NXP Semiconductors

Automotive semiconductors and secure embedded solutions

Lead DFT Engineer

Hardware Validation & TestingConfirmed live in the last 24 hours

Full-timeNoida, Uttar Pradesh, IndiaNo salary listedIn-person

About the Job

Requirements

A B.Tech or M.Tech in Electronics, Electrical, or a related field is required.
Five to eight years of experience in core Design-for-Test (DFT) is required.
Strong expertise in Automatic Test Pattern Generation (ATPG) and Logic Built-In Self-Test (LBIST) methodologies is required.
Hands-on experience in scan insertion and compression is required.
A strong understanding of and hands-on experience with iJTAG (IEEE 1687) is required.
Experience with Memory Built-In Self-Test (MBIST) architectures and repair flows is required.
A good understanding of Boundary Scan / JTAG and related standards (1149.1, 1500, and 1687) is required; the 1687 standard is preferred.
Exposure to low-power DFT concepts is required.
Experience in testability analysis and silicon debugging is required.
Strong problem-solving and debugging skills are required.
Ability to work in a cross-functional team environment is required.
Good communication and mentoring skills are required.

Responsibilities

Lead end-to-end DFT implementation for SoC subsystems.
Drive DFT RTL integration and verification activities.
Manage cross-functional coordination for DFT deliverables at block and subsystem level.
Implement full-scan DFT methodologies.
Develop and optimize scan insertion and compression techniques.
Execute ATPG flows to achieve required fault coverage.
Define and implement MBIST architectures, including repair flows.
Support LBIST planning and implementation.
Implement and ensure compliance with Boundary Scan / JTAG requirements.
Apply low-power DFT methodologies.
Perform testability analysis and improve design coverage.
Support silicon debugging and failure analysis.

Desired Qualifications

Knowledge of the IEEE 1687 standard is preferred.

Summary : We are looking for an experienced and highly motivated DFT Lead Engineer with strong expertise in Design-for-Test methodologies for complex SoC/ASIC designs. The ideal candidate should have hands-on experience in Scan Insertion, ATPG, MBIST, LBIST, JTAG, Silicon Bring-up & Debug, and should be capable of driving complete DFT implementation and signoff activities from RTL to silicon validation.

The candidate will work closely with Design, Physical Design, Verification, and Post-Silicon teams to ensure high test coverage, manufacturability, and robust silicon quality.

Job Qualifications

B.Tech / M.Tech in Electronics, Electrical, or related field
5–8 years of experience in core DFT
Strong expertise in ATPG and LBIST methodologies
Solid hands-on experience in scan insertion and compression
Strong understanding and hands-on experience with iJTAG (IEEE 1687)
Experience in MBIST architectures and repair flows
Good understanding of Boundary Scan / JTAG and related standards (1149.1, 1500, 1687 preferred)
Exposure to low-power DFT concepts
Experience in testability analysis and silicon debug
Strong problem-solving and debugging skills
Ability to work in a cross-functional team environment
Good communication and mentoring skills

Job Responsibilities

Lead end-to-end DFT implementation for SoC subsystems
Drive DFT RTL integration and verification activities
Manage cross-functional coordination for DFT deliverables at block/subsystem level
Implement full-scan DFT methodologies
Develop and optimize scan insertion and compression techniques
Execute ATPG flows to achieve required fault coverage
Define and implement MBIST architectures, including repair flows
Support LBIST planning and implementation
Implement and ensure compliance with Boundary Scan / JTAG requirements
Apply low-power DFT methodologies
Perform testability analysis and improve design coverage
Support silicon debug and failure analysis

More information about NXP in India...

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About the Company

NXP Semiconductors

Automotive semiconductors and secure embedded solutions

NXP Semiconductors designs and sells semiconductor chips for vehicles and other devices. Its products include automotive-grade microcontrollers and other ICs used in engines, infotainment, safety systems, and networked car architectures. These chips process data, run software, and enable features such as advanced driver assistance and vehicle connectivity, often with strong security and real-time performance. Unlike some peers, NXP became an independent company after Philips spun off its semiconductor unit in 2006 and later merged with Freescale in 2015, building a focused strength in automotive semiconductors and microcontrollers. This gives it a clear niche in the market and the goal of growing as a standalone leader in smarter, connected vehicles and related technologies.

Company size: 10,001+
Company stage: IPO
Headquarters: Eindhoven, Netherlands
Founded: 2004

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