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NXP Semiconductors

Automotive semiconductors and secure embedded solutions

ATMC Cu Plate Equipment Technician

Equipment MaintenanceConfirmed live in the last 24 hours
Full-timeAustin, TX, USANo salary listedIn-person

About the Job

Requirements

  • Experience or knowledge with at least one of the following equipment tool types: Semitool Millennium Platers; DNS/SCREEN Scrubbers 80B and EX tools; Novellus Sabre Platers; LAM Da Vinci; or TEL Antares.
  • An Associate's Degree plus two years of industry experience in a semiconductor fabrication facility, or equivalent semiconductor fabrication experience as an Equipment Technician.

Responsibilities

  • Identify and manage all parts, assemblies, and calibration instruments required for preventive maintenance activities, primarily for Novellus Sabre Plate tools, LAM Da Vinci tools, DNS/SCREEN scrubbers, and other critical equipment.
  • Optimize preventive maintenance activities and preventive maintenance kitting, and ensure work standard procedures are well written and updated based on feedback from technicians and tool owners.
  • Monitor, maintain, and repair semiconductor wafer fabrication equipment to ensure uninterrupted production flow.
  • Provide technical support through troubleshooting, diagnostics, adjustments, repairs, modifications, assembly, and equipment calibration according to specifications, blueprints, manuals, or written instructions.
  • Perform routine electrical and mechanical troubleshooting for common-area faults and issues.
  • Use structured troubleshooting skills to diagnose root causes and implement appropriate permanent fixes.
  • Maintain accurate logs of work performed, modifications, calibrations, and adjustments.
  • Maintain area 5S and equipment-efficiency requirements.
  • Work with supervision to determine tool priorities and estimated times of arrival for returning down equipment to production.

About the Company

NXP Semiconductors

Automotive semiconductors and secure embedded solutions

NXP Semiconductors designs and sells semiconductor chips for vehicles and other devices. Its products include automotive-grade microcontrollers and other ICs used in engines, infotainment, safety systems, and networked car architectures. These chips process data, run software, and enable features such as advanced driver assistance and vehicle connectivity, often with strong security and real-time performance. Unlike some peers, NXP became an independent company after Philips spun off its semiconductor unit in 2006 and later merged with Freescale in 2015, building a focused strength in automotive semiconductors and microcontrollers. This gives it a clear niche in the market and the goal of growing as a standalone leader in smarter, connected vehicles and related technologies.

Company size
10,001+
Company stage
IPO
Headquarters
Eindhoven, Netherlands
Founded
2004

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