Integrated Circuit Packaging Engineer - Module Integration

Job Description

Job Responsibilities

• Work with manufacturers on component development and lead resolutions to achieve mass production
• Lead material characterization and process corner studies with suppliers
• Spearhead Root cause analysis and permanent countermeasures with the manufacturer, cross functional team of engineers, GSMs and QE with appropriate mitigation strategies 
• Work cross functionally with design and reliability engineering team, to ensure package can meet the design requirements
• Work with OSATs to bring packaging solution from concept to production
• Monitor the supplier’s yield very minutely and take appropriate actions to predict and resolve excursions
• Audit, assess and oversee equipment performance & monitor implemented process controls at several suppliers
• Assess Supplier’s PFMEA and manufacturing process controls and drive continuous improvement
• Monitor Supplier Production Capacity (Operations management)
• Owner of RFQ's and contract management - ensure Non-Disclosure Agreements, General Terms & Conditions, Piece Price Agreements, and other related contracts are negotiated, agreed and appropriately documented before business is initiated

Job Requirements

• Degree or relevant experience in Electrical Engineering, Material Science, Physics or equivalent experience
• Understands Statistical Process Control, demonstrates experience of enhancing SPC programs and has solid knowledge of statistical analysis
• Has experience of failure analysis and material analysis techniques – SEM/EDX, TEM, XRF, XRD, CSAM, spectrum analyzer, and etc.
• Detailed understanding of JEDEC, AEC-Q, RoHS and IPC and other such standards/requirements
• Has experience with NPI activities for high volume manufacturing
• Understands applications of Cpk, GR&Rs and process qualification methodologies
• Experience with PPAP
• Domestic and international travel (expected 25% of the time) is required to engage with suppliers, sometimes on short notice