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Lyte AI

Robotics perception platform with silicon-level fusion

Wafer Level Test Engineer/Lead

Hardware Validation & TestingConfirmed live in the last 24 hours
Full-timeTaiwan

About the Job

Requirements

  • A bachelor's degree in Electrical Engineering, Electronics, Computer Engineering, Physics, or a related field is required.
  • At least 5 years of hands-on ATE test program development for mixed-signal CMOS ICs, including direct wafer-level (CP / wafer sort) experience, is required.
  • Hands-on experience with Advantest V93000 (SmarTest) and/or Teradyne (UltraFLEX, J750, or similar) platforms is required.
  • Working knowledge of BIST/DFT test methods and OTP/eFuse trimming at wafer level is required.
  • Experience validating test programs pre-silicon in collaboration with chip design teams is required.
  • Proven experience maintaining production test programs and supporting OSATs or test houses, including program transfer and correlation, is required.
  • Programming in C/C++ and/or Java (SmarTest) or VB/VBT (IG-XL) is required.
  • Solid data analysis skills using STDF, wafer maps, yield Paretos, Cp/Cpk, and GR&R are required.
  • Disciplined documentation, version control (e.g., Git/SVN), and change-management practices are required.
  • Strong written and spoken English and Mandarin fluency are required to work with headquarters engineers and local partners.
  • Candidates must be comfortable working independently at partner sites and willing to travel regularly within Taiwan and occasionally across Asia.

Responsibilities

  • Own wafer-level (CP / wafer sort) testing at Taiwan test house partners, managing test program development, engineering lots, and production wafer sort.
  • Develop ATE wafer-level test programs for mixed-signal CMOS on Advantest V93000 or Teradyne platforms, including test program architecture, test flows, pin/levels/timing setups, binning, and limits tables.
  • Work with the chip design team at the US headquarters to translate designs into test plans, test specifications, and test coverage matrices.
  • Implement and debug BIST, scan/DFT, analog and mixed-signal parametric tests, and OTP/eFuse trimming routines.
  • Validate test programs before first silicon using offline/virtual tester environments and pattern conversion (WGL/STIL/VCD) from design simulation.
  • Bring up new silicon on the tester, including first-silicon debug, characterization, and correlation between bench, ATE, and simulation results.
  • Maintain released programs throughout their lifecycle through regression and sign-off, including change requests, limit updates, bug fixes, test-time reduction, and yield improvements.
  • Transfer released test programs to OSAT partners for volume production, including tester-to-tester and site-to-site correlation, GR&R, golden-wafer checks, and production release readiness.
  • Deploy and maintain test programs at partner sites, including production issue triage, excursion response, root cause analysis, and corrective action using 8D / 5-Why.
  • Work with partners on probe card specification and qualification, prober setup, contact/overdrive optimization, and tester hardware debugging.
  • Analyze wafer test data (STDF, wafer maps, bin Paretos, Cp/Cpk) to monitor yield, detect excursions, and improve yield and test time.
  • Extend wafer-level testing capabilities as programs mature, including optical wafer-level testing and collaboration with partners on test methods, hardware, and correlation.
  • Own test documentation and version control so every build is traceable and reproducible across partner sites.
  • Report regularly on test development, yield, and production readiness to engineering and operations leadership.
  • Travel to test house and OSAT facilities in Taiwan and across Asia as needed to resolve issues and support production ramps.

Desired Qualifications

  • Experience as a test lead, owning test strategy and coordinating multiple test house and OSAT partners.
  • Familiarity with probe card design and qualification, load boards, and prober setup and cleaning recipes.
  • Prior experience at, or working closely with, a Taiwan test house or OSAT.
  • Experience with test-time reduction, multi-site test development, and adaptive test / outlier screening (e.g., Part Average Testing).
  • Experience with yield-management and analysis tools (e.g., JMP, Spotfire, or similar).
  • Experience testing analog/mixed-signal blocks such as ADCs/DACs, PLLs, LDOs, bandgaps, and high-speed interfaces.
  • Knowledge of automotive quality standards such as AEC-Q100.
  • Experience with known-good-die (KGD) screening and advanced-packaging wafer-level testing.
  • Experience with, or strong interest in, optical and silicon photonics wafer-level testing.
  • Familiarity with lidar, FMCW, photonics, or robotics sensor technologies.

About the Company

Lyte AI

Robotics perception platform with silicon-level fusion

Lyte AI builds an end-to-end perception stack for robots, from custom sensing silicon to software. Its LyteVision platform combines camera data, inertial measurements, and a 4D distance-velocity sensor into a single synchronized data stream at the silicon level. This reduces latency and calibration drift that can occur when stitching together separate sensors. The system is designed for industrial uses such as inspection, logistics, and manufacturing robots, and also aims to power broader Physical AI platforms. The company differentiates itself through its fully integrated, silicon-level sensor fusion and a pedigree of engineers who helped create depth sensing for devices like Face ID and Kinect, backed by substantial funding to scale silicon production and deployments. Its goal is to provide reliable, low-latency robot perception to enable scalable automation across industrial settings.

Company size
51-200
Company stage
Series C
Total funding
$272M
Headquarters
Mountain View, CA
Founded
2021

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