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Kandou AI

Provides chip-to-chip AI connectivity solutions

Program Manager - DSP-Based Active Cable Solutions

Project ManagementConfirmed live in the last 24 hours
Full-timeTaipei City, TaiwanNo salary listedHybrid

About the Job

Requirements

  • A Bachelor's or Master's degree in Electronics Engineering, Electrical Engineering, or an equivalent field.
  • At least 10 years of semiconductor-industry experience, preferably in SerDes, DSP-based high-speed I/O, or high-speed interconnect products.
  • Five to ten years of program-management experience, including at least five years managing deliverables for engineering teams.
  • Experience leading cross-functional teams across multiple sites and time zones.
  • Strong knowledge of technical project management and the product development process from proposal through design, proof-of-life or validation, qualification, and production release.
  • Experience delivering high-speed Ethernet products built on DSP/PAM4 SerDes, such as 112G/224G retimers and active cable products (AEC, ACC, or AOC), or comparable pluggable or cabled products.
  • Experience managing external cable and connector supply-chain partners, including cable assemblers, connector vendors, PCB/PCBA houses, and contract manufacturers; Taiwan manufacturing ecosystem experience is ideal.
  • Experience supporting customer engagements with hyperscalers, switch/NIC OEMs, or system integrators, including sample deliveries, interoperability testing, and qualification.
  • Ability to manage priorities and schedules for multiple development teams, including Design Engineering, Signal Integrity, Mechanical, Product and Test Engineering, QA, Reliability, Operations, and Purchasing, to meet product specifications, cost targets, milestones, and prototype delivery schedules.
  • Ability to develop detailed project schedules and present critical-path status, issues, and actions to management.
  • Working technical fluency in high-speed link concepts, including insertion and return loss, channel reach, PAM4 signaling, DSP equalization, active-cable-module power and thermal limits, and link training and bring-up.
  • Strong knowledge of Microsoft Project or similar scheduling tools and strong presentation skills.
  • Skill in risk management, dependency tracking, and escalation across globally distributed teams.
  • Fluent written and verbal English.
  • Fluent written and verbal Mandarin for daily work with Taiwan-based suppliers, manufacturing partners, and customers.
  • Ability and willingness to travel approximately 10–20% for supplier reviews, lab bring-ups, builds, customer engagements, and local or regional alignment meetings.

Responsibilities

  • Manage technical programs for 802.3dj DSP-based Active Cable solutions and related development projects from initial proposal through production launch.
  • Chair weekly development team meetings, drive resolution of technical issues, and push critical-path schedule tasks to completion.
  • Coordinate DSP silicon, firmware, cable, connector, and module-assembly deliverables so they converge on integrated builds and milestones.
  • Coordinate cable, connector, and assembly suppliers and Taiwan-based manufacturing partners on design-in, sampling, qualification, cost, and capacity readiness.
  • Support customer interactions, including sample delivery, interoperability and compliance testing against IEEE 802.3dj requirements, and customer qualification milestones.
  • Ensure project teams and deliverables comply with Kandou quality processes, ISO and development-process requirements, and customer requirements.
  • Serve as the focal point for stakeholder communication on program status and present regularly to senior management.
  • Own program-level cost, schedule, and risk tracking, including bill-of-materials cost targets and build plans.

Desired Qualifications

  • PMP, PgMP, or an equivalent program-management certification.
  • Familiarity with IEEE 802.3ck/802.3dj electrical interfaces, such as CR and AUI.
  • Agile and/or Lean Product Development knowledge.

About the Company

Kandou AI

Provides chip-to-chip AI connectivity solutions

Kandou AI designs and sells semiconductor connectivity hardware for AI workloads. It provides a memory fabric and CXL controllers that link processors to memory, enabling scalable, energy-efficient AI inference and training clusters built from affordable hardware. Using Copper MIMO interconnect, it reduces energy per bit and supports features like offloading AI training collectives, switchless memory for in-memory databases, and field-repairable co-packaged optics for better cooling. By targeting the data-movement bottleneck between processors and memory and offering chiplet-based fabrics and IP licensing, Kandou AI aims to make scalable AI infrastructure more accessible to hyperscalers, data centers, and system integrators.

Company size
201-500
Company stage
Late Stage VC
Total funding
$504.7M
Headquarters
Lausanne, Switzerland
Founded
2011

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