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Marvell

High-performance semiconductor solutions for data infrastructure

Advanced Package Design Senior Staff Engineer

Board & Electronics DesignConfirmed live in the last 24 hours
Full-timeSanta Clara, CA, USAIn-person

About the Job

Requirements

  • At least a Bachelor's degree in Computer Science, Electrical Engineering, or a related field and 7+ years of related professional experience, or a Master's degree and/or PhD in Computer Science, Electrical Engineering, or related fields with 5+ years of experience.
  • Experience with high-speed electronic packaging for digital and analog integrated circuits, package floor planning, netlist, schematic, and BGA map development.
  • Experience with 2.5D/3D package development.
  • Knowledge of packaging technologies, materials, package substrate design rules, and assembly rules.
  • Ability to manage package design and development involving cross-functional teams such as integrated circuit physical layout teams, analog and digital designers, signal integrity/power integrity teams, thermal-mechanical teams, assembly development, and marketing.
  • Basic proficiency with integrated circuit package floor-planning tools such as Integrated System Planner (ISP) and layout tools such as APD.
  • Strong fundamentals in electromagnetics, transmission lines, and microwave theory, and experience using 2-D and 3-D electromagnetic simulation tools such as Ansys HFSS, SI-Wave, and Cadence Clarity.
  • Ability to automate signal integrity, power integrity, and packaging activities using scripting tools such as Python.
  • Strong communication, presentation, and documentation skills.

Responsibilities

  • Develop advanced microelectronic packaging solutions for next-generation semiconductor products supporting 448 Gb/s data rates and beyond.
  • Lead package development and electrical design activities, including floorplanning, netlist creation, and BGA map definition.
  • Optimize signal integrity, power integrity, performance, manufacturability, reliability, and cost.
  • Work with package operations teams to evaluate package technologies, drive layout implementation, and ensure designs meet product and manufacturing requirements.
  • Partner with marketing, system architects, and integrated circuit design teams to define package requirements, develop achievable specifications, and advance next-generation packaging technologies.

Desired Qualifications

  • Experience with CPC/CPO connectors.
  • Experience with power plane design, modeling, and analysis using tools such as PowerSI and SIwave.
  • Track record of new product introduction from concept through development and production.

About the Company

Marvell

High-performance semiconductor solutions for data infrastructure

Marvell Technology, Inc. creates high-performance semiconductor products that power data infrastructure for telecommunications operators, data centers, and enterprises. Its offerings span computing, storage, and networking to enable efficient, secure data transmission, storage, and processing. The products are programmable and scalable platforms designed for high bandwidth and strong security, supporting 5G networks and the broader digital economy. Revenue comes from designing, manufacturing, licensing, and providing related services to other businesses that integrate these components into their own products. Unlike many peers, Marvell emphasizes programmable, scalable platforms tailored to data infrastructure needs and long-term partnerships with enterprise and telecom customers. The company aims to help customers upgrade their networks and data systems to increase capacity, performance, and efficiency while expanding its own business in the data infrastructure space.

Company size
10,001+
Company stage
IPO
Headquarters
Santa Clara, CA
Founded
1995

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