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Anduril

Builds autonomous weapons for the US and allies

Electrical Engineer - Manufacturing

Hardware Validation & TestingConfirmed live in the last 24 hours
Full-timeAtlanta, GA, USAIn-person

About the Job

Requirements

  • A Bachelor of Science degree in Electrical Engineering, Computer Engineering, or an equivalent engineering field is required.
  • At least 3 years of experience in electrical manufacturing, PCBA industrialization, or hardware engineering with substantial board-level manufacturing and integration exposure in aerospace, defense, automotive, medical, or telecommunications is required.
  • Proficiency navigating, reviewing, and redlining schematics and layouts in Altium Designer, Cadence Allegro, or Mentor Graphics/PADS is required.
  • Hands-on PCBA production experience and deep understanding of SMT manufacturing, component placement, reflow profiling, wave or selective soldering, and design for manufacturability principles for rigid and rigid-flex boards are required.
  • Experience defining test coverage, test-point guidelines, and manufacturing test strategies—including ICT bed-of-nails, functional verification, and boundary scan—to inform test engineering teams is required.
  • Proficiency with Python or Bash for automated hardware interaction, instrument control, or test-log parsing is required.
  • Hands-on experience debugging, flashing, or testing over CAN, Ethernet, I2C, SPI, UART, and JTAG is required.
  • Working knowledge of IPC-A-610 and IPC J-STD-001 electronic assembly standards is required.
  • U.S. Person status is required to access export-controlled data.

Responsibilities

  • Partner with Electrical Hardware Design Engineers during schematic capture and layout to optimize complex multilayer rigid and rigid-flex boards for automated SMT production.
  • Review board layouts in Altium Designer, Cadence Allegro, or Mentor Graphics to verify pad geometries, solder-mask dams, trace clearances, via-in-pad plating, and component spacing to maximize assembly yields.
  • Review component footprints, connector sections, and active IC packages for manufacturability and functionality with production processes.
  • Ensure manufacturing test strategies across board and subassembly levels are executable, covering in-circuit testing, flying probe, boundary scan (JTAG), and connectorized functional verification tests. Establish test limits, pass/fail criteria, and fault-coverage metrics for handoff to Manufacturing Test Engineering.
  • Partner with Electrical Design Engineers during schematic capture and layout to establish design-for-testability guidelines, including adequate test-point density, probe access, net observability, and connector accessibility for production test fixtures.
  • Define standard test processes, routing sequences, and flashing/calibration workflows for the factory floor. Work with Manufacturing Test Engineering to integrate automated test fixtures, instrumentation racks, and software suites into production-line routings and manufacturing execution system data tracking.
  • Analyze production test yield fallout and telemetry to determine whether failures stem from component defects, SMT process variation, or test-fixture/coverage escapes, and feed actionable findings back into test and design loops.
  • Develop and use diagnostic scripts in Python and Bash to exercise board interfaces, log diagnostic telemetry, and support hardware verification during initial manufacturing bring-up.
  • Support initial board bring-up on the manufacturing line across embedded compute platforms such as AMD/Xilinx Zynq UltraScale+ SoCs, ARM Cortex processors, and high-speed memory interfaces.
  • Define production flashing, secure-key provisioning, and interface-validation procedures over embedded buses and protocols including MIL-STD-1553, PCIe, Ethernet, CAN, SPI, I2C, UART, and JTAG.
  • Collaborate with Embedded Software, FPGA, and Test Engineering teams to specify low-level test hooks, C/C++ firmware images, or register-level diagnostic routines for validating hardware health.
  • Enforce high-reliability aerospace workmanship standards across internal integration lines and external EMS suppliers in accordance with IPC-A-610 and IPC/WHMA-J-STD-001 Class 3 criteria.
  • Lead electrical failure analysis and root-cause investigations (8D) on production fallouts, including microsection evaluation, X-ray (AXI) inspection, solder-bridge analysis, component-counterfeit screening, and component-level ESD damage assessment.
  • Support environmental stress screening, including manufacturing screening strategies aligned with MIL-STD-810, MIL-STD-461, and MIL-STD-704 guidelines.
  • Qualify and audit external PCBA contract manufacturers, reviewing SMT stencil designs, solder paste inspection, automated optical inspection, reflow thermal profiles, and conformal-coating or potting applications.
  • Transition engineering BOMs into production-ready manufacturing BOMs within PLM (Teamcenter), ensuring electrical alternate components are qualified and traceable.
  • Author standard operating procedures and work instructions for electronics handling, ESD control, wire-harness interconnects, and module-level box builds.

Desired Qualifications

  • At least 5 years of experience taking complex electronic systems from NPI through full-rate production is preferred.
  • Experience with AMD/Xilinx Zynq UltraScale+, FPGA architectures, or high-speed digital designs such as PCIe and multi-gigabit Ethernet is preferred.
  • Familiarity with military and aerospace compliance standards, including MIL-STD-461, MIL-STD-810, MIL-STD-704, and DO-254 hardware development life cycles is preferred.
  • Experience with complex board architectures, including multilayer high-speed digital boards with 12 or more layers, rigid-flex circuits, HDI, and blind/buried microvias is preferred.
  • Experience using Siemens Teamcenter (PLM), modern ERP/MES platforms, and Jira for engineering workflow tracking is preferred.
  • IPC-A-610 / J-STD-001 Application Specialist (CIS) or Trainer (CIT) certification is preferred.

About the Company

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Anduril

Builds autonomous weapons for the US and allies

Anduril builds autonomous weapons, such as drones, cruise missiles, and robot submarines, for the US military and its allies, often developing them with its own money before any order arrives. In 2024 it beat Boeing, Lockheed Martin, and Northrop Grumman for an Air Force contract to develop Fury, a pilotless jet that flies alongside crewed fighters. Its Lattice software merges camera and radar feeds into one live map and lets a few operators direct many drones and weapons at once, including other companies' systems. Governments buy its systems under contract, and Anduril builds much of the hardware in its own factories. Oculus founder Palmer Luckey co-founded Anduril in 2017, and it is based in Costa Mesa, California.

Company size
10,001+
Company stage
Private
Total funding
$11.5B
Headquarters
Costa Mesa, CA
Founded
2017

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