A

Applied Materials

Builds equipment for chip and display factories

Product Line Manager

Full-TimeUpdated on 10/23/2026Deadline 12/31/26
No salary listed
Expert
Bachelor's, Master's
Bengaluru, Karnataka, India
In PersonBased in Bangalore, India; travel required 10% of the time.
ProductProduct Management

About the job

Requirements
  • A bachelor's degree in Mechanical Engineering, Electrical Engineering, Electronics Engineering, Industrial Engineering, or a related technical discipline is required.
  • At least 8 years of experience in Product Line Management, Product Management, Program Management, Sustaining Engineering, or semiconductor capital equipment industries is required.
  • Strong experience with Engineering Change Orders, Product Change Management, Bills of Materials management, and configuration control is required.
  • Experience working across engineering, manufacturing, supply chain, and customer-facing organizations is required.
  • Strong analytical, problem-solving, and decision-making skills are required.
  • Excellent communication and stakeholder management abilities are required.
  • Strong leadership and influencing skills in a matrix organization are required.
  • Expertise in product governance, change management, and configuration control is required.
  • Business acumen to balance customer needs, operational requirements, and profitability objectives is required.
  • Strong collaboration skills and ability to drive alignment across diverse stakeholder groups are required.
  • A continuous improvement mindset focused on product quality, customer satisfaction, and operational excellence is required.
Responsibilities
  • Own the overall performance, governance, and lifecycle of assigned semiconductor equipment product lines.
  • Drive execution of product line strategies, product roadmaps, and market proliferation initiatives.
  • Align business objectives, customer requirements, technology roadmaps, and operational capabilities.
  • Serve as the primary cross-functional lead for post-release product activities.
  • Own Product Change Management processes and governance.
  • Manage unreleased product approvals and release readiness activities.
  • Review and approve Engineering Change Orders.
  • Drive implementation of Part Change Notifications in partnership with Global Product Support teams.
  • Evaluate and implement engineering, quality, supply chain, safety, and customer-driven product changes.
  • Ensure accuracy of customer-shipped configurations and Bills of Materials.
  • Lead Configuration Accuracy Review Meetings.
  • Review and approve Non-Standard Requests.
  • Own common module roadmap execution following Phase 5 of the ePLC process.
  • Drive implementation of component and subsystem roadmaps.
  • Manage component obsolescence, alternate part qualifications, supplier transitions, and lifecycle risks.
  • Lead initiatives to improve product reliability, manufacturability, serviceability, and supportability.
  • Ensure successful implementation of product sustainment strategies across installed product platforms.
  • Review and approve field service-related activities impacting customers.
  • Assess and prioritize system feedback, corrective actions, and enhancement requests.
  • Drive implementation of product improvements based on customer, service, and market requirements.
  • Support pricing guidance, spare parts strategies, and restricted component management.
  • Partner with engineering, quality, and service organizations to resolve critical product issues.
  • Drive cost reduction initiatives and product profitability improvements.
  • Manage strategic supplier and vendor-related issues affecting product quality, availability, and cost.
  • Facilitate collaboration across Product Marketing, Engineering, Manufacturing, Supply Chain, Quality, Service, and Global Product Support teams.
  • Lead product alignment reviews and decision-making forums related to roadmap execution and business priorities.
  • Support strategic planning and long-term product competitiveness.
  • Interpret internal and external business challenges and recommend best practices to improve products, processes, or services.
  • Lead functional teams or projects with moderate resource requirements, risk, or complexity.
  • Lead others to solve complex problems, using sophisticated analytical thought to exercise judgment and identify innovative solutions.
  • Impact customer, operational, project, or service objectives, with work guided by functional policies.
  • Communicate difficult concepts and negotiate with others to adopt a different point of view.
Desired Qualifications
  • A master's degree in Engineering or Business Administration is preferred.
  • Experience with product lifecycle management, enterprise resource planning, and product configuration management systems is preferred.
  • Knowledge of semiconductor equipment products and industry practices is preferred.
  • Experience in product cost reduction, supplier management, and obsolescence planning is preferred.
  • Demonstrated ability to lead global cross-functional initiatives is preferred.

About the company

Applied Materials designs and builds precision machines that chipmakers and display manufacturers use to form, shape and inspect thin layers of material. Its platforms handle steps such as depositing films and removing unwanted material, helping chipmakers create transistors and wiring at atomic scale. Customers include makers of logic chips and memory, as well as manufacturers of advanced displays. The company earns money from equipment sales, replacement parts and services, and factory software that schedules production and monitors manufacturing processes. Applied Materials was founded in 1967 and is headquartered in Santa Clara, California.

Company Size

10,001+

Company Stage

IPO

Headquarters

Santa Clara, California

Founded

1967

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Simplify's Take

What believers are saying

  • Installed equipment brings repeat business: Applied Global Services sells long-term service agreements, replacement parts and equipment upgrades.
  • Sales are expanding: Applied's August 2026 report showed fiscal Q3 revenue of $9.12 billion, up 25% yearly.
  • Employees join profitable operations: Applied reported $3.08 billion of operating profit for fiscal Q3 in August 2026.

What critics are saying

  • Singapore manufacturing hires face late shifts: Applied's live engineering posting specifies 4 p.m. to 1:30 a.m. schedules.
  • Export compliance has real costs: Applied and its Korea subsidiary settled a $252 million penalty in February 2026.
  • Sales depend on China access: Applied's December 2025 filing attributed 30% of fiscal 2025 revenue to customers there.

What makes Applied Materials unique

  • Applied combines manufacturing steps under vacuum: its Endura copper platform integrates seven processes to protect delicate material interfaces.
  • Factory software reaches beyond chips: Applied SmartFactory serves battery and pharmaceutical manufacturers alongside semiconductor plants.
  • Research targets future chip generations: Applied's EPIC partners work on technology three to four generations ahead of production.

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Benefits

  • Health Insurance
  • Dental Insurance
  • Vision Insurance
  • Life Insurance
  • Disability Insurance
  • Relocation Assistance
  • Performance Bonus
  • Stock Options
  • Flexible Work Hours

Growth & Insights and Company News

6 month growth

0%

1 year growth

-1%

2 year growth

-1%
Chief in Tech
Oct 16th, 2026
China's chip sector accelerates amid U.S. Export controls, redefining global tech dynamics.

China's chip sector accelerates amid U.S. Export controls, redefining global tech dynamics. 10/16/2026 Your morning in 30 seconds. * China's semiconductor industry surges ahead, fueled by U.S. export controls (Fortune). * Applied Materials and Intel announce a new partnership to accelerate AI-focused chipmaking (DQIndia). * ASML's hybrid bonder patent signals the next wave of advanced chip packaging (DigiTimes). * U.S. chipmakers' overseas production dependence exceeds 95%, SIA reveals (DigiTimes). * Asia startup funding tops $353M this week, led by Tessolve in semiconductors (Techloy). The lead. China's chip sector advances amid export controls. * China's domestic semiconductor sector is making rapid breakthroughs, with export controls from the U.S. acting as a catalyst for increased innovation and self-sufficiency (Fortune). * Recent advancements include new chip manufacturing capabilities and increased market share for Chinese suppliers. * The sector's progress is shifting the geopolitical balance in global technology supply chains. * U.S. restrictions, intended to slow China's progress, have instead accelerated domestic R&D and investment in Chinese chip firms. * The development raises questions about future supply chain resilience and the potential need for supplier diversification. * Source: Fortune * Why it matters: Executives must reassess supply chain strategies and risk exposure as geopolitical forces drive rapid realignment in global chip manufacturing. What changed. Applied Materials and Intel partner on AI chipmaking. * Applied Materials and Intel have formed a strategic collaboration to develop next-generation semiconductor fabrication processes tailored for AI workloads (DQIndia). * The partnership will focus on overcoming scaling challenges and boosting chip performance for advanced computing. * This move is designed to maintain a competitive edge in the race for AI hardware innovation. * Source: DQIndia * Implication: Tech leaders should watch for new fabrication technologies that could influence AI infrastructure roadmaps. ASML's hybrid bonder patent drives packaging innovation. * ASML has patented a hybrid bonder, a key enabler for advanced chip packaging as traditional scaling approaches hit physical limits (DigiTimes). * The technology is expected to improve efficiency and performance in semiconductor manufacturing. * This move reflects growing industry focus on packaging as a differentiator for next-gen chips. * Source: DigiTimes * Implication: Executives should evaluate how packaging advances may alter chip design, procurement, and partnerships. SIA finds U.S. Chipmakers rely heavily on overseas production. * The Semiconductor Industry Association (SIA) reports that U.S. chipmakers source 95% of their manufacturing equipment and materials from foreign suppliers (DigiTimes). * The finding contradicts previous assumptions about domestic self-sufficiency. * Heightened geopolitical risks highlight the need for robust supply chain strategies. * Source: DigiTimes * Implication: Supply chain diversification and contingency planning should be board-level priorities. Asia startup funding surges, led by Tessolve. * Asia's tech startups raised $353.73 million in the past week, with major investments in semiconductors, robotics, and electric mobility (Techloy). * Tessolve, a semiconductor firm, tops the funding list, reinforcing the region's growing influence in deep tech. * The funding landscape signals opportunities for new partnerships and expansion in Asia. * Source: Techloy * Implication: Executives exploring global growth should prioritize engagement with Asia's dynamic startup ecosystem. Cybersecurity job postings hit four-year low. * Cybersecurity job postings have dropped to the lowest level since 2022, according to Help Net Security. * Compliance roles are increasingly sought after, while CISO hiring remains volatile. * The trend suggests an industry-wide reevaluation of cybersecurity needs and workforce planning. * Source: Help Net Security * Implication: Rethink talent acquisition and upskilling strategies to align with evolving security priorities. Signals. * Iberdrola, BBVA, and Santander complete a €150M syndicated loan entirely on blockchain, advancing financial transparency (The Paypers). * Flipkart alumni advocate for ESOP buyouts, spotlighting ongoing debates over employee equity (Economic Times). * BTQ partners with MoonPay Korea to bolster stablecoin security, reinforcing the importance of digital asset protection (The Paypers). * Mastercard and BVNK launch a global money platform integrating fiat and stablecoin payments, aiming for real-time, cross-border efficiency (The Paypers). Chief in Tech Perspective: This week's deeptech surge is a call to action for women leaders in technology: proactive board engagement on supply chain, innovation, and cybersecurity is critical as global dynamics shift. Championing diverse leadership at the intersection of semiconductors, AI, and fintech will be essential for navigating risk and seizing new opportunities.

TechNode Global
Oct 15th, 2026
Applied Materials unveils $5B semiconductor R&D center in Silicon Valley.

Applied Materials unveils $5B semiconductor R&D center in Silicon Valley. Applied Materials has unveiled an Equipment and Process Innovation and Commercialization Center in Silicon Valley, a US$5 billion investment intended to support semiconductor equipment and process research. The company described the EPIC Center as a 600,000-square-foot facility bringing chipmakers, equipment manufacturers and university researchers together to accelerate the development of new semiconductor technologies. Applied Materials identified TSMC, Intel, Samsung, Micron and SK hynix among founding partners. Other companies cited in the announcement include Broadcom, Advantest, SCREEN, KIOXIA and Besi. The project is aimed at reducing the time between research breakthroughs and high-volume chip manufacturing, as growing AI demand raises performance and efficiency requirements. Its anticipated benefits are company expectations, not independently verified development outcomes. The facility is in the United States, but several announced participants are headquartered in Asia, giving the project a direct connection to the region's semiconductor industry.

Tech in Asia
Oct 15th, 2026
Applied Materials opens $5B AI chip research hub with TSMC, Intel, Samsung, Micron and SK hynix

Applied Materials has unveiled an AI chip research hub that brings together chipmakers, equipment suppliers, and university researchers to develop chipmaking technologies for AI. The centre spans 600,000 square feet and includes nearly four acres of cleanroom space for semiconductor process technology and equipment research. Founding partners are TSMC, Intel, Samsung, Micron, and SK hynix. Research partners include Arizona State University, Stanford University, the University of California, Berkeley, the UCLA Samueli School of Engineering, and Rensselaer Polytechnic Institute. Applied Materials expects capital spending to reach about $5 billion over time as customer projects begin.

DIGITIMES
Oct 15th, 2026
Applied Materials targets US$5 billion advanced packaging revenue.

Applied Materials targets US$5 billion advanced packaging revenue. , San Francisco Oct 15, 2026, 10:23 0 Credit: DIGITIMES Applied Materials sees advanced packaging as a key growth lever as AI chips move to multi-die designs, with the company projecting more than US$5 billion in related revenue in the coming years... Picks for you

Yahoo Finance
Oct 14th, 2026
Applied Materials vs Intel: why the $9.1B-quarter equipment maker beats the foundry turnaround

A Motley Fool comparison of chip equipment maker Applied Materials and chipmaker Intel favours Applied Materials as the better 2026 buy, though the author suggests buying shares gradually. Applied Materials' revenue rose 25% to $9.1 billion in the quarter ended July 26, 2026, and net income rose 43% to $2.5 billion. Risks include cyclical demand and China, which made up 28% of revenue. In February 2026 it agreed to pay $252.5 million to settle US export allegations. Intel's second-quarter revenue also rose 25%, to $16.1 billion. It posted an $11.0 billion net loss, driven by a $12.5 billion noncash charge tied to its US government deal. Its foundry unit lost $2.1 billion, and an August share sale raising about $23 billion diluted existing owners. On valuation, Applied trades at 42.2x forward earnings against Intel's 77.7x.