OSAT Management Engineer
HyperLight
OSAT Management Engineer
HyperLight
Photonic integrated circuits for data centers
HyperLight · Hsinchu, Taiwan · Full-time · Posted 2026-10-29
Workplace: on_site
Department: Fab Ops
HyperLight is at the forefront of the commercialization of thin-film lithium niobate (TFLN) integrated photonics - a material and process technology that is enabling high-performance, scalable optical components across AI/datacom infrastructure, hyperscale computing, quantum computing, sensing, and beyond. Founded in 2018 and backed by leading venture capital, we’ve built a team and a platform focused on real-world mass deployment of TFLN photonics technology.
At the core of our work is the TFLN Chiplet™ platform — a modular, integrated architecture designed for scalability, manufacturability, and seamless integration into complex systems. It offers a rare combination of extraordinary performance and industrial readiness, enabling system developers across applications to deploy the technology fast and ready. We partner with our customers and suppliers from conceptualization, design, and prototyping phases, all the way through mass production to ensure smooth and rapid deployment of TFLN photonic technology.
We believe our platform is the key, in the golden age of integrated photonics, to empower humanity to the next level. We assembled a world class team covering engineering, business, and operations. We believe in the power of integrity, innovation, collaboration, and pragmatic solutions. Our diverse team thrives on challenges and is united by a shared commitment to excellence. We take pride in tackling complex challenges with curiosity, humility, and a deep sense of care for one another.
Our growing team is looking for a OSAT Management Engineer to manage our backend operation at our manufacturing partner sites. The candidate will be working closely with our manufacturing partners to scale up and maintain robust and scalable backend operations across different platforms and manufacturing partners
As part of your responsibilities, you will be:
Deep expertise in semiconductor backend (post-fab) manufacturing—with strong, hands-on understanding of wafer-level dicing, bumping, and assembly—including:
Wafer sort / probe (wafer test)
Wafer-level dicing/singulation: street layout awareness, saw/laser process fundamentals, tape/film selection, kerf/edge quality control, and dicing-to-pick handling.
Die/chiplet assembly and packaging: die attach, pick-and-place/flip-chip, underfill/encapsulation, substrate/interposer considerations, and in-process quality checks through final test readiness.
Proven track record managing OSAT operations end-to-end, including production scheduling, execution, yield tracking, and vendor performance management.
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Photonic integrated circuits for data centers
HyperLight designs and manufactures photonic integrated circuits (PICs) using a thin film lithium niobate on insulator (TFLN) platform for data centers and telecommunications networks. Its PICs, such as electro-optic modulators, deliver high bandwidth (over 110 GHz) with low drive voltage, low insertion loss, and strong optical power handling. The company differentiates itself through its TFLN platform, focus on low power and high-bandwidth performance, and the ability to customize PICs for specific applications at high volume. Its goal is to enable faster, more reliable data and telecom networks by providing efficient, scalable photonic solutions.
Explore more opportunities at HyperLight