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Texas Instruments

Texas Instruments

Analog and embedded processing semiconductors

Analog IC Design Engineer Intern - Bachelors

Winter 2026
No salary listed
Internship
Bachelor's
Knoxville, TN, USA+3 more

More locations: Dallas, TX, USA | Phoenix, AZ, USA | Tucson, AZ, USA

In Person
No H1B Sponsorship

About the job

Requirements
  • Currently pursuing an undergraduate degree in Electrical Engineering, Computer Engineering, or Electrical & Computer Engineering.
  • A cumulative GPA of 3.0/4.0 or higher.
  • Texas Instruments will not sponsor job applicants for visas or work authorization for this position.
Responsibilities
  • Architect new Texas Instruments products and define, design, model, implement, and document analog, digital, and radio frequency integrated circuits.
  • Partner with business teams and systems engineering to develop mutually agreeable design specifications.
  • Provide high-level analysis of chip architecture trade-offs to ensure specification compliance and superior performance at a competitive cost.
  • Participate in design reviews and create the necessary design and product documentation.
  • Supervise integrated circuit layouts to ensure a high-performance standard.
  • Characterize prototypes, develop test specifications, and coordinate with test and product engineering to drive product releases.
  • Drive behavioral models.
Desired Qualifications
  • Ability to establish strong relationships with key stakeholders critical to success, both internally and externally.
  • Strong verbal and written communication skills.
  • Ability to quickly ramp on new systems and processes.
  • Demonstrated strong interpersonal, analytical, and problem-solving skills.
  • Ability to work in teams and collaborate effectively with people in different functions.
  • Ability to take the initiative and drive for results.
  • Strong time management skills that enable on-time project delivery.

About the company

TI designs and manufactures semiconductors, focusing on analog and embedded processing chips used by OEMs in automotive, industrial, consumer electronics, communications, and enterprise systems. Analog chips convert real‑world signals into digital data, while embedded processing chips act as the device’s brains to run specific tasks. It differentiates itself through a broad, proven portfolio, long-standing OEM relationships, and a global manufacturing footprint, alongside CSR efforts and a strong focus on employees (TIers). Its goal is to provide reliable semiconductor solutions that help customers build efficient, capable products across industries while supporting sustainable practices and community initiatives.

Company Size

10,001+

Company Stage

IPO

Headquarters

Dallas, Texas

Founded

1951

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Simplify's Take

What believers are saying

  • Q2 2026 revenue reached $5.46 billion, up 23%, and EPS beat estimates.
  • TI’s September 2026 price increases start lifting revenue and margins in Q3 and Q4.
  • SM1 production began in Sherman in 2026, expanding internal capacity for 300mm analog chips.

What critics are saying

  • September 2026 price hikes trigger customer pushback and share loss against ADI and ON.
  • Texas Business Court denied TI’s injunction on August 24, 2026, weakening trade-secret protection.
  • Sherman ramp delays or contamination incidents would undermine TI’s capital-intensive manufacturing bet by 2028.

What makes Texas Instruments unique

  • TI’s 300mm U.S. manufacturing scale, including Sherman SM1, cuts dependence on foundries.
  • Analog and embedded processing breadth gives TI sockets across automotive, industrial, and data centers.
  • India INR direct bulk purchasing and local applications support deepen customer lock-in.

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Benefits

Hybrid Work Options

Growth & Insights and Company News

Headcount

6 month growth

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TimesTech
Sep 16th, 2026
TI showcases semiconductor innovations for electric mobility and sustainable energy at electronica India 2026.

TI showcases semiconductor innovations for electric mobility and sustainable energy at electronica India 2026. September 16, 2026 Texas Instruments, is bringing more than 20 live demonstrations of its latest analog and embedded processing technologies to electronica India 2026, taking place between September 16-18 at Bengaluru International Exhibition Centre (BIEC). India is shifting toward clean energy, driving accelerated growth in applications that demand precise power management, sensing and processing capabilities. TI is showcasing how its semiconductors enable greater efficiency and reliability across the electric vehicle, sustainable energy and industrial markets. As part of strengthening TI India's commitment to the local market, TI now enables customers in India to purchase bulk orders directly from TI in Indian rupees (INR), delivering greater convenience and a more seamless buying experience. Combined with TI's local design and applications expertise, this reflects TI's dedication to working closely with Indian customers and helping them move from concept to production with greater speed and confidence. "As engineers inventing for engineers, TI focuses on designing and manufacturing semiconductor technologies that help our customers solve increasingly complex challenges," said Santhosh Kumar, managing director and president, TI India. "We have been part of India's semiconductor landscape for 40 years, and our commitment here has never been stronger. electronica India 2026 gives us the opportunity to connect directly with the engineers shaping India's next wave of innovation, building products that are smarter, safer and more energy efficient." Semiconductor technologies enable smarter, safer electric mobility. With India's adoption of electric mobility accelerating, TI's semiconductors are enabling engineers to address the growing complexity of electric vehicle architectures, from power management and battery performance to real-time sensing and processing. * Smarter vehicle architecture: TI is showcasing a 3D car wireframe featuring software-defined vehicle (SDV) central compute, zone control modules, 48V wiper and a Gallium Nitride (GaN)-enabled 48V audio amplifier, along with real-time wheel-speed tracking. * Commercial vehicle advanced driver assistance systems (ADAS): TI is demonstrating 1V3R (1x camera, 3x radar) solution capable of meeting the technical requirements of ADAS mandates that apply to commercial vehicles in India. Intelligent sensing and power conversion accelerate sustainable energy. As India scales renewable energy and modernizes its power infrastructure, TI's semiconductor technologies are driving greater efficiency, reliability and intelligence across applications such as solar inverters, smart-grid infrastructure, motors and appliances. * Single phase string inverter: TI is demonstrating a GaN-based 3.6kW string inverter with a single microcontroller controlling a H-Bridge bipolar modulated DC/AC inverter and a single string photovoltaic input with maximum power point tracking. The converter is optimized for high frequency operation to minimize total solution cost and size. It achieves >96.5% efficiency at full power. The single-phase string inverter platform is intended to accelerate the development of residential solar power systems. * Meshed network architecture: TI is showcasing a Wirepas Platform, which is a standard-based connectivity platform built for infrastructure-grade IoT deployments at massive scale. It consists of two components, Wirepas mesh connectivity and the Wirepas Network Management System, and addresses diverse geographies and use cases through a wide range of radio profiles. Making it more convenient to buy TI technology in India. TI is continuing to strengthen its commitment to the Indian market by making its products easier to access and buy locally. In addition to buying directly on TI.com in Indian rupees, TI has now expanded INR capabilities to eligible customers in India through their backlog channel. INR billing offers greater cost predictability and flexibility with better delivery terms for its customers in India. By combining semiconductor technologies with local engineering expertise, technical support and a more convenient purchasing experience, TI is helping Indian customers design and build products for evolving automotive, energy and industrial applications. TI at electronica India 2026. At electronica India 2026, in Hall 5, Booth B21, BIEC, TI will demonstrate how innovation across its analog and embedded processing portfolios is enabling what's next in electric mobility and sustainable energy, with engineers on-site to discuss how TI's solutions can address the challenges facing Indian engineers. See ti.com/electronica-india for more information.

Yahoo Finance
Sep 14th, 2026
Texas Instruments up 55% in 2026 as industrial demand jumps 30% and data centre revenue doubles

Texas Instruments' stock has surged 55% year-to-date, reaching $264.70, significantly outperforming the broader market. The company reported second-quarter revenue growth of 23% year-over-year, driven by a 30% increase in industrial demand and doubling data centre revenue. CEO Haviv Ilan highlighted that growth was broad-based across sectors and regions. The company's analog segment grew 26%, with embedded processing also expanding. Texas Instruments outpaced rivals Analog Devices, which gained 35%, and Microchip Technology, up 15%. The company built fabrication capacity during the market downturn to capture market share. Analog chip prices remained flat in the first half of 2026, defying typical annual declines, as Texas Instruments began implementing customer-by-customer price increases in the third quarter.

Yahoo Finance
Sep 11th, 2026
TXN raises prices in Q3 2026 to boost revenues and margins as semiconductor demand strengthens

Texas Instruments has begun raising prices on its semiconductors after maintaining stable pricing in the first half of 2026, management confirmed during its second-quarter earnings call. The increases are being negotiated with customers and are expected to contribute to revenue growth starting in the third quarter. The move comes from a position of strength. Second-quarter revenues rose 23% year over year to $5.46 billion, whilst operating profit jumped 47.8% to $2.31 billion. Analogue revenues increased 26%. Management expects only a small pricing contribution to third-quarter growth initially, with most sequential revenue gains coming from higher unit volumes. However, sustained price increases could support margins if demand remains strong across industrial, automotive, and data centre markets. Competitors including Analogue Devices and ON Semiconductor have already implemented similar pricing strategies in 2026.

Shenzhen Mingjiada Electronics Co., Ltd.
Sep 11th, 2026
TI TMS320F28375 dual-core Delfino(TM) real-time control MCU - Mingjiada Electronics in stock.

TI TMS320F28375 dual-core Delfino(TM) real-time control MCU - Mingjiada Electronics in stock. Shenzhen Mingjiada Electronics Co., Ltd. long-term stock supplier of TI TMS320F28375 high-performance dual-core Delfino(TM) real-time control MCU Against the backdrop of continuous upgrades in high-performance real-time control applications such as industrial motor drives, photovoltaic inverters, digital power supplies, and electric vehicle charging facilities, DSP/MCUs with powerful floating-point computing capabilities and rich control peripherals have become the core guarantee of the system's closed-loop performance. Texas Instruments (TI) has launched the TMS320F28375 series, a high-end member of the C2000(TM) platform Delfino(TM) family. It features a 200MHz dual-core C28x architecture, a programmable control law accelerator (CLA), a trigonometric function acceleration unit (TMU), and up to 1MB of ECC-protected flash memory It has become the preferred main control chip for real-time control systems in the fields of industrial automation and new energy vehicles. Shenzhen Mingjiada Electronics Co., Ltd. provides a long-term spot supply of the full range of brand-new original products TMS320F28375, offering enterprises one-stop procurement services with stable supply and fast delivery. I. High-performance real-time control flagship of the TMS320F28375 - C2000(TM) Delfino(TM) platform The TMS320F28375 is a 32-bit floating-point microcontroller unit in the TI C2000(TM) series for advanced closed-loop control applications. It is a core model in the two major product branches, F2837xS and F2837xD, and represents TI's technological accumulation in the field of real-time control DSP. In terms of core computing power, the TMS320F28375 is equipped with a 200MHz TMS320C28x 32-bit CPU, integrating IEEE 754 single-precision floating-point unit (FPU), trigonometric mathematics unit (TMU) and Viterbi/complex mathematics unit (VCU-II). TMU can quickly perform trigonometric operations commonly found in transform and torque loop calculations, while VCU-II can significantly reduce the time required for complex mathematical operations in coding applications. The device is also equipped with a programmable control law accelerator (CLA) - an independent 32-bit floating-point processor that runs at the same speed as the main CPU, can respond to external triggers and execute code simultaneously with the main C28x CPU, effectively doubling the computing performance of the real-time control system. The dual-core version TMS320F28375D is equipped with two C28x CPUs and two CLAs, providing computing power of up to 800 MIPS. In terms of storage configuration, the device integrates 512KB or 1MB of ECC-protected flash memory, and 132KB to 164KB of ECC/parity-protected SRAM (single-core version), while the dual-core version is equipped with 172KB or 204KB of RAM. It supports dual-zone security mechanisms developed by third parties and is equipped with a unique identification number, providing hardware-level protection for code protection and firmware security. In terms of system and communication peripherals, the device is equipped with two external memory interfaces (EMIFs) supporting ASRAM and SDRAM, a 6-channel direct memory access (DMA) controller, up to 169 independent programmable GPIO pins with input filtering functions, and an extended peripheral interrupt controller (ePIE). The communication interface includes USB 2.0 (MAC+PHY), a 12-pin universal parallel port (uPP), two CAN modules, three high-speed SPI ports (up to 50MHz), two McBSPs, four SCI/UARTs, and two I2C interfaces. In terms of analog subsystems, the device integrates up to four analog-to-digital converters (ADCs), each with 1.1 MSPS (system throughput up to 4.4 MSPS) in 16-bit mode, supporting differential input; and each with 3.5 MSPS (system throughput up to 14 MSPS) in 12-bit mode, supporting single-ended input. Each ADC is equipped with a sample-and-hold circuit that supports hardware-integrated post-processing functions, including saturation offset calibration and setpoint calculation error processing. In addition, it integrates three 12-bit buffered DAC outputs and eight window comparators with 12-bit DAC references. In terms of enhanced control peripherals, the device provides 24 pulse width modulation (PWM) channels, 16 high resolution PWM (HRPWM) channels, six enhanced capture (eCAP) modules, three enhanced quadrature encoder pulse (eQEP) modules, and eight Sigma-Delta filter module (SDFM) input channels. Configurable Logic Blocks (CLBs) further enhance existing peripheral capabilities and support location manager solutions. In terms of functional safety, TMS320F28375 is specifically developed for functional safety applications and can provide document-assisted ISO 26262 system design (up to ASIL D), IEC 61508 (up to SIL 3), IEC 60730 (up to Class C), and UL 1998 (up to Class 2). In terms of packaging, TMS320F28375 offers a variety of packaging options, including 176-pin HLQFP (24x24mm), 337-pin NFBGA (16x16mm), and 100-pin HTQFP (14x14mm), with an operating temperature range of -40°C to 105°C (up to 125°C in some models). II. Typical Application Scenarios of TMS320F28375 The TMS320F28375 is widely used in the following high-growth areas due to its powerful floating-point computing capabilities, rich high-precision control peripherals and functional security support: Industrial drive and servo control: Dual-core + dual-CLA architecture can handle speed loop, position loop and current loop respectively to achieve high-precision motor vector control. Digital power supply: Suitable for three-phase inverters, UPS uninterruptible power supplies, server power supplies, etc., HRPWM and high-precision ADC ensure efficient power conversion. Solar inverter: supports multi-channel MPPT (maximum power point tracking) algorithm to improve the power generation efficiency of photovoltaic systems. Electric vehicles and charging facilities: control cores for on-board chargers (OBCs) and DC fast charging piles, meeting high reliability and functional safety requirements. Power Line Communication (PLC): Utilizes VCU accelerators to process complex communication protocols and demodulation algorithms. 3. Why choose Mingjiada Electronic Procurement TMS320F28375? 1. Brand new, original, genuine product, quality guaranteed Mingjiada Electronics has been deeply engaged in the field of electronic component distribution and supply chain services for nearly 30 years. It was established in Shenzhen in 1996 and has established branches in Hong Kong, Japan, Russia, Taiwan and other places. The TMS320F28375 series supplied by the company are all original TI products, brand new and unopened. They are in good condition and have clear silk printing to ensure product quality and traceability. 2. Stable spot inventory and fast delivery Mingjiada has the TMS320F28375 series in stock all year round, which can meet the diversified needs of enterprises for small-batch R&D and trial production as well as large-batch mass production. Relying on its global supply chain network and intelligent warehousing system, Mingjiada can provide efficient and fast logistics and distribution services to help customers quickly advance their projects. 3. Full model coverage, one-stop ordering Minceda can provide stable supply of all models of the TMS320F28375 series, covering a variety of packaging options such as 176-pin HLQFP, 337-pin NFBGA, 100-pin HTQFP, as well as different configurations of single-core (F28375S) and dual-core (F28375D). At the same time, Mingjiada provides one-stop ordering services to customers around the world, which can simultaneously meet customers' supporting procurement needs for various components such as MCUs, power management, memory, connectors, etc. In addition to TMS320F28375, Minceda also supplies the full range of TI C2000(TM) products for a long time, including: Delfino(TM) series: TMS320F2833x, TMS320F2837x (including the full F28375 series), TMS320F2838x, TMS320F28P65x, TMS320F28P55x, etc Piccolo(TM) series: TMS320F2802x, TMS320F2803x, TMS320F2805x, TMS320F2806x, TMS320F2807x, etc Concerto(TM) series: F28M35x, F28M36x (dual-core Arm+C28x) Other mainstream C2000 series models: F2837x, F2800x, etc At the same time, Minceda also supplies Arm(R)-based microcontrollers (SimpleLink(TM), Hercules(TM), Sitara(TM) AM2x, etc.), MSP430/MSPM0 series ultra-low power MCUs, and TI's full range of power management, analog devices, sensors and other products. To obtain a purchase quote for the TI TMS320F28375 high-performance dual-core Delfino(TM) real-time control MCU -, please visit Mingjiada Electronics' official website www.hkmjd.com News recommendation.

Voce
Sep 9th, 2026
Denison TX real estate forecast: Q4 2026 outlook.

Denison TX real estate forecast: Q4 2026 outlook. September 9, 2026 Denison, Texas is entering Q4 2026 as something it has never been before: a primary housing destination, not a budget footnote to Dallas. The $60 billion semiconductor buildout in neighboring Sherman - headlined by Texas Instruments' four-chip-fab complex - is pulling engineers, technicians, and the suppliers who serve them straight up Highway 75, while a revived downtown and a $6 billion resort project are making Denison itself the draw rather than the consolation prize. For most of the past two decades, Denison was the affordable edge of the Dallas-Fort Worth metro, a place buyers settled for when McKinney and Frisco priced them out. That calculus has started to shift. Zillow places Denison's average home value at $225,218, down 6.8% over the past year, with homes going to pending in around 60 days (Zillow[[1]]). On the surface that reads as a softening market. The deeper story is a correction from a 2021-2023 spike converging with an employment wave that has not yet finished arriving. How Sherman's chip boom is redrawing Denison's demand map. Grayson County's housing demand is no longer driven by spillover from Dallas - it is driven by one of the largest industrial expansions in Texas history, sitting minutes away in Sherman. Texas Instruments is building four 300-megawatt semiconductor fabrication facilities with a combined price tag north of $30 billion, each producing millions of chips daily and creating 3,000 direct jobs; GlobalWafers is adding a $5 billion silicon-wafer plant with 1,500 jobs, and II-VI a $3 billion laser-components operation (Cooper Land Company[[2]]). For every direct semiconductor role, local brokers estimate the region generates 2.5 to 3 indirect jobs - teachers, healthcare staff, contractors, retail managers. That math points to 10,000 to 15,000 new households needing a place to land in Grayson County within five years, and much of the developable land sits between Gunter and Denison (Cooper Land Company[[2]]). Sherman's own stock can't absorb that population, so Denison becomes the pressure-release valve. The result is visible in the land market: raw acreage along Highway 75 and FM 1417 that traded at $8,000 to $12,000 per acre in 2024 now commands $18,000 to $25,000 per acre, and developers are assembling 3,000- to 4,000-acre master-planned sites (Cooper Land Company[[2]]). Mike Harrison @mikeharrison Local Professional Want to connect with Mike? Ask, follow, or jump into the discussion on this article.