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Eliyan

D2D/C2C interconnect IP licensing

Digital SerDes Design Lead

Full-Time
No salary listed
Expert
Master's, PhD
California, USA
In Person
Hardware EngineeringSilicon & ASIC Design

About the job

Requirements
  • Masters or Ph.D in Electrical Engineering, Computer Engineering, or related fields
  • 12+ years of experience in digital design of high-speed SerDes, PHY, or transceiver IPs with proven tapeout experience at 112G PAM4 or higher data rates
  • Strong RTL design skills in SystemVerilog with deep understanding of synthesis, timing closure, CDC/RDC, and design-for-test (DFT) methodologies
  • Expert-level knowledge of SerDes DSP architectures including FFE, DFE, MLSE, CTLE digital controls, CDR loop dynamics, and adaptation/calibration algorithms for PAM4 signaling
  • Strong working knowledge of IEEE 802.3 (100G/200G/400G/800G/[1.6T]), OIF CEI specifications, FEC architectures (RS-FEC KP4/KP8), and/or die-to-die standards such as UCIe
  • Hands-on experience with high-speed digital design on advanced process nodes (5nm, 3nm, or below) with understanding of FinFET/GAA device implications on circuit performance and power
  • Experience working at the digital-analog boundary including specification of DAC/ADC interfaces, calibration state machines, and integration with mixed-signal simulation environments
  • Demonstrated technical leadership with ability to mentor engineers, drive architectural decisions, and deliver silicon on aggressive schedules in startup or high-growth environments
  • Experience with optical/electrical interconnects (VCSEL, EML), chiplet D2D interfaces, DRAM PHYs, or HBM memory interfaces a plus
Responsibilities
  • Lead the micro-architecture definition and RTL implementation of high-speed SerDes digital blocks targeting 224G PAM4 and 448G signaling, including DSP-based equalization (FFE, DFE, CTLE digital controls), CDR loop logic, and adaptation engines
  • Design and optimize PHY-level digital logic including TX driver control, RX datapath, PCS sublayers, lane alignment, deskew, and gear-boxing/rate-matching logic
  • Architect and implement forward error correction (FEC) encoder/decoder blocks including RS-FEC (KP4/KP8), interleaving, and low-latency FEC architectures optimized for 224G/448G link budgets
  • Drive RTL design quality through lint, CDC/RDC analysis, synthesis optimization, and close collaboration with physical design and timing closure teams on advanced FinFET/GAA process nodes
  • Collaborate closely with analog/mixed-signal designers on SerDes AFE integration, digital-to-analog interface specification, calibration sequencing, and AMS co-simulation bring-up
  • Own design deliverables and milestones from RTL development through tapeout signoff; coordinate with verification, DFT, and backend teams to meet aggressive schedules
  • Define and implement auto-negotiation, link training, and PHY initialization state machines compliant with IEEE 802.3
  • Develop power-efficient digital architectures with emphasis on clock gating, voltage scaling, and low-power design techniques for data center and AI/ML interconnect applications
  • Participate in standards bodies and stay current with emerging 224G/448G specifications, OIF CEI, and next-generation interconnect standards
  • Design firmware-accessible register interfaces, configuration/calibration logic, and DPI-based firmware co-simulation hooks for PHY bring-up and debug
  • Support post-silicon characterization and debug activities; correlate silicon measurements with pre-silicon simulation results to drive design improvements
Desired Qualifications
  • None

About the company

Eliyan provides high-performance interconnect IP and chiplet products for chiplet-based systems. Its NuLink PHY enables die-to-die and chip-to-chip connections with simultaneous bidirectional signaling, delivering high bandwidth on standard organic substrates and reducing dependency on expensive advanced packaging. The company licenses IP cores and offers NuGear memory/I-O chiplets and a Universal Memory Interface to connect ASICs with multiple memory types, compatible with UCIe and BoW standards. Eliyan aims to help data centers, AI accelerators, and HPC developers build scalable, cost-effective multi-die systems with improved system performance.

Company Size

51-200

Company Stage

Series C

Total Funding

$295M

Headquarters

Santa Clara, California

Founded

2021

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Simplify Jobs

Simplify's Take

What believers are saying

  • Eliyan closed a $145 million Series C on July 29, 2026.
  • Cisco Investments and Lumentum joined in July 2026, validating optical and infrastructure demand.
  • Initial chiplet shipments are expected in 2026, with low-millions revenue rising toward 2027.

What critics are saying

  • PhotonIC sued Eliyan in June 2026 over breach, fraud, and trade secrets claims.
  • NuLink-XD launched July 24, 2026 without named customers, volumes, or revenue commitments.
  • Broadcom, Marvell, and Nvidia still own critical AI connectivity, threatening Eliyan's standalone relevance.

What makes Eliyan unique

  • Ramin Farjadrad's SBD signaling doubles bandwidth on standard organic substrates, not just advanced packaging.
  • Eliyan's NuLink-XD and NuGear span die-to-die, chip-to-module, and memory interfaces.
  • Arm Total Design and OCP participation make Eliyan an open chiplet infrastructure player.

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Benefits

Health Insurance

Paid Vacation

Flexible Work Hours

Growth & Insights and Company News

Headcount

6 month growth

3%

1 year growth

1%

2 year growth

2%
Yahoo Finance
Oct 14th, 2026
Eliyan unveils NuLight microVCSEL chiplets to break AI's copper wall, scaling to 12.8Tbps

Eliyan has introduced NuLight, which it calls the first 2D microVCSEL interconnect platform for AI scale-up networks. The Santa Clara company says it aims to get past the "copper wall," the bandwidth and reach limits of copper links in large AI systems. The platform pairs two chiplets. Nexus is a 1.6Tbps reverse gearbox, and Oscar is an interface chip for microVCSEL and photodiode arrays. Both are sampling now. The design targets an initial optical reach of about 50 metres. Modular 1.6Tbps slices scale to 6.4Tbps and 12.8Tbps configurations, with a path toward co-packaged optics. A spare-lane repair feature reroutes traffic if a lane fails, without interrupting the link. Chief executive Ramin Farjadrad unveiled the technology at OCP Summit 2026.

InfraSale
Oct 9th, 2026
Eliyan receives takeover bid following $1 billion Series C funding.

Eliyan receives takeover bid following $1 billion Series C funding. October 9, 2026 Eliyan has attracted a takeover bid after securing $1 billion in Series C funding. This development highlights the growing interest in battery energy storage systems (BESS) as demand surges for long-duration energy solutions. InfraSale's audience should monitor how this bid may impact the competitive landscape in the BESS market. investment battery storage renewables

Data Center Dynamics
Jul 31st, 2026
Chiplet interconnect startup Eliyan valued at $1bn following $145m Series C funding round.

Chiplet interconnect startup Eliyan valued at $1bn following $145m Series C funding round. Umesh Padval, managing partner of Seligman Ventures, will also join the company's board July 31, 2026 Chiplet interconnect manufacturer Eliyan has raised $145 million in a Series C funding round, valuing the startup at $1 billion. The oversubscribed round was led by Seligman Ventures, with participation from both new and existing investors, including Cisco Investments and Lumentum. In addition to the funding, Umesh Padval, managing partner of Seligman Ventures, will join Eliyan's Board of Directors. In a statement, Eliyan said the financing will support the development of its next-generation interconnect technologies and allow the company to expand its ecosystem partnerships and scale manufacturing. Founded in 2021 by Ramin Farjadrad, the former CTO and VP of networking at Marvell Semiconductor, along with Syrus Ziai, and Patrick Soheili, Eliyan's chiplet interconnect technology speeds up the processing for AI chips, with the company claiming it achieves up to four times the performance and half the power of other solutions. The company's NuLink PHY and NuGear offerings address both die-to-die and die-to-memory interconnect challenges through its Universal Memory Interface (UMI), a bi-directional interconnect method that enables a bandwidth-efficient connection to memory, in both standard organic substrates and advanced packaging. Chiplets are tiny integrated circuits with specialized functions, which can be combined to make larger integrated circuits. They contain multiple smaller dies, instead of one monolithic die. "AI infrastructure is undergoing one of the largest architectural transitions in computing history," said Farjadrad, who is Eliyan's CEO. "As compute, memory, packaging, and networking become increasingly interconnected, traditional approaches to system connectivity are reaching their limits. Eliyan was founded to address these challenges at the architectural level. This financing, together with the support of leading strategic and financial investors, positions us to accelerate product development, customer adoption, and ecosystem expansion as we help enable the next generation of AI infrastructure." More in investment / M&A / financing.

TechStartups
Jul 29th, 2026
AI infrastructure startup Eliyan becomes unicorn after $145M Series C to solve AI data center bottlenecks.

AI infrastructure startup Eliyan becomes unicorn after $145M Series C to solve AI data center bottlenecks. As AI companies race to build more powerful chips, one problem has become impossible to ignore: getting data in and out of those processors fast enough. Santa Clara-based startup Eliyan believes it has the answer - and investors are betting big on that vision. On Wednesday, Eliyan announced it has raised $145 million in Series C funding, valuing the company at $1 billion and officially joining the ranks of unicorn startups. The round was led by Seligman Ventures, with participation from new and existing investors, including Cisco Systems, Lumentum, and Umesh Padval, an early investor in networking pioneer Mellanox, whose $6.9 billion acquisition by Nvidia helped reshape the AI networking landscape. The new funding comes as demand for AI infrastructure surges and chipmakers search for ways to eliminate one of the industry's biggest performance constraints: moving data between processors quickly enough to keep increasingly powerful AI chips fully utilized. "AI infrastructure is undergoing one of the largest architectural transitions in computing history," said Ramin Farjadrad, CEO and Co-Founder of Eliyan. "As compute, memory, packaging, and networking become increasingly interconnected, traditional approaches to system connectivity are reaching their limits. Eliyan was founded to address these challenges at the architectural level. This financing, together with the support of leading strategic and financial investors, positions us to accelerate product development, customer adoption, and ecosystem expansion as we help enable the next generation of AI infrastructure." Cisco-backed Eliyan raises $145M at $1B valuation to tackle one of AI's biggest infrastructure bottlenecks. Today's AI accelerators can process information at extraordinary speeds, but many spend significant time waiting for data to arrive. As processor performance continues to outpace networking and memory bandwidth, data movement has emerged as one of the biggest obstacles to scaling AI systems efficiently. "People have tried to build faster compute, faster processors and GPUs," Eliyan co-founder and CEO Ramin Farjadrad told Reuters. "Today we are at the point that maybe only 30% to 40% of the GPUs are being used, mainly because of how fast they can receive the data to process. We're solving that problem." Eliyan develops high-speed interconnect technology and optical chiplets that help AI processors exchange data more efficiently. The company says its architecture is designed to deliver higher bandwidth while reducing power consumption and packaging complexity, allowing AI infrastructure builders to scale larger computing clusters without relying on proprietary networking ecosystems. An independent alternative for AI chipmakers. The challenge of connecting thousands of AI chips has become increasingly important as cloud providers and semiconductor companies invest billions in custom AI hardware. Nvidia addressed much of that challenge through its acquisition of Mellanox, whose networking technology became a cornerstone of the company's AI infrastructure strategy. Meanwhile, companies such as Google and Amazon Web Services rely on networking technologies from suppliers including Broadcom and Marvell Technology to support their custom AI chips. Eliyan is positioning itself as an independent alternative. Instead of building AI processors, the company licenses its interconnect technology and provides chiplets that semiconductor companies can integrate directly into their own AI chip designs. Its technology is aimed at hyperscalers, cloud providers, and semiconductor companies developing custom AI accelerators as demand grows for alternatives to off-the-shelf GPUs. From startup to unicorn. The funding also marks an important milestone for Eliyan, pushing its valuation to $1 billion less than five years after the company's founding. According to the company, initial shipments of its chiplet products are expected to begin this year. Chief Strategy and Business Officer Patrick Soheili said Eliyan expects revenue to grow from low millions of dollars in 2025 to hundreds of millions by the end of 2027 as commercial deployments accelerate. The company also says its roadmap extends beyond electrical interconnects to electro-optical connectivity, an area attracting growing attention as AI data centers require dramatically higher bandwidth while keeping energy consumption under control. As part of the financing, Seligman Ventures Managing Partner Umesh Padval, who previously served on Mellanox's board before its acquisition by Nvidia, will join Eliyan's board of directors. Why investors are paying attention. The AI boom has fueled record spending on GPUs, custom AI chips, and data centers. Increasingly, however, the limiting factor is no longer computing power alone but how efficiently those processors communicate with one another. That shift is creating opportunities for infrastructure companies focused on connectivity rather than compute. By targeting one of AI's fastest-growing bottlenecks, Eliyan is betting that the next wave of AI innovation will depend as much on moving data efficiently as on building faster processors. Investors appear to agree, backing the startup with $145 million to help bring that vision to market.

Eliyan
Jul 29th, 2026
Eliyan Achieves Unicorn Status with $145 Million Series C to Advance Electro-optical Interconnects for AI Infrastructure  - Eliyan

Eliyan's latest funding round, led by Seligman Ventures, values the company at $1 billion and includes new strategic investors Cisco Investments and Lumentum.