Lyte AI

Robotics perception platform with silicon-level fusion

Packaging and Assembly Lead

Manufacturing EngineeringConfirmed live in the last 24 hours

Full-timeSunnyvale, CA, USAIn-person

About the Job

Requirements

A Master’s or Ph.D. degree with at least 8 years of relevant experience.
Experience with process integration for process-flow design and continuous process improvement.
Prior experience in microelectronic and optical-device packaging.
Project-management capability or experience.
Experience working with foundries, OSATs, PCBA fabrication facilities, and contract manufacturers in process development and yield improvement.
Experience with failure mode and effects analysis, failure analysis, and 8D reports.
Ability to work independently, take ownership of projects, and collaborate in cross-functional teams.
Ability to protect confidential company information and intellectual property.

Responsibilities

Lead the NPI process team across wafer, device-packaging, and PCBA assembly process improvement and optimization to improve yield through material selection optimization, process refinement, or specification openings for design-of-experiments corner-case studies.
Communicate with the R&D team to understand design targets, existing specifications and process flows, process maturity, and yield for each process step.
Lead tradeoffs between design and process.
Work with wafer foundries and OSATs to support NPI and volume-production contract manufacturing.
Lead process-integration checks to ensure upstream processes do not adversely affect downstream process yield.
Act as the technical program manager for the operations process team.
Provide design-for-manufacturing, design-for-reliability, and design-for-test inputs to headquarters R&D teams for device tapeout design and device packaging during the design phase.
Develop and maintain packaging and component specifications, as well as inventory tracking.
Audit and regularly visit contract manufacturers and suppliers, and provide reports.
Write technical reports and present results to internal and external stakeholders.
Build and grow the worldwide Operations Process Team.
Write technical statements of work.
Drive process capability, process performance, and yield improvement.

Desired Qualifications

Experience with process-flow design, statistical process control, particularly Six Sigma and Lean manufacturing continuous-improvement plans, and material-staging concepts.
Familiarity with data-analysis software such as JMP.
Knowledge of wafer-level processes, including lithography, thin film, plating, and DIE/DRIE.
Experience with PCBA processes.
Understanding of silicon photonics.
Experience in III-V wafer processes, bar-level processes, and CoC packaging.
Supplier-quality management experience.
Knowledge of lidar and related technologies.
Prior experience writing technical statements of work.
Familiarity with engineering change notices, product change notices, and documentation.

About Lyte

Lyte builds perception systems for Physical AI operating in complex environments. The company combines custom silicon, integrated sensors, and software into a unified platform for robotics, mobility, and next-generation automation. Lyte is headquartered in Sunnyvale, California, with a global presence. For more information, visit www.lyte.ai

If you’re excited about building impactful technology in a dynamic, hands-on environment, we’d love to hear from you!

About the role

We are seeking an experienced process lead/Manager in the field of optical sensor device packaging and contract manufacture with a degree in Electrical Engineering, Photonics, Mechanical Engineering, Physics or a related field.Describe the role and team the candidate will be joining

What you'll do

Lead NPI process team involving wafer, device packaging, PCBA assembly process improvement and optimization for yield improvement through material selection optimization, process refinement, or specs opening through DOE for corner case studies.
Communicate with the RnD team to understand the design targets, existing specs, and existing process flow, process maturity, and its related yield for each process step.
Lead the tradeoff between the design and process.
Work with our wafer foundries and OSATs to support NPI and volume production contract manufacture.
Lead process integration check to ensure the upstream process will not affect the downstream process yield.
Act as the technical program manager for operation process team.
Provide DFM, DFR, DFT inputs for HQ RnD teams for device tapeout design ad device packaging during the design phase.
Develop and maintain packaging and component specifications as well as inventory tracking.
Audit/regularly visit our contract Manufacturers and suppliers then provide reports.
Write technical reports and present results to internal and external stakeholders.
Build and grow the Operation Process Team worldwide.
Write technical SOW.
Drive Cp, Cpk, and yield improvement.

Required Qualifications

Minimal requirement is a Master or Ph.D. degree with 8 years of relevant experience.
Experience with process integration for process flow design and continue process improvement.
Former experience of microelectronic and optical devices packaging is a must.
Project management capability/experience is a must.
Experience working with foundries, OSATs, PCBA fab, and contract manufacturers in process development and yield improvement is important.
Experience with FMEA, failure analysis, and 8D report.
Ability to work independently and take ownership of projects as well as collaboratively in cross-functional teams is a must.
Fast learner is a must.
Good work ethics is a must
Capable of keeping company confidential information and IP is a must.

Preferred Qualifications

Experience on process flow design, and SPC, particularly the six sigma and Lean manufacture continuing improvement plan, and material staging concept are highly desirable.
Familiar with data analysis software such as JMPs is a plus.
Knowledge of wafer level process including lithography, thin film, plating, and DIE/DRIE is a plus.
Experience with PCBA process is highly desirable.
Understanding Silicon Photonics is a plus.
Experience in IIIV wafer process, bar level process, and CoC packaging is a plus.
Supplier quality management experience is a plus.
Knowledge of Lidar and relevant technologies is a plus.
Former experience of writing technical SoW is a plus.
Familiar with ECN, PCN and documentation are highly desirable.

Benefits

Competitive salary and equity
Comprehensive medical, dental, and vision coverage
401(k) retirement plan
Flexible vacation and time-off policy
Collaborative, fast-paced, and inclusive work environment
Opportunity to work on cutting-edge technologies with a highly cross-functional team

About the Company

Lyte AI

Robotics perception platform with silicon-level fusion

Lyte AI builds an end-to-end perception stack for robots, from custom sensing silicon to software. Its LyteVision platform combines camera data, inertial measurements, and a 4D distance-velocity sensor into a single synchronized data stream at the silicon level. This reduces latency and calibration drift that can occur when stitching together separate sensors. The system is designed for industrial uses such as inspection, logistics, and manufacturing robots, and also aims to power broader Physical AI platforms. The company differentiates itself through its fully integrated, silicon-level sensor fusion and a pedigree of engineers who helped create depth sensing for devices like Face ID and Kinect, backed by substantial funding to scale silicon production and deployments. Its goal is to provide reliable, low-latency robot perception to enable scalable automation across industrial settings.

Company size: 51-200
Company stage: Series C
Total funding: $272M
Headquarters: Mountain View, CA
Founded: 2021

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