C

Cambridge GaN Devices

Designs energy-efficient GaN power devices

Director of Packaging

Board & Electronics DesignConfirmed live in the last 24 hours
Full-timeCambridge, UKIn-person

About the Job

Requirements

  • A Bachelor’s degree or higher in Engineering, Physics, Material Sciences, or a related subject.
  • Demonstrable experience designing and manufacturing high-volume semiconductor power packaging, including selecting and working with overseas assembly houses.
  • In-depth knowledge of power semiconductor packaging technologies and selection, including die-attach, silver sintering, flip-chip, wire bonding, copper clip, PCB embedding, and chip metallisation.
  • In-depth experience producing designs according to supplier design rules and design-for-manufacture guidelines using a modern 3D CAD tool such as Solidworks, Fusion360, AutoCAD, or similar.
  • Solid experience with 3D multiphysics simulation, such as COMSOL or ANSYS, for thermal, electrical, and stress analysis using finite element modelling.
  • A solid understanding of, and/or experience with, thermal characterisation of semiconductor packages.
  • Good experience with semiconductor-packaging-related product qualification tests such as TCoB, MSL, TC, HAST, and HTS, according to standards such as JEDEC, IPC, MIL, and AEC-Q100.
  • Ability to work and drive activities in cross-functional teams within the company and with external partners, including overseas teams.
  • Strong problem-solving skills and ability to select and use appropriate methods such as 8D, DOE, and Fishbone diagrams.
  • Ability to take responsibility for managing own tasks and delivering results on time.
  • Experience preparing, presenting, and reporting results and ideas to team members, external partners, and other stakeholders.

Responsibilities

  • Lead the design and technical development of high-performance, high-density semiconductor packaging solutions for CGD GaN power products.
  • Work closely with internal stakeholders, including the GaN chip design, Application Engineering, and Operations teams, and external stakeholders such as packaging partners in the UK and overseas.
  • Design wirebond, flip-chip, and embedded semiconductor packages, including wafer back-end process modifications, to meet product goals for form factor, cost, quality, electrical performance, and thermal performance.
  • Support module development internally or with customers.
  • Support semiconductor packaging verification and qualification tests, including driving package-related performance tests such as board-level reliability and thermal characterisation.
  • Survey global suppliers for suitable packaging technologies in support of CGD product and technology roadmaps.
  • Drive package technology developments with suppliers to differentiate CGD products.
  • Conduct multiphysics simulations using finite element modelling to analyse package and system-level thermal performance, parasitic extraction, current spreading, electromagnetic fields, and thermo-mechanical stress of CGD’s GaN power packages.
  • Contribute to developing and enhancing design processes, tools, and methodologies to streamline the design flow for right-first-time solutions.
  • Build professional networks to stay up to date with state-of-the-art packaging and process development in industry and academia.
  • Conduct first-article inspection and failure analysis in the Cambridge labs and with external partners.
  • Support the Applications Engineering team and customers by providing packaging-related resources such as package outline drawings, thermal models, PCB footprints, application notes, and technical support.
  • Make a significant contribution to CGD product and technology roadmap development.
  • Lead and develop the packaging function, build future capability, and create an environment in which people can perform at their best.
  • Translate company strategy into clear functional priorities and ensure the team has the capability, focus, and resources required to deliver.
  • Work collaboratively with the Executive team, contributing expertise and perspective to wider business decisions and helping shape CGD’s future direction.

Desired Qualifications

  • Track record designing and simulating semiconductor packaging for voltages greater than 100 V, ideally for GaN power devices.
  • Experience designing and simulating power semiconductor modules at voltages of 600 V and upwards for high-power applications, with a focus on optimising and simulating low-inductance structures.
  • Experience with high-voltage power-module qualification tests, including power and thermal cycling and isolation tests such as partial discharge.
  • Experience with embedded high-voltage power packaging manufactured at panel level (PLP).
  • Experience with electromagnetic finite element modelling.
  • Experience designing and qualifying to automotive standards.
  • Experience selecting and analysing semiconductor-packaging test methods such as CSAM, X-ray, shear tests, CT, EDX, and EMMI.
  • Formal project-management training and experience, including use of JIRA for task management and issue tracking.
  • Experience managing publicly funded collaborative projects.
  • Experience in power-related products and/or designing for GaN products is advantageous.

About the Company

Cambridge GaN Devices

Designs energy-efficient GaN power devices

Cambridge GaN Devices designs GaN-based power semiconductors and outsources manufacturing as a fabless company. Its ICeGaN family uses enhancement-mode GaN transistors that run with standard silicon gate drivers and include on-chip logic and protection, delivering a single-chip solution with up to 50% lower power losses than silicon; the H2 series adds an on-chip circuit for better light-load and no-load efficiency. It stands out by prioritizing easy integration (no special circuitry or negative voltages) and offering a product roadmap from consumer electronics to data centers and EV powertrains, with Combo ICeGaN modules that pair GaN HEMTs with traditional IGBTs for high-power needs. The goal is to enable more energy-efficient power conversion to reduce energy use and CO2 emissions across electronics, data centers, industry, and mobility.

Company size
51-200
Company stage
Series C
Total funding
$64.6M
Headquarters
Cambridge, United Kingdom
Founded
2016

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