onsemi

Semiconductors for intelligent power and sensing

Principal Wirebond Engineer

Manufacturing EngineeringPosted on Nov 11

Full-timeCarmona, Cavite, PhilippinesNo salary listedIn-person

About the Job

Requirements

A minimum of seven years of direct experience in semiconductor operations is required.
A bachelor's degree in Engineering, specifically Mechanical, Electrical, Electronics, or Materials Science, is required.
Extensive experience in New Package/Product Engineering, with specific expertise in assembly processes, is required.
Basic understanding of statistical analysis and the ability to apply it are required.
Specific assembly process expertise is required.
Working knowledge of Design of Experiments and Six Sigma statistical tools is required.
Working knowledge of large-scale safe launch and pre-production releases is required.
Working knowledge of Control Plans, Failure Mode and Effects Analysis, 8D, and problem solving is required.
A background in program management, problem solving, business acumen, and strategic thinking is required.
Proficiency in Microsoft Office is required.
The ability to multitask and organize work systematically to meet deadlines without compromising quality is required.

Responsibilities

Provide support for new package development initiatives, project and program management, and continuous improvement activities at the Carmona site to improve operational excellence, manufacturing and business performance, quality and delivery outcomes, and cost reductions.
Spearhead, lead, and support project champions in collaborating with cross-functional teams to align with KPI metrics and achieve targets.
Support the development of projects and programs to meet Operational Excellence Department goals.
Lead and manage BOM-related projects and product development, including qualifying new suppliers and introducing cost-effective BOM and process types from qualification and manufacturing validation through safe launch and mass production release.
Review engineering builds and complete assembly build requests, qualification reports, and production release documentation.
Support manufacturing requirements related to equipment and maintenance.
Perform other related project activities as assigned.
Support and improve wire bonding equipment and processes to enable device and platform proliferation and ensure product and process robustness.

Desired Qualifications

Knowledge of metallurgy and materials science is an advantage.
AutoCAD and 3D modeling experience is an advantage.

Provide the necessary support for new package development initiatives, project and program management, and continuous improvement activities to drive best-in-class performance at the onsemi Carmona site. These efforts are focused on enhancing operational excellence, improving manufacturing and business performance, achieving superior quality and delivery outcomes, and driving sustainable cost reductions through effective project execution, process optimization, and productivity improvements.

Job Specifications:

•Minimum of seven years of direct experience in semiconductor operations.

•Bachelor’s degree in Engineering (Mechanical, Electrical, Electronics, or Materials Science).

•Extensive experience in New Package/Product Engineering, with specific expertise in assembly processes. Knowledge of metallurgy and materials science is an advantage.

•Good interpersonal skills in collaborating with support groups

•Highly motivated to work in a dynamic environment, with good integrity and character

•Basic understanding of and ability to apply statistical analysis

•Excellent communication skills

Skills:

•Specific Assembly Process expertise
•Working knowledge of DOE / 6 Sigma Statistical Tools
•Working knowledge on large scale, safe launch and pre-production releases
•Working knowledge on Control Plan / FMEA, 8D and Problem Solving
•Background on Program Management, Problem Solving Skills and Business Acumen and Strategic Thinking .
•Proficient in Microsoft Office
•AutoCAD and 3D modelling is an advantage

•Spearhead, lead, and support project champions in collaborating with cross-functional teams to align with KPI metrics and achieve targets.

•Support the development of projects and programs to meet the goals of the Operational Excellence Department.

•Lead and manage BOM-related projects and product development, including qualifying new suppliers and introducing cost-effective BOM and process types—from qualification and manufacturing validation to safe launch and mass production release.

•Review engineering builds and complete assembly build requests, qualification reports, and production release documentation.

•Provide support for all manufacturing requirements related to equipment and maintenance.

•Perform other related project activities as assigned.

•Demonstrate the ability to multi-task and organize work systematically to meet deadlines without compromising quality.

•Support and improve wire bonding (WB) equipment and processes to enable device and platform proliferation and ensure product and process robustness.

About the Company

onsemi

Semiconductors for intelligent power and sensing

onsemi designs and manufactures semiconductors with a focus on intelligent power and sensing technologies for automotive and industrial markets. Its products include power management ICs and sensors that regulate energy, monitor conditions, and provide control signals for EVs, ADAS, factory automation, robotics, and energy infrastructure. The company differentiates itself by its specialized emphasis on intelligent power and sensing across both sectors and through its direct OEM relationships and global distributor network. Its goal is to improve energy efficiency and enable smarter, more capable systems for electrification, autonomy, and sustainable energy solutions.

Company size: 10,001+
Company stage: IPO
Headquarters: Scottsdale, AZ
Founded: 1999

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