onsemi

Semiconductors for intelligent power and sensing

Power Module Development Engineer - PIM – Si Gel Filled

Hardware EngineeringConfirmed live in the last 24 hours

Full-timeNo salary listedIn-person

About the Job

Requirements

A bachelor's degree in materials science or mechanical engineering is required.
More than 8 years of power module package development experience, including transfer to production, is required.
Good statistical analysis skills using Minitab or JMP are required.
Good English communication skills are required.

Responsibilities

Develop new package technology and platform modules, including silicon-gel-filled modules.
Provide technical leadership on new power module technology and enabling technology for automotive and industrial applications.
Serve as the technical interface for the package team and communicate with business units, marketing, device technology development, quality and reliability, manufacturing, and application teams.
Conduct package and design reviews for new package development and support on-time release with first-pass qualification success.
Present technical findings, design reviews, and recommendations to stakeholders and management.
Lead package-related failure analysis, reliability testing, and debugging of package issues.
Participate in customer meetings, provide technical clarification, and support failure investigations.
Define power module package strategy aligned with the product roadmap.
Own end-to-end package development from concept to qualification according to company package development procedures.
Ensure package reliability, performance, and manufacturability.
Establish and optimize packaging processes and specifications.
Collaborate with design, wafer fabrication, test, and product engineering teams.
Evaluate and introduce new packaging technologies and materials.
Manage risk, cost, and schedule for packaging programs.
Support customer engagement for technical discussions and issue resolution.
Serve as the subject matter expert for packaging within the organization.

Desired Qualifications

Experience developing silicon-gel-filled module packages with silicon carbide devices is preferred.
Knowledge of AutoCAD is preferred.

New package technology and platform module development (Si-gel filled module).
Technical leadership on new power module technology and enabling technology for automotive/industrial application.
Technical interface for package team, communication with business unit, marketing, device TD, quality/reliability, manufacturing and application team.
Package/design review for new package development, on-tme release with the first pass success (qualification).
Present technical finding, design review and recommendation to stakeholders and management.
Lead package related failure analysis, reliability testing and debug package issues.
Participate in customer meeting, provide technical clarification and support failure investigation.

Minium Bachelor's degree of material science or mechanical engineering.
More than 8 years of power module package development experience including transfer to the production.
Preferred Si gel filled module package development experience with SiC device.
Good statistical analysis skills with Minitab or JMP.
Preferred the knowledge to use Auto CAD software
Good communication skills with English.

Define power module package strategy aligned with product roadmap.
Own end-to-end package development from concept to qualification upon company's package development procedures.
Ensure package reliability, performance, and manufacturability.
Establish and optimize packaging processes and specifications.
Collaborate with cross-functional teams (design, wafer fab, test, product engineering).
Evaluate and introduce new packaging technologies and materials.
Manage risk, cost, and schedule for packaging programs.
Support customer engagement for technical discussions and issue resolution.
Serve as subject matter expert (SME) for packaging within the organization.

About the Company

onsemi

Semiconductors for intelligent power and sensing

onsemi designs and manufactures semiconductors with a focus on intelligent power and sensing technologies for automotive and industrial markets. Its products include power management ICs and sensors that regulate energy, monitor conditions, and provide control signals for EVs, ADAS, factory automation, robotics, and energy infrastructure. The company differentiates itself by its specialized emphasis on intelligent power and sensing across both sectors and through its direct OEM relationships and global distributor network. Its goal is to improve energy efficiency and enable smarter, more capable systems for electrification, autonomy, and sustainable energy solutions.

Company size: 10,001+
Company stage: IPO
Headquarters: Scottsdale, AZ
Founded: 1999

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