escalate critical equipment issues promptly and provide effective communication during major tool downtime events.
15. Support shift coverage, weekend work, and on-call duties when required to support manufacturing operations.
16. Ensure compliance with cleanroom protocols, contamination control requirements, and ESD procedures.
17. Read and interpret electrical schematics, pneumatic diagrams, mechanical drawings, and technical manuals.
18. Escalate critical equipment issues promptly and provide effective communication during major tool downtime events.
19. Support shift coverage, weekend work, and on-call duties when required to support manufacturing operations.
20. Basic understanding of PLC systems, sensors, servo motors, robotics, vacuum systems, pumps, and pneumatic control systems is an advantage .
21. Knowledge of machine interlocks, safety circuits, and lockout/tagout (LOTO) procedures.
22. Ability to use measuring instruments such as digital multimeters, calipers, pressure gauges, vacuum gauges, and dial indicators.
23. Basic understanding of servo motors, robotics, vision systems, and automated wafer handling mechanisms.
24. Ability to interpret equipment alarms, logs, and diagnostic information to identify equipment failures.