Agentic AI Windows Power and Thermal Engineer
Qualcomm
Agentic AI Windows Power and Thermal Engineer
Qualcomm
Designs mobile chips and licenses wireless patents
General Summary:
Power/Thermal Software products team at Qualcomm to achieve industry leading Power/Thermal/Limit SW management solution on Qualcomm Compute, Mobile, IoT, Automotive and AR/VR chipsets.
In this position, the candidate will be working with cross-functional teams to Profile Power & Thermal and identify Power, thermal & Peak Current risks and provide optimized solutions with proper Mitigation.
The candidate will need to perform system level analysis of Power/thermal use cases, expected to collaborate with Architecture, HW design, Performance, Power/Thermal Systems and various software teams to work towards optimal system level Power/thermal SW solution.
In this position, the candidate will be working on automation based on AI/Agentic AI infrastructure, that require AI Model expertise, designs, trains, and deploys neural network architectures (like CNNs, LLMs, or Transformers) and to build e2e infrastructure automation to process huge telemetry data(Power, Performance, Logs) to optimize power, performance with the e2e infrastructure automation. This cross-disciplinary role blends machine learning expertise with deep knowledge of AI infrastructure, Network Models, and cloud computing.
In addition, the candidate will need to develop tools and methodologies for competitive analysis to learn about competitors strengths and weaknesses, and come up with thermal mitigations schemes that are best in the industry.
Minimum Qualifications:
• Bachelor's degree in Engineering, Information Systems, Computer Science, or related field.Preferred Qualifications:
Systems/HW background with a good understanding of microprocessor architecture and common SoC hardware blocks (Interconnects, Display, Graphics, etc.)
AI Expertise - Model development, Data pipeline Management, Infrastructure Automation.
Operating systems concepts - scheduling, memory management and device drivers.
Using debug tools like JTAG debugger, oscilloscopes, logic analyzers.
Knowledge on Mobile power or Power/thermal management SW development.
In-depth knowledge in the areas of Embedded Systems, Microcontrollers, SoC Power, Modem, Multimedia, and Wireless communications, System level debugging and analysis for SoC power optimizations.
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Pay range and Other Compensation & Benefits:
$99,500.00 - $149,300.00The above pay scale reflects the broad, minimum to maximum, pay scale for this job code for the location for which it has been posted. Even more importantly, please note that salary is only one component of total compensation at Qualcomm. We also offer a competitive annual discretionary bonus program and opportunity for annual RSU grants (employees on sales-incentive plans are not eligible for our annual bonus). In addition, our highly competitive benefits package is designed to support your success at work, at home, and at play. Your recruiter will be happy to discuss all that Qualcomm has to offer – and you can review more details about our US benefits at this link.
If you would like more information about this role, please contact Qualcomm Careers.
Qualcomm designs the Snapdragon processors and modems inside many Android phones, and it licenses its wireless patents to device makers around the world. It helped commercialize CDMA, the cellular technology behind 3G networks, and its patents cover core parts of the 4G and 5G standards that phones use to connect. The company does not run its own chip factories; contract foundries make its chips, which it sells to makers of phones, PCs, cars, and connected devices. Device makers also pay Qualcomm royalties for using its patented technology, which forms a second business alongside chip sales. Qualcomm was founded in 1985 and is based in San Diego, California.
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