DFT
Kandou AI
DFT
Kandou AI
Provides chip-to-chip AI connectivity solutions
Key Responsibilities:
Lead DFT activity for the next generation products
Driving the DFT architectures, methodologies and tool flows for complex multi-million gate designs with Analog/high bandwidth SerDes, DDR, PCIe designs
Closely working with Physical implementation team to define timing constraints in test modes and helping to converge for successful tapeout
Good understanding of ATE, knowledge of probe and final test bring up debug issues and drive the test engineering team for successful Silicon bring up and test program development
Define the test plan by closely working with the design teams and drive the pattern development of functional/structural tests for final/wafer test program
Closely working with the cross functional teams to bring up device qualification solution for HTOL
Drive lab bench silicon debug to understand ATE bring up issues
Skills:
Excellent communication skills, and strong team player with can do type of attitude
Mentoring the team members
Excellent debugging skills
Process oriented to drive automation to help increase productivity and quality
Qualifications:
12+ years of DFT experience including architecture specification, implementation, test pattern development, and simulation
Proven track record of delivering DFT solution to complex designs
Experience working with IJTAG methodologies, understanding device functionality
Experience with hierarchical MBIST insertion, hierarchical scan insertion and scan compression methodologies
Experience in ATPG pattern generation for different kinds of fault models, fault coverage analysis and converging to high coverage metrics
Strong debug capabilities in simulating patterns with timing
Experience in defining test mode constraints and analyzing the timing reports
Experience with industry standard EDA tools for DFT, timing, and simulation
Good knowledge of System Verilog
Experience with chiplet based designs is a plus
Education:
Bachelor of Engineering in Electronics and Electrical Engineering, Computer Engineering or similar fields (equivalent or higher)
Kandou AI designs and sells semiconductor connectivity hardware for AI workloads. It provides a memory fabric and CXL controllers that link processors to memory, enabling scalable, energy-efficient AI inference and training clusters built from affordable hardware. Using Copper MIMO interconnect, it reduces energy per bit and supports features like offloading AI training collectives, switchless memory for in-memory databases, and field-repairable co-packaged optics for better cooling. By targeting the data-movement bottleneck between processors and memory and offering chiplet-based fabrics and IP licensing, Kandou AI aims to make scalable AI infrastructure more accessible to hyperscalers, data centers, and system integrators.
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