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Eliyan

D2D/C2C interconnect IP licensing

Principal Systems/DSP Engineer

Electrical EngineeringConfirmed live in the last 24 hours
Full-timeSan Francisco Bay Area, CA, USANo salary listed

About the Job

Requirements

  • A Master's or Ph.D. in Electrical Engineering, Computer Engineering, or a related field.
  • At least 10 years of experience in DSP system architecture and algorithm development for high-speed serial communication systems, including hands-on work at 112G PAM4 or higher data rates.
  • Deep expertise in digital communication and signal processing theory, including PAM4 modulation, equalization architectures, clock and data recovery loop dynamics, and statistical channel modeling.
  • Expert-level proficiency in system modeling using MATLAB, Simulink, C, and/or Python, with the ability to build production-quality behavioral models.
  • Strong working knowledge of high-speed serial protocols and standards including Ethernet, IEEE 802.3ck/df/dj, PCIe, UCIe, and OIF CEI specifications.
  • Solid understanding of mixed-signal circuit design concepts, including DAC/ADC architectures, PLL phase noise, and analog front-end linearity, and their impact on DSP algorithm performance and link budgets.
  • The ability to collaborate across analog, digital, and verification teams to translate algorithmic intent into silicon-ready implementations.
  • Hands-on experience with 112G/224G SerDes products, with proven tapeout or silicon characterization results.
  • Detailed knowledge of OIF CEI-224G and IEEE 802.3dj standards, including link budget allocation, compliance test methodologies, and FEC performance metrics.

Responsibilities

  • Define and architect low-power DSP architectures for 224G PAM4 and 448G SerDes designs, driving trade-offs among power, performance, and area.
  • Develop and maintain behavioral models of mixed-signal transceiver circuits using MATLAB, Simulink, C, and/or Python for system-level performance prediction and design specification.
  • Develop, evaluate, and optimize equalization algorithms including FFE, DFE, CTLE, and MLSE/MLSD for 224G/448G channel loss and impairment compensation.
  • Derive and specify analog front-end, DAC/ADC, and PLL performance targets from system-level BER and link budget analyses.
  • Design and optimize adaptive DSP algorithms for channel compensation, including adaptation convergence strategies, calibration sequencing, and robustness across PVT corners.
  • Architect and evaluate clock and data recovery algorithms and loop dynamics, including jitter tolerance analysis, bang-bang and linear CDR trade-offs, and frequency acquisition strategies.
  • Perform system-level simulations and trade-off analyses balancing digital and analog power consumption, performance, and BER requirements.
  • Collaborate with analog, digital RTL, and physical design teams to ensure algorithm-to-implementation fidelity and power-efficient silicon realization.
  • Develop and evaluate FEC solutions including inner/outer FEC architectures, RS-FEC KP4/KP8 integration, and concatenated coding schemes per IEEE 802.3dj and OIF CEI-224G standards.
  • Drive silicon bring-up and characterization test plans, correlating pre-silicon system models with post-silicon measurements to validate DSP performance.
  • Define lab validation methodologies and work with characterization teams on silicon debug, performance benchmarking, and standards-compliance testing.
  • Provide technical leadership to customers and partners on system-level link performance, interoperability, and algorithmic optimization.

Desired Qualifications

  • Experience with chiplet die-to-die interconnects, optical/electrical interfaces such as VCSEL and EML, or DRAM/HBM PHY systems.

About the Company

Eliyan

D2D/C2C interconnect IP licensing

Eliyan provides high-performance interconnect IP and chiplets for chiplet-based systems, including NuLink PHY for die-to-die and chip-to-chip connections and NuGear memory/I O chips, plus a Universal Memory Interface. Its NuLink uses simultaneous bidirectional signaling on a single wire to achieve high bandwidth while staying compatible with standards like UCIe and BoW and using standard organic substrates. The company licenses its IP to chip makers rather than selling completed hardware, focusing on reducing cost, simplifying supply chains, and boosting system-level performance for data centers, AI accelerators, and HPC workloads. Eliyan aims to enable scalable, flexible multi-die designs that can connect to different memory types (HBM, GDDR, DDR) across future process nodes.

Company size
51-200
Company stage
Series C
Total funding
$295M
Headquarters
Santa Clara, CA
Founded
2021

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