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Microchip Brings EtherCAT(R) and TSN Networking Solutions to its Power-Efficient PolarFire(R) FPGA Platform TMCnet News [October 29, 2026] | / | Microchip Brings EtherCAT(R) and TSN Networking Solutions to its Power-Efficient PolarFire(R) FPGA Platform CHANDLER, Ariz., Oct. 29, 2026 (GLOBE NEWSWIRE) - As industrial systems evolve to support AI-enabled automation, robotics and intelligent edge computing, developers need to deliver deterministic, real-time networking while minimizing power consumption, maintaining security and reducing system complexity. To address these challenges, Microchip Technology (Nasdaq: MCHP) has expanded its industrial edge networking solution stack with EtherCAT(R) and Time-Sensitive Networking (TSN) capabilities on PolarFire(R) devices. Beckhoff(R) Automation GmbH EtherCAT IP is compatible with both PolarFire(R) FPGA and SoC devices and Microchip TSN IP is supported on PolarFire FPGA SoCs. These enhancements expand Microchip's growing portfolio of FPGA solution stacks which combine hardware, IP, development tools and reference designs to accelerate development across industrial networking, AI, machine learning and security-focused applications. "Industrial networks are becoming more intelligent, distributed and data driven as AI moves closer to the edge," said Shakeel Peera, vice president of Microchip's FPGA business unit. "By adding EtherCAT and TSN capabilities to our power-efficient PolarFire platform, we're providing developers with the deterministic networking technologies needed to build highly responsive, scalable systems for industrial and embedded networking applications." Beckhoff EtherCAT IP supports EtherCAT connectivity at 10/100/1000 bps and Microchip's TSN solution enables deterministic 1 Gbps Ethernet using IEEE 802.1 Time-Sensitive Networking standards. Together, these technologies help developers build scalable industrial networks with predictable communication performance and interoperability across connected devices. Built on power-efficient PolarFire FPGAs and SoCs, the industrial edge networking solution stack delivers real-time processing with high reliability and energy efficiency. PolarFire devices feature a secure, non-volatile architecture that enables instant-on operation and supports integrated security features such as secure boot and anti-tamper protection. The flexible FPGA fabric enables EtherCAT and TSN integration while supporting scalable customization for evolving industrial network architectures. Target applications include motion control, industrial robotics, embedded vision, factory automation, autonomous mobile robots, automotive systems, smart infrastructure and aerospace and defense platforms. PolarFire FPGA and SoC industrial networking solutions are supported by Microchip's Libero(R) SoC design suite, IP cores and reference designs, as well as the Dual-Port Gigabit Ethernet FMC card (ETH-DC-DUALGBE) and PolarFire(R) SoC Video Kit (MPFS250-VIDEO-KIT) for rapid evaluation and prototyping. Visit the website to learn more about Microchip's full portfolio of FPGA devices. Resources High-res images available through Flickr or editorial contact (feel free to publish): * Application image: https://www.flickr.com/gp/microchiptechnology/76v8P3CuKo About Microchip Technology: Microchip Technology Inc. is a broadline supplier of semiconductors committed to making innovative design easier through total system solutions that address critical challenges at the intersection of emerging technologies and durable end markets. Its easy-to-use development tools and comprehensive product portfolio supports customers throughout the design process, from concept to completion. Headquartered in Chandler, Arizona, Microchip offers outstanding technical support and delivers solutions across the industrial, automotive, consumer, aerospace and defense, communications and computing markets. For more information, visit the Microchip website at www.microchip.com. Note: The Microchip name and logo, the Microchip logo, Libero and PolarFire are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. All other trademarks mentioned herein are the property of their respective companies. Editorial Contact: Amber Liptai 480-792-5047 [email protected] [ Back To TMCnet.com's Homepage] |

Microchip reports progress in PIC64-HPSC Spaceflight Computing programme. Microchip Technology Inc (Nasdaq: MCHP) has reported progress in its PIC64-HPSC High-Performance Spaceflight Computing Series, a 64-bit multicore RISC-V computing platform developed for spacecraft, satellites and other mission-critical space systems. The company announced early radiation-characterisation results for the PIC64-HPSC1000-RH radiation-hardened variant, along with progress in customer evaluations and development activities. Testing has demonstrated Total Ionizing Dose (TID) performance up to 200 krad(Si) and successful Single Event Latch-up (SEL) testing up to 78.2 MeV·cm[2]/mg under specified operating conditions. Early Single Event Effects testing also showed stable system-controller operation, with no uncorrected errors or external resets required during testing completed to date. The results provide an indication of the platform's progress towards meeting radiation-tolerance requirements for future missions ranging from Low Earth Orbit to lunar and Mars exploration. Kevin So, Vice President of Microchip's Communications Business Unit, said the programme was intended to provide a modern, high-performance computing platform for civil, commercial, scientific and defence space systems. He said operational silicon, radiation-characterisation results and customer evaluations marked progress in the development of the platform. Through its Early Access Program, Microchip is supplying silicon and development kits to participating customers. They are evaluating the hardware and beginning application development with software, tools, technical resources and engineering support from the company. Microchip is also working with a growing group of board partners developing PIC64-HPSC-based VPX and VNX+ computing platforms. These products are expected to provide system developers with additional options for integrating the processor into future spacecraft and related systems. Initial silicon performance measurements are in line with programme objectives. Potential applications include onboard autonomy, Earth observation, intelligence, secure communications, spacecraft control, scientific exploration, high-performance payload processing and edge artificial intelligence. By processing sensor and mission data onboard, spacecraft can reduce reliance on communications bandwidth, lower decision-making delays and respond more quickly to changing conditions. Microchip noted that NASA's FY26 Civil Space Shortfall Prioritization ranked advanced onboard computing for space operations as the third-highest civil space technology shortfall. The PIC64-HPSC programme originated from NASA and the Jet Propulsion Laboratory's assessment of future spaceflight computing requirements. Microchip received the HPSC contract in 2022. The programme also helped establish the foundation for the company's broader 64-bit PIC64 microprocessor portfolio, which addresses computing requirements across multiple markets. Microchip Technology is widely recognized for its semiconductor, embedded systems, and timing solutions used across automotive, industrial, aerospace, communications, and consumer electronics applications. Through ongoing innovation in frequency control and precision timing technologies, the company aims to support next-generation electronic systems that demand higher performance, lower power consumption, and improved operational resilience.

New R&D proving ground strengthens future transport development. GÖPEL electronic and Microchip Technology collaborate to expand the ASA-ML ecosystem into Automotive Video Testing. October 28, 2026 ASA-ML Automotive Video Testing - GÖPEL electronic and Microchip Technology, a broadline supplier of semiconductors, are deepening their collaboration in the field of ASA Motion Link (ASA-ML). GÖPEL electronic is expanding its modular frame grabber/frame generator to include ASA-ML technology using SerDes chips from Microchip. The goal of the collaboration is to further expand the ecosystem surrounding ASA-ML and provide potential users with a seamless, fully functional environment - from the chip through test equipment to frame grabbers and generators. Medical electronics devices The open standard ASA-ML SerDes technology provides automakers and suppliers with an independent and high-performance technology for data connections. Thanks to its interoperability, the standard reduces dependence on individual vendors and facilitates the integration of different components. GÖPEL electronic and Microchip expect that their collaboration in the field of videobased test solutions using ASA-ML will further accelerate the adoption of the technology. Discover more Tech industry updates Automotive electronics components Artificial intelligence solutions "Expanding the ASA Motion Link ecosystem gives automakers and suppliers greater flexibility, interoperability and confidence so they can move faster from development to deployment," said Kevin So, vice president of Microchip's communications business unit. "Working with leading ecosystem partners such as GÖPEL electronic helps customers develop, test and validate multivendor ASA-ML solutions, supporting a more open approach to high-speed automotive connectivity." AI accelerator chips ASA-ML is an open standard for high-speed in-vehicle communication developed by the Automotive SerDes Alliance. The Alliance consists of automakers, suppliers, and chip manufacturers. The goal is to achieve cross-vendor interoperability of cameras, sensors, and other vehicle components while maintaining high data rates. ASA-ML supports asymmetric transmission of video, control, and payload data at data rates of up to 16 Gbit/s, thereby offering a scalable communication solution for modern vehicle architectures. Particularly for ADAS and future automated driving functions, the standard enables high-performance, secure, and interoperable networking of sensors and control units. With the high-performance Video Dragon frame grabber/frame generator from GÖPEL electronic, such ASA-ML components can also be reliably tested and simulated in the future. GÖPEL electronic uses the new ASA-ML chipsets from Microchip to develop these high-performance data transmission capabilities. Learn Engineering Discover more Electronics news subscription