onsemi

Semiconductors for intelligent power and sensing

Staff Engineer - Package Dev : Pkg & Assy

Manufacturing EngineeringConfirmed live in the last 24 hours

Full-timeCarmona, Cavite, PhilippinesNo salary listedIn-person

About the Job

Requirements

A Bachelor's or Master's degree in an appropriate technical discipline, such as Physics, Electrical Engineering, Chemical Engineering, Materials Science, Mechanical Engineering, or Electronics and Communications Engineering.
Eight years of experience in semiconductor manufacturing, particularly in new package or product development.
Hands-on assembly development and manufacturing experience.
Analytical skills related to process, materials, and assembly equipment parameters.
Hands-on experience with program management.

Responsibilities

Find or create linkages with proof-of-concept labs and providers of equipment, materials, and services.
Develop new packages from conceptualization and ideation through creation of fully functional prototypes.
Physically conduct proof-of-concept builds and/or technology demonstrations with providers.
Benchmark processes and technologies.
Provide proof-of-concept development costing and project timing.
Follow the New Package Technology Development (12MON47078H) and H3 Ideation Flow.
Ensure intellectual property coverage before engagement.
Generate and present proof-of-concept and/or technology demonstration reports to stakeholders.
Transfer technology to the development site.
Provide intelligence on package technology and markets.
Conduct tests and research on basic materials and properties involved in packaging, and develop solutions for new package development.
Provide recommendations on technical approach or design, resource allocation, and project timing.
Determine the best approach to solve problems independently, with general guidance.
Conduct design reviews and risk assessments with other technical experts.
Manage technical risks for assigned projects and ensure deployment of mitigation actions according to committed project timing.
Work with Manufacturing, Reliability, and Business Units to close engineering gaps and support smooth production transfer.

Find/Create linkages with POC labs/providers (Eqpt, Material, Service providers)
New package development -from conceptualization and ideation to creation of fully functional prototypes
Physically conduct POC builds and/or technology demonstration with Provider
Benchmark processes/technologies
Provides POC development costing and project timing
Follows the New Package Technology Development (12MON47078H) and H3 Ideation Flow
Make sure we are covered with the Intellectual Property prior engagement
Generate/Present POC and/or Technology demonstration reports to Stakeholders
Technology Transfer to development site
Provides intelligence on Package Technology/Market
Responsible for New Package Development. Conducts tests and research on basic materials and properties involved in packaging. Develops solutions.
Provides recommendations regarding technical approach or design, resource allocation, or project timing.
Works with general guidance but independently determines the best approach for solving a problem.
Conducts Design reviews and risk assessments with participation by other technical experts
Manages the Technical risks of the projects assigned to ensure deployment of mitigation actions as per committed project timing
Strong interaction with Manufacturing, Reliability and Business Units to close engineering gaps and for smooth production transfer.

Bachelors/Master of appropriate technical discipline; ie. Physics, Electrical Engineering, Chemical Engineering, Materials Science, Mechanical Engineering, Electronics and Communications Engineering
8 years of experience in semiconductor manufacturing, particularly in New Package/Product Development
Hands-on assembly development and manufacturing experience.
Analytical skills: process, materials and assembly equipment parameters
Hands-on experience on program management

About the Company

onsemi

Semiconductors for intelligent power and sensing

onsemi designs and manufactures semiconductors with a focus on intelligent power and sensing technologies for automotive and industrial markets. Its products include power management ICs and sensors that regulate energy, monitor conditions, and provide control signals for EVs, ADAS, factory automation, robotics, and energy infrastructure. The company differentiates itself by its specialized emphasis on intelligent power and sensing across both sectors and through its direct OEM relationships and global distributor network. Its goal is to improve energy efficiency and enable smarter, more capable systems for electrification, autonomy, and sustainable energy solutions.

Company size: 10,001+
Company stage: IPO
Headquarters: Scottsdale, AZ
Founded: 1999

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