Integrated Circuit Packaging Substrate Engineer - Packaging Engineering

Company:

Qualcomm Semiconductor Limited

Job Area:

Engineering Group, Engineering Group > Packaging Engineering

General Summary:

Qualcomm Packaging group is responsible for developing new package technologies and high-volume manufacturing deployment for different product segments for mobile market & new emerging markets as IoT, Automotive, 5G. This team is responsible for roadmap, working with OSATs and CMs, IC substrate and PCB suppliers, internal design and product teams as well as NPI. Team is looking for experienced packaging substrate engineer who has worked on substrate technologies.

IC package substrate engineering role focuses on the development, evaluation, and qualification of next-generation substrate technologies used in advanced semiconductor packaging. The role requires close collaboration with internal teams specializing in design, electrical, mechanical engineering, materials, and reliability, as well as external substrate/PCB suppliers and OSATs/CMs.

Key Responsibilities

• Responsible for IC substrate advanced technology development and PCB development (New structure, Materials and Machine)
• Responsible for IC substrate and PCB design rule set-up and management.
• Responsible for new product introduction (NPI)
• Work with internal design team and drive DFM methodology for new technologies.
• Technical program management to plan, execute and monitor complex process or product developments.
• IC substrate/PCB supplier management for HVM capability improvement and quality control, troubleshooting with RMA handing.

Minimum Qualifications

• Bachelor's degree in Material Science, Chemical, Mechanical, Electrical Engineering or related field.
• 8 to 10 years of Package Engineering or related work experience.

Preferred Qualifications

• Master's in Material Science/Chemical/Mechanical/Electrical Engineering.
• Over 10 years of hands-on experience working in IC substrate/PCB manufacturing factory (FCCSP/PCB)
• Hands on experience working on substrate material factory or semiconductor packaging environment.
• Experience of development, high-volume manufacturing, troubling shooting of IC substrate (FCCSP)
• Experience of development, high-volume manufacturing, troubling shooting of PCB especially in Automotive applications.
• Understanding of organic laminate manufacturing, role of packaging on product electrical & thermal performance, JEDEC standard component & board level reliability testing.
• Experience of Technical program management to plan, execute, and monitor complex process or product developments.
• Knowledge in DOE, control plan, FMEA and other statistical process control method.
• Proficiency in material and characterization data analysis, and statistical data analysis.
• Knowledge of reliability test methods and qualification procedure.
• Good oral and written communication skills, strong team player & project management skills.

Minimum Qualifications:

•    Bachelor's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 4+ years of System/Package Design/Technology Engineering or related work experience.
OR
Master's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 3+ years of System/Package Design/Technology Engineering or related work experience.
OR
PhD in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 2+ year of System/Package Design/Technology Engineering or related work experience.

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