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Cadence Design Systems

Develops EDA software, IP, verification tools

Product Engineering Architect - High-Speed IP PHY

Hardware Systems IntegrationConfirmed live in the last 24 hours
Full-timeGyeonggi-do, South KoreaNo salary listedIn-person

About the Job

Requirements

  • Strong experience with high-speed interface intellectual property.
  • Deep understanding of register-transfer-level design, gate-level verification, and simulation methodologies.
  • Experience with synthesis, static timing analysis, and timing closure; backend knowledge is a plus.
  • Familiarity with design-for-test methodologies, test flows, and system validation approaches.
  • Bachelor’s degree in Electrical Engineering, Computer Engineering, or a related field with 15+ years of relevant experience; master’s degree with 12+ years; or PhD with 10+ years.
  • Ability to solve complex technical problems and drive root cause to closure.
  • Experience leading cross-functional technical efforts across design, validation, and customer teams.
  • Ability to influence customer and internal stakeholders through communication.
  • Experience managing multiple priorities, escalations, and technical reviews.
  • Ability to represent the organization in customer-facing technical roles.
  • Ownership mindset and ability to drive deliverables independently.
  • Ability to communicate and coordinate with direct reports in the local team and supervising management within a larger organization.

Responsibilities

  • Act as the primary product engineering owner for high-speed interface intellectual property, including PCIe, UCIe, Ethernet, USB, DDR, LPDDR, GDDR, and HBM, at the customer level.
  • Lead customer engagements, technical discussions, design reviews, and deployment strategy.
  • Own and drive resolution of complex subsystem integration and implementation issues.
  • Lead system-on-chip integration reviews covering PHY and controller subsystems.
  • Provide technical leadership for register-transfer-level design, gate-level simulations, and timing closure strategies.
  • Define and drive improvements to integration methodologies, checklists, and customer collateral.
  • Lead post-silicon bring-up and debug activities to ensure successful customer deployment.
  • Collaborate with R&D, validation, and applications teams to deliver product readiness.
  • Drive continuous improvement in customer experience, turnaround time, and engineering quality.
  • Mentor and lead team members and provide technical guidance across projects.
  • Work with global product engineering management to define, develop, and consistently execute customer support procedures.
  • Leverage artificial intelligence tools to improve debug efficiency, data analysis, and decision-making.
  • Manage and coordinate local team resources and maintain status and prioritization information for ongoing customer support activities.

Desired Qualifications

  • Experience with memory and/or high-speed communication interfaces, including DDR, LPDDR, PCIe, Ethernet, UCIe, and USB.
  • Understanding of analog and mixed-signal design practices.
  • Experience in customer-facing silicon debug and bring-up environments.
  • Familiarity with artificial-intelligence-assisted workflows and data-driven debug techniques.
  • Backend knowledge.

About the Company

Cadence Design Systems

Develops EDA software, IP, verification tools

Cadence Design Systems supplies software, hardware, and IP for electronic design automation (EDA) to help customers create advanced semiconductor chips and electronic systems. Its tools handle system design, verification, digital and analog IC design, and custom flows, while IP such as Tensilica processors and DSP cores can be licensed for integration into customer products. The offerings are delivered as software licenses with maintenance and support, plus IP licensing and occasional hardware-accelerated options. The company differentiates itself with a broad, end-to-end EDA portfolio and close collaboration with industry leaders to streamline the path from concept to silicon, aiming to help customers bring sophisticated silicon and electronics to market faster with lower risk and higher productivity.

Company size
10,001+
Company stage
IPO
Headquarters
San Jose, CA
Founded
1988

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