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MaxLinear

Fabless RF/analog/mixed-signal IC designer

Senior Staff Systems Applications Hardware Engineer - Optical Products

Implementation & Technical Account ManagementConfirmed live in the last 24 hours
Full-timeHsinchu, North District, Hsinchu City, TaiwanNo salary listedIn-person

About the Job

Requirements

  • A BS or MS in Electrical Engineering and at least 3 years of experience in optical modules and long-haul or data center transceiver product design.
  • Broad knowledge of analog circuits, system hardware integration, firmware, and application-layer software issues.
  • Experience in 400G, 800G, or 1.6 transceiver design with DML, EML, SiPho Driver/TIA/CDR/DSP/PAM4, including circuit design, hardware/software debugging, and application support.
  • Experience in high-speed digital and RF/Microwave PCB design.
  • Familiarity with lab instruments including spectrum analyzers, signal generators, network analyzers, Digital Communication Analyzers (DCA), Optical DCA Sampling Oscilloscopes, Optical/Electrical Clock Recovery (CDR), logic analyzers, protocol analyzers, and BER testers.
  • Strong ownership of driving customer issues to closure and acting as the interface between customers and internal engineering to resolve technical issues.
  • Ability to write and maintain datasheets, technical application notes, and user guides.
  • Technical capability to guide customers through product usage.
  • Excellent verbal and written communication skills in English for communicating with customers and internal marketing, engineering, sales, and operations groups.

Responsibilities

  • Work with Sales and FAE teams to secure design wins and strengthen relationships with key customers and strategic partners.
  • Communicate and clarify customer-required system specifications and application requirements.
  • Demonstrate MaxLinear product evaluations and present technical seminars at customer sites and trade show events.
  • Support and track customer design, bring-up, validation, and debugging activities.
  • Provide product and technical training for regional Sales and FAE teams.
  • Reproduce customer-reported issues, complete primary debugging, clarify issue details, and provide accurate information to internal teams.
  • Support regression and stress testing.
  • Gather customer and market information to support marketing, perform feasibility studies on new product features, support the Marketing team in defining new products and product roadmaps, and conduct competitive intelligence studies and analyses.
  • Build reference designs for system validation and customer evaluation.
  • Develop product test plans and generate test reports.
  • Generate product collateral and customer support documents, including application notes, datasheets, and user guides.
  • Work with Engineering teams to improve product reliability, quality, and user experience.
  • Conduct field testing and analysis for new products.
  • Manage and support PCB and assembly vendors for purchasing parts and building PCBs and PCBAs.
  • Manage, test, and deliver EVKs to FAEs or customers.

Desired Qualifications

  • Experience with RF/SI simulation tools such as ADS or HFSS.
  • Experience in 400G, 800G, or 1.6 transceiver design with DML, EML, SiPho Driver/TIA/CDR/DSP/PAM4, including circuit design, hardware/software debugging, and application support.
  • Experience in driver integration and ATE development for platform characterization and debugging.

About the Company

MaxLinear

Fabless RF/analog/mixed-signal IC designer

MaxLinear designs and sells RF, analog, and mixed-signal ICs for broadband, connectivity, infrastructure, and industrial markets. It offers system-on-chip solutions for cable broadband, fiber-to-the-home networks, and Wi-Fi, plus RF transceivers and high-speed interconnects for data centers, set-top boxes, automotive video systems, and mobile devices. It is a fabless company that outsources manufacturing to foundries like UMC and targets OEM, ODM, and module makers, expanding its portfolio through acquisitions such as Exar, Intel’s Home Gateway Platform Division, and NanoSemi. Its goal is to provide scalable, high-quality semiconductor solutions that enable reliable connectivity across home, mobile, automotive, and data-center applications, while growing through diversified products and strategic acquisitions.

Company size
1,001-5,000
Company stage
IPO
Headquarters
Carlsbad, CA
Founded
2003

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