Q

Qualcomm

Designs mobile chips and licenses wireless patents

Digital SOC Test Engineer - Multiple Teams

Hardware Validation & TestingConfirmed live in the last 24 hours
Full-timeHsinchu, North District, Hsinchu City, TaiwanNo salary listedIn-person

About the Job

Requirements

  • A Bachelor's or Master's degree in Electrical or Electronic Engineering, Computer Engineering, or a related field is required.
  • For senior-level candidates, four or more years of test engineering experience with hands-on involvement in SoC test program bring-up is nice to have.
  • Experience in one or more of structural testing (ATPG, TDF, MBIST), functional testing, high-speed testing, test-related characterization, high-voltage stress, or integration is required.
  • Experience with one or more chiplet-based or multi-die products, including die-to-die interfaces and associated test and yield challenges, is required.
  • Hands-on experience with Advantest 93K or Teradyne UltraFLEX or iFlex test platforms is required.
  • Proficiency in one or more programming or scripting languages, including C++, VB, Java, or Python, is required.
  • Experience using test or yield data analysis tools such as O+, Data Power, or Exensio is required.
  • Exposure to test method or test library development, including development, validation, regression, and enhancements, is required.
  • A Bachelor's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or a related field is also listed in the posting's minimum qualifications.

Responsibilities

  • Develop, bring up, and validate SoC or chiplet test programs across new product introduction and high-volume manufacturing stages.
  • Debug and resolve issues related to coverage, test time, yield, and test escapes.
  • Improve test efficiency and cost through test time optimization and test flow simplification.
  • Analyze test and yield data to identify trends, root causes, and improvement opportunities.
  • Collaborate with DFT, Design, Yield, Reliability, Product, and Manufacturing Test Engineering teams.
  • Participate in cross-region collaboration to drive timely issue resolution across global teams.
  • Communicate technical findings clearly to peers and stakeholders with an appropriate level of detail.

Desired Qualifications

  • Experience working on System-on-Chip or chiplet products.
  • Experience defining or executing chiplet test strategies, including die-to-die interface coverage, multi-stage test flows, yield issue root-cause analysis and resolution, and collaboration with DFT, Design, Process, and Package Design teams.
  • Experience supporting test bring-up or debug on advanced or leading-edge technology nodes.
  • Experience using data analysis tools such as O+, Exensio, JMP, or similar platforms.
  • Experience mentoring or supporting junior engineers in a collaborative engineering environment.
  • Interest or experience in AI-assisted tools for test automation, workflow efficiency, or engineering data analysis.
  • Hands-on experience with version control systems such as Git or SVN.
  • Familiarity with issue tracking systems such as JIRA.
  • Comfort communicating in English, including participation in technical discussions and cross-region collaboration.

About the Company

Qualcomm

Designs mobile chips and licenses wireless patents

Qualcomm designs the Snapdragon processors and modems inside many Android phones, and it licenses its wireless patents to device makers around the world. It helped commercialize CDMA, the cellular technology behind 3G networks, and its patents cover core parts of the 4G and 5G standards that phones use to connect. The company does not run its own chip factories; contract foundries make its chips, which it sells to makers of phones, PCs, cars, and connected devices. Device makers also pay Qualcomm royalties for using its patented technology, which forms a second business alongside chip sales. Qualcomm was founded in 1985 and is based in San Diego, California.

Company size
10,001+
Company stage
IPO
Headquarters
San Diego, CA
Founded
1985

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