SiC Wafer & Package Technology Development Engineer

Technical and customer support for the qualification of SiC die sales and development. The candidate must have knowledge of package design, assembly processes and interactions with device.

• MS Degree in Material Science, Chemical Engineering, Semiconductor Processes or other relevant technical field.
• Strong communication skills.
• Ability to lead development projects and implement strategies on a global basis.
• Knowledge of post fab processing such as wafer thinning, sputter, electroplating, electroless plating, photolithography, wafer bonding. Knowledge of wafer level packaging, package assembly and component processes such as: wirebond, sintering, die attach, clip attach, reflow, molding. 
• Knowledge of materials and material interactions.
• Strong English conversational skills. 

• Work with fellow technologists, customers, business unit representatives, sales, reliability, and other teams on a global basis to develop and qualify the next generation of SiC technologies which meets the cost, performance, manufacturing, timeline and reliability goals.
• Lead and organize efficient development methodologies to address issues and lead technology development through cross functional teams.
• Understand detailed customer requirements and verify latest technologies meet or exceed all expectations.
• Document findings and process flows to create baseline for new technology platforms.
• Lead maturity gate reviews, publish progress reports to executives and peers on monthly and quarterly basis.
• Updates customer assembly application notes.