Assembly Process Engineer

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Job Description:

Assembly Process Engineer is responsible for developing, setting up, optimizing, and sustaining Flip Chip BGA assembly processes, with primary focus on Heat Spreader Attachment and Ball Attachment processes. The role includes machine setup, process setup, process evaluation, yield improvement, defect reduction, and supporting high-volume manufacturing operations. The engineer will work closely with production, quality, equipment, and product engineering teams to ensure stable and reliable assembly performance.

Requirements/Qualifications:

Requirements

• Bachelor’s Degree in any Engineering related field
• Minimum 2–5 years of semiconductor assembly process engineering experience.
• Experience in Flip Chip BGA package assembly processes.
• Knowledge of semiconductor assembly materials and process interactions.
• Experience with DOE, SPC, PFMEA, 8D, and root cause analysis methodologies.
• Ability to interpret engineering drawings, process specifications, and technical documentation.
• Familiarity with assembly equipment used in: DispensingPlacementReflowBall mountingInspection systems
• Good troubleshooting and analytical skills.
• Strong communication and cross-functional collaboration skills.

Travel Time:

0% - 25%

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