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Kandou AI

Provides chip-to-chip AI connectivity solutions

Digital Verification Engineer

Hardware Validation & TestingConfirmed live in the last 24 hours
Full-timeNo salary listedHybrid

About the Job

Requirements

  • Strong scripting techniques, regression setup, and management.
  • Deep understanding of simulation and verification environments.
  • Strong knowledge of metrics-driven verification, including test planning and coverage closure.
  • Deep knowledge of simulation tools and debugging techniques.
  • Understanding of verification planning and test bench development using current methodologies.
  • At least 5 years of experience in the semiconductor industry.
  • A proven track record verifying complex designs, preferably in high-volume applications, using FPGA or ASIC.
  • Skilled in balancing quality and schedule trade-offs.
  • Experience in constrained-random test bench development.
  • Extensive digital verification background with some Universal Verification Methodology (UVM) experience.
  • Bachelor of Engineering in Electronics and Electrical Engineering, or equivalent or higher.

Responsibilities

  • Develop design verification methodologies and implement standard debug flows.
  • Work with designers on verification and validation of circuit designs.
  • Participate in design reviews.
  • Prepare design verification plans based on design specifications.
  • Plan and schedule assigned projects for timely completion.
  • Use current techniques, tools, and technologies for design verification activities.
  • Maintain the design verification environment and track and close design bugs.

Desired Qualifications

  • Experience with third-party Verification IP (VIP) usage and test development.
  • Experience with Assertion-Based Verification.
  • Familiarity with SerDes and high-level protocols such as PCIe, USB, and DisplayPort.

About the Company

Kandou AI

Provides chip-to-chip AI connectivity solutions

Kandou AI designs and sells semiconductor connectivity hardware for AI workloads. It provides a memory fabric and CXL controllers that link processors to memory, enabling scalable, energy-efficient AI inference and training clusters built from affordable hardware. Using Copper MIMO interconnect, it reduces energy per bit and supports features like offloading AI training collectives, switchless memory for in-memory databases, and field-repairable co-packaged optics for better cooling. By targeting the data-movement bottleneck between processors and memory and offering chiplet-based fabrics and IP licensing, Kandou AI aims to make scalable AI infrastructure more accessible to hyperscalers, data centers, and system integrators.

Company size
201-500
Company stage
Late Stage VC
Total funding
$504.7M
Headquarters
Lausanne, Switzerland
Founded
2011

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