A

Apple

Designs phones, computers and their operating systems

Technical Program Manager - System in Package

Process EngineeringConfirmed live in the last 24 hours
Full-timeNo salary listedIn-person

About the Job

Requirements

  • A bachelor's degree in Engineering or equivalent.
  • Excellent written and spoken English communication skills.
  • Experience in high-volume consumer-electronics manufacturing with surface-mount technology (SMT) and packaging processes.
  • Operations management experience, including yield improvement and overall equipment effectiveness (OEE) optimization.
  • Working knowledge of quality-control methodologies, including statistical process control (SPC), measurement system analysis (MSA), gauge repeatability and reproducibility (GRR), and failure mode and effects analysis (FMEA).
  • Program or project management experience, with the ability to translate high-level goals into actionable plans.
  • Experience operating within a matrix organization and leading cross-functional teams across cultures.

Responsibilities

  • Own end-to-end factory output, yield, quality, and readiness for volume ramp.
  • Integrate lessons learned into future designs and apply predictive methods to anticipate quality issues early in the development cycle.
  • Maintain open issue lists and drive closure prior to mass production start.
  • Partner with manufacturing partners to advance yield and operational excellence through direct engagement, structured communication, and continuous improvement initiatives.
  • Track manufacturing-partner performance through objective measurement systems, audits, and on-line verification, and implement corrective action plans across the product life cycle.
  • Deliver executive-level status reports on a weekly cadence.
  • Escalate key concerns and resolution options to senior management.

Desired Qualifications

  • A master's degree in Engineering or equivalent.
  • Demonstrated technical expertise in printed circuit board assembly (PCBA), molding, laser processing, sputtering, assembly, test, and pack-out processes.
  • Hands-on experience with design of experiments (DOE) and failure analysis (FA), with the ability to solve problems under pressure using data-driven methods.
  • Familiarity with automation and design for manufacturing (DFM) for semiconductor packaging operation.
  • Background in electrical engineering through education or work experience.
  • Familiarity with electrical and mechanical product inspections.

About the Company

Apple

Designs phones, computers and their operating systems

Apple designs and sells consumer electronics, from iPhone smartphones and Mac computers to tablets and wearable devices. Its operating systems manage apps and built-in functions for communication and work, while iCloud stores files and synchronizes data across devices. Customers buy additional digital services through subscriptions such as Apple Music and Apple TV, and developers distribute software through the App Store. Apple earns money from hardware sales, subscriptions and digital transactions, selling directly to customers and through retailers and mobile carriers around the world. It was founded in 1976 and has its headquarters in Cupertino, California.

Company size
10,001+
Company stage
IPO
Headquarters
Cupertino, CA
Founded
1976

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