NXP Semiconductors
Automotive semiconductors and secure embedded solutions
Design for Test Engineer Intern - Summer 2027
The role is on-site/hybrid in Austin; the posting does not specify the required number of office days.
About the job
- Currently pursuing a Bachelor's or Master's degree in Electrical Engineering, Computer Engineering, or a related field.
- Strong understanding of digital logic design and Very-large-scale integration fundamentals.
- Familiarity with Verilog, Very-high-speed integrated circuit Hardware Description Language, and scripting languages such as Python, Perl, or Tool Command Language.
- Excellent problem-solving skills and attention to detail.
- Strong communication and teamwork abilities.
- Must be returning to school or graduating at the conclusion of the summer internship term; candidates graduating before July 2027 should apply to entry-level full-time roles.
- Assist in implementing Design for Test techniques such as scan insertion, boundary scan, and memory built-in self-test.
- Support automatic test pattern generation pattern generation and validation using industry-standard tools.
- Help analyze test coverage and debug test patterns.
- Collaborate with register-transfer-level designers and verification teams to ensure testability requirements are met.
- Contribute to automating Design for Test flows using Python, Perl, or Tool Command Language scripting.
- Document Design for Test methodologies, test plans, and results.
- Exposure to Design for Test concepts such as scan chains, automatic test pattern generation, and built-in self-test.
- Experience with electronic design automation tools from Synopsys, Cadence, or Mentor Graphics.
- Coursework or project experience in Design for Test or digital integrated-circuit design.
- Knowledge of static timing analysis, synthesis, and register-transfer-level verification.
- Familiarity with Linux or Unix environments.
About the company
NXP Semiconductors designs and sells semiconductor chips for vehicles and other devices. Its products include automotive-grade microcontrollers and other ICs used in engines, infotainment, safety systems, and networked car architectures. These chips process data, run software, and enable features such as advanced driver assistance and vehicle connectivity, often with strong security and real-time performance. Unlike some peers, NXP became an independent company after Philips spun off its semiconductor unit in 2006 and later merged with Freescale in 2015, building a focused strength in automotive semiconductors and microcontrollers. This gives it a clear niche in the market and the goal of growing as a standalone leader in smarter, connected vehicles and related technologies.
Company Size
10,001+
Company Stage
IPO
Headquarters
Eindhoven, Netherlands
Founded
2004
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Simplify's Take
What believers are saying
- Q2 2026 revenue hit $3.5 billion, up 19%, with 35.1% non-GAAP operating margin.
- July 28, 2026 results showed automotive revenue $1.94 billion and industrial revenue $755 million.
- September 1, 2026 EIB loan funds Malaysia back-end expansion, deepening capacity and supply resilience.
What critics are saying
- Korea FTC sent NXP examiners' reports on July 8, 2026; fines reach 92 billion won.
- Distributor controls and resale-price practices threaten penalties, forced contract changes, and customer churn in 2027.
- Automotive concentration and Korea penalties erase free cash flow if OEM platforms shift by 2028.
What makes NXP Semiconductors unique
- NXP's S32N7 and SAF8444 unify vehicle compute and radar for software-defined cars.
- January 6, 2026 eIQ Agentic AI Framework extends secure edge AI into robotics.
- NXP's 2026 EV charging stack bundles RW612, Matter, OCPP, and ISO 15118.
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6 month growth
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↑ 0%Andrew Micallef, chief operations officer at NXP Semiconductors, sold 1,000 shares of the company on 15 September at a weighted average price of $226.04, according to an SEC Form 4 filing. The transaction was conducted under a pre-established 10b5-1 trading plan, which allows company insiders to sell shares at predetermined times to avoid accusations of insider trading. NXP Semiconductors' stock has returned 2.2% this year through 16 September, trailing the S&P 500's 11.3% and Nasdaq Composite's 12.3%. The semiconductor company reported second-quarter revenue of $3.5 billion, up 19% year over year, and expects third-quarter revenue of approximately $3.8 billion, representing an 18% increase from the prior year.
In AI infrastructure race, Nokia's optical Bet outpaces IBM's software pivot. Nokia and IBM have spent five years chasing similar returns, but their bets on where AI infrastructure spending lands could not be more different, and 2026 is forcing a reckoning between the two approaches. Nokia (NYSE:NOK | NOK Price Prediction) and IBM (NYSE:IBM) have delivered similar five-year returns of 92.7% and 83.9%, respectively. Year to date, the paths diverged sharply. Nokia is up 62.8% after a Q2 beat-and-raise. IBM is down 19.7% after a rare EPS miss. AI orders lift Nokia. Mainframe timing sinks IBM. Nokia's July report showed AI and cloud customer revenue more than doubling, up 105% in constant currency, with Q2 order intake of €2.8 billion in that segment. Optical Networks grew 20% and IP Networks 16%. CEO Justin Hotard said, "Demand remains strong, while supply continues to be the main industry constraint." IBM went the other way. Q2 revenue grew just 1.1%, and operating EPS of $2.93 missed the $2.97 consensus. Software rose 5.1%, with Red Hat up 11%, but Infrastructure fell 7.4% as IBM Z mainframe revenue collapsed 42% in a late-cycle trough. CEO Arvind Krishna conceded the quarter "fell short of expectations," blaming deferred capex deals rather than lost demand. Plumbing versus what runs on it. The two reside in AI infrastructure at different layers. Nokia sells physical plumbing: optical transport (fiber gear moving data between and inside data centers) and IP routing (switches directing traffic). Its Infinera acquisition and planned purchase of NXP's fab in Chandler, Arizona, for indium phosphide production are bets on owning that supply chain. IBM sells what runs on top: Red Hat OpenShift, watsonx orchestration, HashiCorp, Confluent, and mainframes that process over 70% of the world's transaction value. (The suppliers benefiting from that buildout, from power to cooling to networking, are the subject of a free report we put together.) | Lens | Nokia | IBM | | Core Bet | Optical and IP for AI data centers | Hybrid cloud software and mainframe | | Q2 Growth Engine | AI & Cloud sales +105% | Data software +18% | | Weak Spot | Fixed Networks −3% | IBM Z −42% | | Revenue Base | Carrier and hyperscaler capex cycles | ~80% recurring software | A patent portfolio IBM cannot match. Nokia also runs a technology licensing business through Technology Standards, which grew 15% in the quarter. That royalty stream on cellular standards has no IBM analog in networking, and it cushions Nokia when carrier spending sags. A majority of Nokia's sales are billed in dollars despite its Finnish base, so a stronger euro would compress reported profits for U.S. ADR holders. Next test: deferred deals and supply ramps. IBM claims delayed Q2 transactions were "deferral and not destruction" and lowered its full-year constant-currency revenue growth guidance to 4%-5%. Nokia expects combined IP and Optical revenue to grow 18%-20% and aims for indium phosphide fab volume production by Q4 2026. What the market is paying for. At $10.60 per share, Nokia trades at a forward P/E near 22, pricing in a durable AI infrastructure supercycle and successful U.S. manufacturing pivot. IBM, at $237.75, carries a forward P/E near 18, a 2.8% yield, and 31 consecutive years of dividend increases. One is priced as a cyclical growth story that is delivering. The other is priced as a compounder working through an execution stumble and an active securities fraud inquiry. Got $1,000? Before you buy IBM, read this. If you have cash sitting in your account right now, give this two minutes. After more than two decades of helping investors beat the market, our top analysts at 24/7 Wall St. put together a definitive report on the Top 10 Stocks To Buy Today. And IBM wasn't one of them. They combed the entire market. It's not 10 ideas, not 10 stocks everyone is talking about, it's what their research points to as the 10 best stocks to buy right now, and it's free. Read more here and see which stocks made the list ->> Trey Thoelcke Trey has been an editor and author at 24/7 Wall St. for more than a decade, where he has published thousands of articles analyzing corporate earnings, dividend stocks, short interest, insider buying, private equity, and market trends. His comprehensive coverage spans the full spectrum of financial markets, from blue-chip stalwarts to emerging growth companies. Beyond 24/7 Wall St., Trey has created and edited financial content for Benzinga and AOL's BloggingStocks, contributing additional hundreds of articles to the investment community. Trey's editorial expertise extends across multiple publishing environments. He served as production editor at Dearborn Financial Publishing and development editor at Kaplan, where he helped shape financial education materials. Earlier in his career, he worked as a writer-producer at SVE. His freelance editing portfolio includes work for prestigious clients such as Sage Publications, Rand McNally, the Institute for Supply Management, the American Library Association, Eggplant Literary Productions, and Spiegel. Outside of financial journalism, Trey writes fiction and has been an active member of the writing community for years, moderating workshop sessions at regional conventions.
NXP Article - Accelerate EV charger development with the EasyEVSE platform and RW612 wireless MCU. By Susanne Zach At electronica India 2026, NXP showcased its EasyEVSE Entry-level Development Platform based on the RW612 wireless MCU. This highly integrated solution is designed to simplify the development of residential, commercial and smart energy EV charging applications. By bringing wireless connectivity, Matter, OCPP, security, charger control, metrology and EV charging software support together in a single platform, EasyEVSE helps developers simplify design, reduce complexity and accelerate the development of connected, interoperable EV charging solutions. The platform is built around NXP's RW612 wireless microcontroller with built-in security, integrating Wi-Fi 6, Bluetooth(R) Low Energy and Thread connectivity, with Matter-ready capabilities for smart energy ecosystems. By consolidating multiple functions into a highly integrated wireless MCU, the solution enables manufacturers to develop competitive EV charging products while supporting evolving connectivity and interoperability requirements. Simplify EV charger development with an integrated wireless platform. Learn more about the RW612-based EasyEVSE platform and its ecosystem of EV charging development resources. The EasyEVSE development platform supports open-source Open Charge Point Protocol (OCPP) for charger-to-cloud communications and gives capabilities to enable the ISO 15118 EV charging communication standard through NXP's EasyEVSE ecosystem. This allows manufacturers to build charging solutions that can connect across charging infrastructure and support evolving EV charging standards. "As the EV charging market continues to expand globally, manufacturers need solutions that reduce cost and complexity without compromising connectivity, security, or user experience," said Susanne Zach, EV Charging and Power Conversion Segment Lead, Power & Energy at NXP. "Our EasyEVSE entry-level development platform combines wireless connectivity, security, and charger control in a highly integrated solution that helps customers accelerate development of smart, scalable EV charging products for residential and commercial applications." Caption: Integrated wireless connectivity, security, metrology and EV charging software support in a single development platform. A Simpler Path to Connected EV Charging EV charging manufacturers are looking to deliver connected and interoperable charging products while managing increasing requirements around cybersecurity, connectivity, energy management and charging standards. Traditional architectures can require multiple components and software elements to address these requirements, increasing system complexity, development effort and time to market. The EasyEVSE entry-level development platform brings wireless connectivity, security, metrology and EV charging software support together into a highly integrated development solution. Integrated EdgeLock(R) security capabilities support secure device onboarding, authentication and cloud communications, while modifiable, pre-certified metrology software enables accurate billing and energy monitoring. Its combination of Wi-Fi 6, Bluetooth LE, Thread and Matter-ready connectivity enables manufacturers to address a range of smart energy applications, while OCPP help to enable interoperability between chargers, vehicles and cloud-based charging infrastructure. The platform is particularly suited for residential smart EV chargers, entry-level and mid-range AC wallbox chargers, commercial AC charging stations, smart energy management systems, and home energy and charging applications leveraging Matter connectivity. Development Resources and Ecosystem Support NXP is working with chargebyte GmbH in Germany, which has sold more than 100,000 units of its ISO 15118 stack, predominantly on NXP's S32K1 MCU family, and has now implemented it on the RW612 MCU and other NXP MCU-based EV charging designs. NXP also works with SEVENSTAX, which runs its ISO 15118 stack on NXP MCU-based EV charging development platforms. Early adopters evaluating the RW612-based platform for next-generation residential and commercial EV charging products have highlighted interest in its single-chip architecture, Matter support, integrated security, and support for OCPP and ISO 15118 charging standards. The platform provides hardware, software, design files, documentation and reference implementations to help accelerate development cycles. Software scalability across NXP's broader EasyEVSE MCU and MPU portfolio also enables manufacturers to address different charging requirements while building on a common development ecosystem. The RW612-based EasyEVSE Entry-level Development Platform is available now, with hardware, software and development resources to accelerate customer designs. For more information, visit the EasyEVSE Entry-level Development Platform. Susanne Zach Marketing Manager, Power and Energy Susanne holds a Bachelor's degree in Electrical Engineering and a Master's degree in Business Management. She began her career as a hardware and software engineer, developing innovative sensor solutions. In 2022, she joined NXP focusing on Electric Vehicle Supply Equipment (EVSE) system solutions. Since 2023, Susanne has led NXP's EV Charging segment, and since 2026, she has also led the Power Conversion segment within the Power & Energy division. In these roles, she is responsible for defining market strategies, identifying customer and technology requirements, and driving the development of innovative system solutions that accelerate electrification and energy efficiency. Her work focuses on advancing next-generation EV charging infrastructure and power conversion solutions, including power supplies, energy conversion systems, and intelligent energy management architectures. By fostering strong partnerships across the ecosystem, she helps customers accelerate the adoption of innovative, intelligent, and sustainable solutions that enable smarter, safer, more reliable, and energy-efficient energy systems.
Accelerate EV Charger Development with the EasyEVSE Platform and RW612 Wireless MCU. At electronica India 2026, NXP showcased its EasyEVSE Entry-level Development Platform based on the RW612 wireless MCU. This highly integrated solution is designed to simplify the development of residential, commercial and smart energy EV charging applications. By bringing wireless connectivity, Matter, OCPP, security, charger control, metrology and EV charging software support together in a single platform, EasyEVSE helps developers simplify design, reduce complexity and accelerate the development of connected, interoperable EV charging solutions. The platform is built around NXP's RW612 wireless microcontroller with built-in security, integrating Wi-Fi 6, Bluetooth(R) Low Energy and Thread connectivity, with Matter-ready capabilities for smart energy ecosystems. By consolidating multiple functions into a highly integrated wireless MCU, the solution enables manufacturers to develop competitive EV charging products while supporting evolving connectivity and interoperability requirements. Simplify EV charger development with an integrated wireless platform. Learn more about the RW612-based EasyEVSE platform and its ecosystem of EV charging development resources. The EasyEVSE development platform supports the open-source Open Charge Point Protocol (OCPP) for charger-to-cloud communications and gives capabilities to enable the ISO 15118 EV charging communication standard through NXP's EasyEVSE ecosystem. This allows manufacturers to build charging solutions that can connect across charging infrastructure and support evolving EV charging standards. As the EV charging market continues to expand globally, manufacturers need solutions that reduce cost and complexity without compromising connectivity, security, or user experience. Its EasyEVSE entry-level development platform combines wireless connectivity, security, and charger control in a highly integrated solution that helps customers accelerate development of smart, scalable EV charging products for residential and commercial applications. A simpler path to connected EV charging. EV charging manufacturers are looking to deliver connected and interoperable charging products while managing increasing requirements around cybersecurity, connectivity, energy management and charging standards. Traditional architectures can require multiple components and software elements to address these requirements, increasing system complexity, development effort and time to market. The EasyEVSE entry-level development platform brings wireless connectivity, security, metrology and EV charging software support together into a highly integrated development solution. Integrated EdgeLock(R) security capabilities support secure device onboarding, authentication and cloud communications, while modifiable, pre-certified metrology software enables accurate billing and energy monitoring. Its combination of Wi-Fi 6, Bluetooth LE, Thread and Matter-ready connectivity enables manufacturers to address a range of smart energy applications, while OCPPs help to enable interoperability between chargers, vehicles and cloud-based charging infrastructure. The platform is particularly suited for residential smart EV chargers, entry-level and mid-range AC wallbox chargers, commercial AC charging stations, smart energy management systems, and home energy and charging applications leveraging Matter connectivity. Development resources and ecosystem support. NXP is working with chargebyte GmbH in Germany, which has sold more than 100,000 units of its ISO 15118 stack, predominantly on NXP's S32K1 MCU family, and has now implemented it on the RW612 MCU and other NXP MCU-based EV charging designs. NXP also works with SEVENSTAX, which runs its ISO 15118 stack on NXP MCU-based EV charging development platforms. Early adopters evaluating the RW612-based platform for next-generation residential and commercial EV charging products have highlighted interest in its single-chip architecture, Matter support, integrated security, and support for OCPP and ISO 15118 charging standards. The platform provides hardware, software, design files, documentation and reference implementations to help accelerate development cycles. Software scalability across NXP's broader EasyEVSE MCU and MPU portfolio also enables manufacturers to address different charging requirements while building on a common development ecosystem. The RW612-based EasyEVSE Entry-level Development Platform is available now, with hardware, software and development resources to accelerate customer designs. For more information, visit the EasyEVSE Entry-level Development Platform. Marketing Manager, Power and Energy Susanne holds a Bachelor's degree in electrical engineering and a Master's degree in Business Management. She started her career as a hardware and software engineer for innovative sensor solutions. In 2022 she joined NXP in the vertical segment focusing on EV charging system solutions. Since 2023, Susanne leads the Electric Vehicle Supply Equipment (EVSE) sub-segment within the Power and Energy division. In this role, she is responsible for shaping the future of EV charging infrastructure by defining strategies and market requirements, developing cutting-edge solutions, and fostering partnerships with customers that accelerate the transition to a sustainable EV charging ecosystem. Her work focuses on delivering secure, efficient, reliable and scalable EV charging systems that meet the demands of global electrification - today and for the future.
Construction of TSMC fab in Germany on track: ESMC president. 09/15/2026 12:29 PM Berlin, Sept. 14 (CNA) A topping out ceremony was held Monday at the site of a plant being built in Germany by Taiwan Semiconductor Manufacturing Co. (TSMC), indicating that the fab is progressing as planned and within budget, according to the head of a joint vent ure company in charge of the project. Christian Koitzsch, president of European Semiconductor Manufacturing Co. (ESMC), said about 2,000 workers from 106 countries are working around the clock at the site in Dresden, and he is confident that construction would be completed on schedule, according to a report by German news outlet Sächsische Zeitung (SZ). ESMC is a joint venture between TSMC, Bosch, Infineon, and NXP, established to build the advanced semiconductor fab in Dresden, the capital of the German state of Saxony. The topping out ceremony, or Richtfest as it is called in Germany, being held 25 months after the groundbreaking was an achievement for the construction team, Koitzsch said, according to the report. A topping out ceremony typically marks the construction milestone of laying the final beam or structural piece at the highest point of a building, and it also honors the construction crew, architects, and engineers. The ceremony, held on Sept. 14, recognized an auspicious day in Taiwanese culture, while the ritual itself followed German customs. A carpenter gave a speech before breaking a glass for a toast, SZ reported. However, because alcohol is prohibited on the construction site, the glass was filled with water instead, according to the report. Looking back at the groundbreaking ceremony in August 2024, Koitzsch said ESMC had specifically reminded guests to fill their shovels with soil, as the gesture symbolizes good luck and prosperity in Taiwan, SZ reported. Koitzsch said that gesture appeared to have had a positive effect, as construction of the fab has been proceeding smoothly, the SZ report said. The next milestone for the fab will be the installation of the first manufacturing process equipment in the second half of 2027, Koitzsch said, according to the report. Before production can begin, the interior of the fab's cleanroom will have to be completed, the automated material handling system installed, and infrastructure work completed, including electricity and water supply, according to SZ. Also speaking at the topping out ceremony, Saxony State Premier Michael Kretschmer said TSMC's decision to build a fab in Dresden was significant, the report said. The smooth progress of the project, as marked by the Richtfest, showed that TSMC, the Dresden city government, and the Saxony state government had kept their commitments, he was cited as saying. The mutual trust established during the process would provide a basis for further cooperation, he said, according to the report. Kretschmer said the state hoped to continue participating in Europe's semiconductor industry initiatives and that more suppliers and companies would settle in Dresden following the European Commission's recent proposal for a Chips Act 2.0, SZ reported. Meanwhile, Dresden Mayor Dirk Hilbert estimated that 15,000 to 20,000 workers would move to the area by 2030, SZ said. According to sources, the estimate includes about 600 TSMC engineers, their family members, and personnel from the company's suppliers who are expected to move there in 2027. The city is preparing to establish a more systematic economic area to meet projected demand for residential, industrial and commercial land, investment promotion, and economic development when fab starts production, Hilbert said, according to the SZ report. Dresden has also held events introducing Taiwanese culture to local residents and to welcome Taiwanese workers, he said, adding that the city also hopes to host a Taiwanese night market in the future, SZ reported. (By Lin Shang-ying and Wu Kuan-hsien)