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HyperLight

Photonic integrated circuits for data centers

OSAT Management Engineer

Manufacturing EngineeringConfirmed live in the last 24 hours
Full-timeHsinchu, Hsinchu City, TaiwanNo salary listedIn-person

About the Job

Requirements

  • A bachelor's or master's degree in Electrical Engineering, Electronics Engineering, Materials Science, Photonics, or a related technical discipline.
  • At least 5 years of experience in semiconductor test, product engineering, or manufacturing operations, with direct engagement with foundries and OSAT partners.
  • Deep expertise in semiconductor backend (post-fab) manufacturing, with hands-on understanding of wafer-level dicing, bumping, and assembly.
  • Experience with wafer sort/probe (wafer test).
  • Knowledge of wafer-level dicing/singulation, including street layout awareness, saw/laser process fundamentals, tape/film selection, kerf/edge quality control, and dicing-to-pick handling.
  • Knowledge of wafer bumping, including process flow (UBM/metallization, plating, reflow), bump metrology, reliability risks, and supplier control plans.
  • Knowledge of die/chiplet assembly and packaging, including die attach, pick-and-place/flip-chip, underfill/encapsulation, substrate/interposer considerations, and in-process quality checks through final test readiness.
  • A proven track record managing OSAT operations end-to-end, including production scheduling, execution, yield tracking, and vendor performance management.
  • Strong experience in yield engineering and data-driven problem solving, with ability to lead root cause analysis and drive corrective actions to closure across external partners.
  • Advanced analytical skills and strong proficiency in Python for data analysis, automation, and yield modelling.
  • Experience with LabVIEW for test automation, instrumentation control, and data acquisition in production or R&D environments.
  • Understanding of cost-of-test drivers and test optimization, with demonstrated impact on test time reduction and production efficiency.
  • Experience leading cross-functional initiatives across test engineering, process, operations, and external vendors, and ability to influence without direct authority.
  • Experience communicating and managing stakeholders, including presenting data, issues, and recommendations to technical and executive audiences.
  • Ability to work independently and take ownership in a fast-paced, high-ambiguity environment.

Responsibilities

  • Serve as the primary on-site interface between HyperLight and external manufacturing partners, including foundry test teams and test OSAT vendors, to ensure seamless production execution.
  • Work with external manufacturing partners and equipment vendors to debug test-related hardware and software issues, minimizing production downtime and disruption.
  • Own and drive wafer-level backend execution across foundry and OSAT partners, including wafer-level dicing/singulation, bumping, and assembly, covering prioritization, scheduling, vendor readiness, and day-to-day execution to meet production timelines and delivery commitments.
  • Ensure the integrity, accuracy, and organization of data received from foundries and OSATs to support analysis and decision-making.
  • Collaborate with test engineering, process engineering, operations, and quality teams to troubleshoot backend process yield and test-related issues.
  • Coordinate with internal stakeholders and external partners to identify root causes and resolve yield excursions and test anomalies in a timely manner.
  • Oversee corrective actions at foundry test and OSAT sites and monitor solution effectiveness through yield and test metric tracking.
  • Drive continuous improvement initiatives for production workflows, focusing on efficiency, quality, and cycle time reduction.
  • Partner with operations teams to optimize wafer flow from foundry to OSAT, ensuring smooth logistics and minimal delays.
  • Work with test engineering teams to reduce production test time while maintaining test coverage and product quality.
  • Develop and maintain clear communication and reporting on production status, issues, and improvement initiatives with internal and external stakeholders.

Desired Qualifications

  • Hands-on expertise in optical testing, including characterization, validation, and troubleshooting of photonic or optical devices.

About the Company

HyperLight

Photonic integrated circuits for data centers

HyperLight designs and manufactures photonic integrated circuits (PICs) using a thin film lithium niobate on insulator (TFLN) platform for data centers and telecommunications networks. Its PICs, such as electro-optic modulators, deliver high bandwidth (over 110 GHz) with low drive voltage, low insertion loss, and strong optical power handling. The company differentiates itself through its TFLN platform, focus on low power and high-bandwidth performance, and the ability to customize PICs for specific applications at high volume. Its goal is to enable faster, more reliable data and telecom networks by providing efficient, scalable photonic solutions.

Company size
51-200
Company stage
Series C
Total funding
$117M
Headquarters
Cambridge, MA
Founded
2018

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